業界動向 | Heisener Electronics
連絡先
SalesDept@heisener.com +86-755-83210559-836
Language Translation

* Please refer to the English Version as our Official Version.

業界動向

最新の業界動向データが利用可能になりました

New Nanometer-Scale 3D Transistor Unveiled

投稿する 11月 7, 2024
A team from the Massachusetts Institute of Technology (MIT) has successfully developed a novel nanometer-scale 3D transistor using ultra-thin semiconductor materials. This transistor is the smallest 3D transistor known to date, with performance and functionality that can match or even exceed current silicon-based transistors. It is expected to open new pathways for the development of high-performance, energy-efficient electronic products. The related paper was published in the Nature Electronics journal on the 5th.

Breakthrough in Multi-Band Electromagnetic Wave Absorbing Ultra-Thin Film

投稿する 11月 7, 2024
Scientists at the Korea Institute of Materials Science have developed an ultra-thin composite film capable of absorbing over 99% of electromagnetic waves across various frequencies, including 5G, 6G, WiFi, and radar for autonomous vehicles, which could significantly enhance the reliability of wireless communication. The findings were published in Advanced Functional Materials.

SEMI: Global Silicon Wafer Shipments to Fall 2.4% in 2024, 9.5% Growth Expected in 2025

投稿する 10月 22, 2024
On October 22, the Semiconductor Industry Association (SEMI) released its 2024 silicon shipment forecast report in California. The report predicts that after a significant decline of 14.3% in 2023, global silicon wafer shipments will experience a smaller year-on-year drop of 2.4% in 2024.

STMicro STM32C0 Series: High-Efficiency MCUs with Performance Boost

投稿する 10月 18, 2024
Developers now have access to enhanced storage and advanced functionalities with the STM32C0 microcontroller (MCU), enabling more sophisticated capabilities in resource-constrained and cost-sensitive embedded applications.

STMicroelectronics Introduces Page EEPROM 2-in-1 Memory

投稿する 10月 16, 2024
STMicroelectronics has introduced its new Page EEPROM, which combines the energy efficiency and durability of EEPROM technology with the storage capacity and read/write speed of flash memory. This hybrid memory solution is ideal for applications that face extreme space and power constraints, providing embedded systems with storage options that meet rising demands for both capacity and performance.

X-FAB New Generation Photodiodes Significantly Improve Sensing Sensitivity

投稿する 10月 11, 2024
X-FAB Silicon Foundries (“X-FAB”), a globally recognized leader in analog/mixed-signal semiconductor foundries, today announced the release of four new high-performance photodiodes on its 180nm CMOS process platform, XS018, which is specially optimized for optical sensor applications. This addition expands the options available for photodetectors and strengthens X-FAB's already extensive product portfolio.

Bourns Introduces AEC-Q200 Compliant High Voltage Gas Discharge Tubes (GDTs)

投稿する 10月 8, 2024
Bourns, Inc., a globally recognized manufacturer of power, protection, and sensing solutions, has introduced the SA2-A Series high-voltage Gas Discharge Tube (GDT). As the latest addition to Bourns' extensive AEC-Q200 compliant product lineup, the SA2-A Series is specifically engineered to meet the stringent requirements of harsh environments, ensuring exceptional reliability, durability, and regulatory compliance.

Challenges Brought to Gate Driver Power Supplies by WBG Devices

投稿する 9月 27, 2024
The gate driver power supplies for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices must meet the unique biasing requirements of these wide-bandgap semiconductors. This article discusses the key factors to consider when designing gate driver power supplies for SiC and GaN applications.

STMicroelectronics Launches FIPS 140-3 Certified TPM Modules

投稿する 9月 27, 2024
STMicroelectronics has announced that its STSAFE-TPM Trusted Platform Module (TPM) has achieved FIPS 140-3 certification, making it one of the first standardized cryptographic modules on the market to receive this certification.

In-Depth Analysis of Modular Silicon Carbide (SiC) Device Evaluation

投稿する 9月 24, 2024
Silicon Carbide (SiC) is revolutionizing the power electronics field by delivering exceptional efficiency, increased power density, and improved thermal performance, especially in automotive applications such as main drives, onboard chargers, and battery charging stations.