Molex, LLC 製品 - IC用ソケット、トランジスタ

0475960232

Molex, LLC

CONN SOCKET LGA 1155POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1155 (40 x 40)
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.036" (0.91mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫3,726

1155 (40 x 40)

0.036" (0.91mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.036" (0.91mm)

-

Thermoplastic

-

0475960132

Molex, LLC

CONN SOCKET LGA 1156POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1156 (40 x 40)
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.036" (0.91mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫6,408

1156 (40 x 40)

0.036" (0.91mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.036" (0.91mm)

-

Thermoplastic

-

0475943001

Molex, LLC

CONN SOCKET LGA 1356POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1356 (32 x 41)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: -
Mounting Type: Surface Mount
Features: Open Frame
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫4,662

1356 (32 x 41)

0.040" (1.01mm)

Gold

15µin (0.38µm)

-

Surface Mount

Open Frame

-

0475940002

Molex, LLC

CONN SOCKET LGA 1366POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1366 (32 x 41)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫7,038

1366 (32 x 41)

0.040" (1.01mm)

Gold

30µin (0.76µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

-

Liquid Crystal Polymer (LCP)

-

0475940001

Molex, LLC

CONN SOCKET LGA 1366POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1366 (32 x 41)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫6,444

1366 (32 x 41)

0.040" (1.01mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

-

Liquid Crystal Polymer (LCP)

-

0475939000

Molex, LLC

CONN SOCKET LGA 1366POS NICKEL

Type: LGA
Number of Positions or Pins (Grid): 1366 (32 x 41)
Pitch - Mating: -
Contact Finish - Mating: Nickel
Contact Finish Thickness - Mating: 3µin (0.08µm)
Contact Material - Mating: -
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Nickel
Contact Finish Thickness - Post: 3µin (0.08µm)
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫2,718

1366 (32 x 41)

-

Nickel

3µin (0.08µm)

-

Surface Mount

Closed Frame

Solder

-

Nickel

3µin (0.08µm)

-

0479890242

Molex, LLC

CONN SOCKET PGA 988POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 988 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫5,130

988 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890232

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫8,550

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890222

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫8,586

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890212

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫6,858

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890142

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫8,406

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890132

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫6,606

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890122

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫6,012

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0479890112

Molex, LLC

CONN SOCKET PGA 989POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫2,502

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

0009483031

Molex, LLC

CONN SOCKET TRANSIST TO-220 3POS

Type: Transistor, TO-220
Number of Positions or Pins (Grid): 3 (Rectangular)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA66), Nylon 6/6
Operating Temperature: -40°C ~ 80°C

パッケージ: -

在庫2,304

3 (Rectangular)

-

Tin

100µin (2.54µm)

Brass

Through Hole

Closed Frame

Solder

-

Tin

100µin (2.54µm)

Brass

Polyamide (PA66), Nylon 6/6

-40°C ~ 80°C

1051420433

Molex, LLC

LGA2011-3 SOCKET FULL ASSY 30U'

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫5,976

-

1051420133

Molex, LLC

CONN SOCKET LGA 2011POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫3,924

2011 (47 x 58)

0.040" (1.01mm)

Gold

30µin (0.76µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

-

Thermoplastic

-

1051420432

Molex, LLC

LGA2011-3 SOCKET FULL ASSY 15U'

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫3,762

-

1051420132

Molex, LLC

CONN SOCKET LGA 2011POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫6,030

2011 (47 x 58)

0.040" (1.01mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

-

Thermoplastic

-

1050282031

Molex, LLC

CONN CAMERA SOCKET 32POS GOLD

Type: Camera Socket
Number of Positions or Pins (Grid): 32 (4 x 8)
Pitch - Mating: 0.035" (0.90mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3µin (0.08µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Plastic
Operating Temperature: -

パッケージ: -

在庫5,364

32 (4 x 8)

0.035" (0.90mm)

Gold

3µin (0.08µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.035" (0.90mm)

Gold

Flash

Copper Alloy

Plastic

-

0784990002

Molex, LLC

CONN CAM SOCKET 24POS GOLD

Type: Camera Socket
Number of Positions or Pins (Grid): 24 (2 x 4, 2 x 8)
Pitch - Mating: 0.024" (0.60mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.024" (0.60mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Plastic
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫8,568

24 (2 x 4, 2 x 8)

0.024" (0.60mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.024" (0.60mm)

Gold

Flash

Copper Alloy

Plastic

-55°C ~ 85°C

0473370001

Molex, LLC

CONN CAM SOCKET 24POS GOLD

Type: Camera Socket
Number of Positions or Pins (Grid): 24 (4 x 6)
Pitch - Mating: 0.035" (0.90mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫7,200

24 (4 x 6)

0.035" (0.90mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.035" (0.90mm)

Gold

Flash

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 85°C

0787250002

Molex, LLC

SMIA85 CAMERA SOCKET T/BRD 18PIN

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫8,550

-

1051990001

Molex, LLC

CONN CAM SOCKET 34POS GOLD

Type: Camera Socket
Number of Positions or Pins (Grid): 34 (2 x 8, 2 x 9)
Pitch - Mating: 0.024" (0.60mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.024" (0.60mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Plastic
Operating Temperature: -30°C ~ 85°C

パッケージ: -

在庫5,652

34 (2 x 8, 2 x 9)

0.024" (0.60mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.024" (0.60mm)

-

Copper Alloy

Plastic

-30°C ~ 85°C

1052000008

Molex, LLC

SMIA55 CAMERA SOCKET BOTTOM CONT

Type: Camera Socket
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.028" (0.70mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount, Through Board
Features: Open Frame
Termination: Solder
Pitch - Post: 0.028" (0.70mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫8,406

12 (2 x 6)

0.028" (0.70mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount, Through Board

Open Frame

Solder

0.028" (0.70mm)

Gold

Flash

Copper Alloy

Thermoplastic

-55°C ~ 85°C

1052000001

Molex, LLC

SMIA55 CAMERA SOCKET BOTTOM CONT

Type: Camera Socket
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.028" (0.70mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount, Through Board
Features: Open Frame
Termination: Solder
Pitch - Post: 0.028" (0.70mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫3,438

12 (2 x 6)

0.028" (0.70mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount, Through Board

Open Frame

Solder

0.028" (0.70mm)

Gold

Flash

Copper Alloy

Thermoplastic

-55°C ~ 85°C

1051900001

Molex, LLC

TOP-MOUNT CAMERA SOCKET FOR SMIA

Type: Camera Socket
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.033" (0.85mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Phosphor Bronze Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.033" (0.85mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Phosphor Bronze Alloy
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫8,154

12 (2 x 6)

0.033" (0.85mm)

Gold

12µin (0.30µm)

Phosphor Bronze Alloy

Surface Mount

Open Frame

Solder

0.033" (0.85mm)

Gold

Flash

Phosphor Bronze Alloy

Thermoplastic

-55°C ~ 85°C

1051670001

Molex, LLC

SMIA65 TOP MNT CAMERA SOCKET

Type: Camera Socket
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫5,364

12 (2 x 6)

0.037" (0.95mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount

Open Frame

Solder

-

Gold

Flash

Copper Alloy

Thermoplastic

-55°C ~ 85°C

1051631001

Molex, LLC

SMIA65 CAMERA SOCKET CONTACT

Type: Camera Socket
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12µin (0.30µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount, Through Board
Features: Open Frame
Termination: Solder
Pitch - Post: 0.037" (0.95mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 85°C

パッケージ: -

在庫6,714

12 (2 x 6)

0.037" (0.95mm)

Gold

12µin (0.30µm)

Copper Alloy

Surface Mount, Through Board

Open Frame

Solder

0.037" (0.95mm)

Gold

Flash

Copper Alloy

Thermoplastic

-55°C ~ 85°C

1050281001

Molex, LLC

CONN CAM SOCKET 32POS GOLD

Type: Camera Socket
Number of Positions or Pins (Grid): 32 (4 x 8)
Pitch - Mating: 0.035" (0.90mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3µin (0.08µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Nickel
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫7,020

32 (4 x 8)

0.035" (0.90mm)

Gold

3µin (0.08µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.035" (0.90mm)

Nickel

50µin (1.27µm)

Copper Alloy

Thermoplastic

-