ページ 719 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BAP64-05W,115	NXP	DIODE PIN 100V 100MA SOT323 Diode Type: PIN - 1 Pair Common Cathode Voltage - Peak Reverse (Max): 100V Current - Max: 100mA Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz Resistance @ If, F: 1.35 Ohm @ 100mA, 100MHz Power Dissipation (Max): 240mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	パッケージ: SC-70, SOT-323	在庫36,000
MC34VR5100A1EP	NXP	IC REG 9OUT BUCK/LDO 48QFN Topology: Step-Down (Buck) (3), Linear (LDO) (6) Function: Communications Processors Number of Outputs: 9 Frequency - Switching: - Voltage/Current - Output 1: 1.8V/3.3V/0.7 V ~ 1.425 V, 3.8A Voltage/Current - Output 2: 1.5 V ~ 1.85 V/2.5 V ~ 3.3 V, 1.25A Voltage/Current - Output 3: 0.9 V ~ 1.65 V, 1.5A w/LED Driver: No w/Supervisor: No w/Sequencer: No Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫13,908
74LVT00D,118	NXP	IC GATE NAND 4CH 2-INP 14-SO Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Max): - Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫4,112
KMPC8313EVRAFFB	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	パッケージ: 516-BBGA Exposed Pad	在庫6,128
KMPC8360VVALFHA	NXP	IC MPU MPC83XX 667MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫5,648
KMPC8358EZUAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫3,664
B4420NSE7QQMD	NXP	BASEBAND PROC PILOT REV 1.0 Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5 Gbps (4) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33x33)	パッケージ: 1020-BBGA, FCBGA	在庫6,576
MCIMX6X4AVM08AB	NXP	IC MPU I.MX6SX 800MHZ 400MAPBGA Core Processor: ARM? Cortex?-A9, ARM? Cortex?-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14x14)	パッケージ: 400-LFBGA	在庫3,568
MCIMX27VOP4A	NXP	IC MPU I.MX27 400MHZ 404MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (3) Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Operating Temperature: -20°C ~ 85°C (TA) Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Package / Case: 404-LFBGA Supplier Device Package: -	パッケージ: 404-LFBGA	在庫46,944
S912ZVML12F2MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	パッケージ: 64-LQFP Exposed Pad	在庫3,520
MCF52234CVM60J	NXP	IC MCU 32BIT 256KB FLASH 121BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 60MHz Connectivity: CAN, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LBGA Supplier Device Package: 121-MAPBGA (12x12)	パッケージ: 121-LBGA	在庫7,008
LPC2460FET208,551	NXP	IC MCU 32BIT ROMLESS 208TFBGA Core Processor: ARM7? Core Size: 16/32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 160 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-TFBGA Supplier Device Package: 208-TFBGA (15x15)	パッケージ: 208-TFBGA	在庫4,336
MC9S08AW60MPUE	NXP	IC MCU 8BIT 60KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫8,196
PCF8563T/F4,112	NXP	IC RTC CLK/CALENDAR I2C 8-SOIC Type: Clock/Calendar Features: Alarm, Leap Year, Watchdog Timer Memory Size: - Time Format: HH:MM:SS (24 hr) Date Format: YY-MM-DD-dd Interface: I2C, 2-Wire Serial Voltage - Supply: 1.8 V ~ 5.5 V Voltage - Supply, Battery: - Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫5,376
MPC9230FA	NXP	IC PECL CLOCK LV 800MHZ 32-LQFP Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer PLL: Yes with Bypass Input: Crystal Output: LVPECL Number of Circuits: 1 Ratio - Input:Output: 1:1 Differential - Input:Output: No/Yes Frequency - Max: 750MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫6,960
MC100ES6226FA	NXP	IC CLK BUFFER 1:9 3GHZ 32LQFP Type: Fanout Buffer (Distribution), Divider Number of Circuits: 1 Ratio - Input:Output: 1:9 Differential - Input:Output: Yes/Yes Input: LVPECL Output: LVCMOS, LVPECL Frequency - Max: 3GHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 110°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫2,496
SL3S4021FHKH	NXP	IC U-CODE RF FE DUAL DIFF 8XQFN Type: RFID Transponder Frequency: 860MHz ~ 960MHz Standards: ISO 18000-6 Interface: I2C Voltage - Supply: 1.8 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-XFQFN Exposed Pad Supplier Device Package: 8-XQFN (1.6x1.6)	パッケージ: 8-XFQFN Exposed Pad	在庫5,652
MC13191FCR2	NXP	IC RF TXRX ISM>1GHZ 32-VFQFN Type: TxRx Only RF Family/Standard: General ISM > 1GHZ Protocol: - Modulation: DSSS, O-QPSK Frequency: 2.4GHz Data Rate (Max): 250kbps Power - Output: 4dBm Sensitivity: -92dBm Memory Size: - Serial Interfaces: SPI GPIO: 7 Voltage - Supply: 2 V ~ 3.4 V Current - Receiving: 37mA Current - Transmitting: 30mA Operating Temperature: -40°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad	パッケージ: 32-VFQFN Exposed Pad	在庫16,992
MMG2401NR2	NXP	IC RF POWER AMP WLAN 12-QFN Frequency: 2.4GHz ~ 2.5GHz P1dB: - Gain: 26.5dB Noise Figure: - RF Type: 802.11g Voltage - Supply: 3.3V Current - Supply: 210mA Test Frequency: - Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	パッケージ: 12-VFQFN Exposed Pad	在庫3,438
BGA7204,115	NXP	RF AMP 2.75GHZ VGA 32HVQFN Frequency: 400MHz ~ 2.75GHz P1dB: 20.5dBm Gain: 16.5dB ~ 18.5dB Noise Figure: 7dB RF Type: General Purpose Voltage - Supply: 4.75 V ~ 5.25 V Current - Supply: 115mA Test Frequency: 2.1GHz Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫6,444
TJF1052IT/2Y	NXP	DGTL ISOLATOR 2.5KV 2CH CAN 16SO Technology: Capacitive Coupling Type: CAN Isolated Power: No Number of Channels: 2 Inputs - Side 1/Side 2: 1/1 Channel Type: Unidirectional Voltage - Isolation: 2500Vrms Common Mode Transient Immunity (Min): 20kV/µs Data Rate: 2Mbps Propagation Delay tpLH / tpHL (Max): - Pulse Width Distortion (Max): - Rise / Fall Time (Typ): - Voltage - Supply: 3 V ~ 5.25 V Operating Temperature: -40°C ~ 105°C Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫2,070
MK28FN2M0ACAU15R	NXP	150MHZ ARM CORTEX-M4F Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Number of I/O: 120 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b Oscillator Type: Internal/External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,992
S912XDG128F2VAL	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫6,848
UJA1131HW/5V0/S90Y	NXP	IC SBCS CAN HIGH SPEED 48HTQFP Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,296
FS32K146HRT0MLQT	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 128 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: -	Request a Quote
FB32K146HFT0VLQT	NXP	S32K146, M4F, FLASH 1M, RAM 128K Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
S912ZVMAL1F0WLFR	NXP	VMA16, 16K FLASH, 1K RAM, 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V Data Converters: A/D 7x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote
FS32K144HFT0VLFR	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 89 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: -	Request a Quote

BAP64-05W,115

NXP

DIODE PIN 100V 100MA SOT323

Diode Type: PIN - 1 Pair Common Cathode
Voltage - Peak Reverse (Max): 100V
Current - Max: 100mA
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35 Ohm @ 100mA, 100MHz
Power Dissipation (Max): 240mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

在庫36,000

MC34VR5100A1EP

NXP

IC REG 9OUT BUCK/LDO 48QFN

Topology: Step-Down (Buck) (3), Linear (LDO) (6)
Function: Communications Processors
Number of Outputs: 9
Frequency - Switching: -
Voltage/Current - Output 1: 1.8V/3.3V/0.7 V ~ 1.425 V, 3.8A
Voltage/Current - Output 2: 1.5 V ~ 1.85 V/2.5 V ~ 3.3 V, 1.25A
Voltage/Current - Output 3: 0.9 V ~ 1.65 V, 1.5A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Voltage - Supply: 2.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫13,908

74LVT00D,118

NXP

IC GATE NAND 4CH 2-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Quiescent (Max): -
Current - Output High, Low: 20mA, 32mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫4,112

KMPC8313EVRAFFB

NXP

IC MPU MPC83XX 333MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

パッケージ: 516-BBGA Exposed Pad

在庫6,128

KMPC8360VVALFHA

NXP

IC MPU MPC83XX 667MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫5,648

KMPC8358EZUAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫3,664

B4420NSE7QQMD

NXP

BASEBAND PROC PILOT REV 1.0

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.6GHz
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1/2.5 Gbps (4)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Package / Case: 1020-BBGA, FCBGA
Supplier Device Package: 1020-FCPBGA (33x33)

パッケージ: 1020-BBGA, FCBGA

在庫6,576

MCIMX6X4AVM08AB

NXP

IC MPU I.MX6SX 800MHZ 400MAPBGA

Core Processor: ARM? Cortex?-A9, ARM? Cortex?-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 800MHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (14x14)

パッケージ: 400-LFBGA

在庫3,568

MCIMX27VOP4A

NXP

IC MPU I.MX27 400MHZ 404MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (3)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Operating Temperature: -20°C ~ 85°C (TA)
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Package / Case: 404-LFBGA
Supplier Device Package: -

パッケージ: 404-LFBGA

在庫46,944

S912ZVML12F2MKHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

パッケージ: 64-LQFP Exposed Pad

在庫3,520

MCF52234CVM60J

NXP

IC MCU 32BIT 256KB FLASH 121BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 60MHz
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LBGA
Supplier Device Package: 121-MAPBGA (12x12)

パッケージ: 121-LBGA

在庫7,008

LPC2460FET208,551

NXP

IC MCU 32BIT ROMLESS 208TFBGA

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 160
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 208-TFBGA
Supplier Device Package: 208-TFBGA (15x15)

パッケージ: 208-TFBGA

在庫4,336

MC9S08AW60MPUE

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫8,196

PCF8563T/F4,112

NXP

IC RTC CLK/CALENDAR I2C 8-SOIC

Type: Clock/Calendar
Features: Alarm, Leap Year, Watchdog Timer
Memory Size: -
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.8 V ~ 5.5 V
Voltage - Supply, Battery: -
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫5,376

MPC9230FA

NXP

IC PECL CLOCK LV 800MHZ 32-LQFP

Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer
PLL: Yes with Bypass
Input: Crystal
Output: LVPECL
Number of Circuits: 1
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Frequency - Max: 750MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫6,960

MC100ES6226FA

NXP

IC CLK BUFFER 1:9 3GHZ 32LQFP

Type: Fanout Buffer (Distribution), Divider
Number of Circuits: 1
Ratio - Input:Output: 1:9
Differential - Input:Output: Yes/Yes
Input: LVPECL
Output: LVCMOS, LVPECL
Frequency - Max: 3GHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: 0°C ~ 110°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫2,496

SL3S4021FHKH

NXP

IC U-CODE RF FE DUAL DIFF 8XQFN

Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Standards: ISO 18000-6
Interface: I2C
Voltage - Supply: 1.8 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-XFQFN Exposed Pad
Supplier Device Package: 8-XQFN (1.6x1.6)

パッケージ: 8-XFQFN Exposed Pad

在庫5,652

MC13191FCR2

NXP

IC RF TXRX ISM>1GHZ 32-VFQFN

Type: TxRx Only
RF Family/Standard: General ISM > 1GHZ
Protocol: -
Modulation: DSSS, O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 250kbps
Power - Output: 4dBm
Sensitivity: -92dBm
Memory Size: -
Serial Interfaces: SPI
GPIO: 7
Voltage - Supply: 2 V ~ 3.4 V
Current - Receiving: 37mA
Current - Transmitting: 30mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad

パッケージ: 32-VFQFN Exposed Pad

在庫16,992

MMG2401NR2

NXP

IC RF POWER AMP WLAN 12-QFN

Frequency: 2.4GHz ~ 2.5GHz
P1dB: -
Gain: 26.5dB
Noise Figure: -
RF Type: 802.11g
Voltage - Supply: 3.3V
Current - Supply: 210mA
Test Frequency: -
Package / Case: 12-VFQFN Exposed Pad
Supplier Device Package: 12-QFN (3x3)

パッケージ: 12-VFQFN Exposed Pad

在庫3,438

BGA7204,115

NXP

RF AMP 2.75GHZ VGA 32HVQFN

Frequency: 400MHz ~ 2.75GHz
P1dB: 20.5dBm
Gain: 16.5dB ~ 18.5dB
Noise Figure: 7dB
RF Type: General Purpose
Voltage - Supply: 4.75 V ~ 5.25 V
Current - Supply: 115mA
Test Frequency: 2.1GHz
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫6,444

TJF1052IT/2Y

NXP

DGTL ISOLATOR 2.5KV 2CH CAN 16SO

Technology: Capacitive Coupling
Type: CAN
Isolated Power: No
Number of Channels: 2
Inputs - Side 1/Side 2: 1/1
Channel Type: Unidirectional
Voltage - Isolation: 2500Vrms
Common Mode Transient Immunity (Min): 20kV/µs
Data Rate: 2Mbps
Propagation Delay tpLH / tpHL (Max): -
Pulse Width Distortion (Max): -
Rise / Fall Time (Typ): -
Voltage - Supply: 3 V ~ 5.25 V
Operating Temperature: -40°C ~ 105°C
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫2,070

MK28FN2M0ACAU15R

NXP

150MHZ ARM CORTEX-M4F

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 150MHz
Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Number of I/O: 120
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b
Oscillator Type: Internal/External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,992

S912XDG128F2VAL

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫6,848

UJA1131HW/5V0/S90Y

NXP

IC SBCS CAN HIGH SPEED 48HTQFP

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,296

FS32K146HRT0MLQT

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 128
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: -

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FB32K146HFT0VLQT

NXP

S32K146, M4F, FLASH 1M, RAM 128K

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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S912ZVMAL1F0WLFR

NXP

VMA16, 16K FLASH, 1K RAM, 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Data Converters: A/D 7x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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FS32K144HFT0VLFR

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

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