Nexperia has introduced a series of high-performance gate driver ICs for driving high-side and low-side N-channel MOSFETs in synchronous buck or half-bridge configurations. These ICs, available in automotive-grade and industrial-grade versions, deliver high current output and dynamic performance to enhance efficiency and robustness.
The NGD4300-Q100, designed to meet automotive-grade standards, is ideal for applications like electric power steering and power converters. Meanwhile, the NGD4300 is suited for DC-DC converters in consumer electronics, servers, telecom equipment, and industrial microinverters.
These ICs support DC bus voltages up to 120 V and integrate a bootstrap power supply with a diode, reducing PCB size and simplifying system design. They deliver up to 4 A (peak) sourcing current and 5 A sinking current, ensuring rapid rise and fall times even under heavy loads.
With input-to-output delays as low as 13 ns and channel-to-channel mismatches of just 1 ns, these ICs improve switching duty cycles and reduce dead time. Featuring rise times of 4 ns and fall times of 3.5 ns, they enhance efficiency and support high-frequency, fast system control. Compatibility with TTL and CMOS logic levels adds further versatility.
Irene Deng, General Manager of Nexperia’s IC Solutions Business Group, stated:
"These devices are the first in our new portfolio of high-performance half-bridge gate driver products. This launch underscores Nexperia's commitment to leveraging process innovations to meet the growing demand for robust gate drivers. The new series not only enhances power converter efficiency across consumer, industrial, and automotive applications but also improves motor control stability."
The ICs are built using a silicon-on-insulator (SOI) process, which extends the HS pin’s negative voltage tolerance to -5 V, significantly reducing the risk of chip damage from system parasitics and unexpected voltage spikes. This ensures exceptional robustness in power conversion and motor drive applications. The NGD4300 and NGD4300-Q100 are available in three package options: DFN-8, SO-8, and HSO-8, providing engineers with flexibility in balancing device size and thermal performance according to application needs.