ページ 7 - IC用ソケット、トランジスタ -アダプタ | コネクタ、相互接続

部品番号	メーカ	説明	パッケージ	在庫	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
64-304121-00	Aries Electronics	SOCKET ADAPTER TQFP TO 64QFP Convert From (Adapter End): TQFP Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.031" (0.80mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫2,736	QFP	64	0.031" (0.80mm)	-	Through Hole	Solder	0.031" (0.80mm)	Tin-Lead	-	FR4 Epoxy Glass
44-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 44DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫8,766	DIP, 0.6" (15.24mm) Row Spacing	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-AQ132D	Aries Electronics	SOCKET ADAPTER PQFP TO 132PGA Convert From (Adapter End): PQFP Convert To (Adapter End): PGA Number of Pins: 132 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫4,194	PGA	132	0.025" (0.64mm)	Gold	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
264-1300-09-0602J	3M	RECEPTACLE DIP SOCKET 64POS .8" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫8,694	-	-	-	-	-	-	-	-	-	-
240-3639-09-0602J	3M	RECEPTACLE DIP SOCKET 40POS 1.0" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫6,480	-	-	-	-	-	-	-	-	-	-
32-652000-10-P	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫5,346	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
18-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 18SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 18 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	パッケージ: -	在庫3,798	SOIC	18	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-555000-00	Aries Electronics	SOCKET ADAPTER SSOP TO 28SOWIC Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫6,858	SOWIC	28	0.026" (0.65mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-665000-00	Aries Electronics	SCK ADAPT 28P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫6,012	SOIC	28	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
22-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 22SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫3,580	SOWIC	22	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
1106396-32	Aries Electronics	SOCKET ADAPTER DIP TO 32DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	パッケージ: -	在庫2,664	DIP, 0.6" (15.24mm) Row Spacing	32	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
44-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 44PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫3,436	PGA	44	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
LCQT-QFP0.5-80	Aries Electronics	SOCKET ADAPTER MULT PKG TO 80QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 80 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	パッケージ: -	在庫6,930	QFP	80	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
1106396-14	Aries Electronics	SOCKET ADAPTER DIP TO 14DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	パッケージ: -	在庫8,820	DIP, 0.6" (15.24mm) Row Spacing	14	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
22-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 22DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	パッケージ: -	在庫5,958	DIP, 0.3" (7.62mm) Row Spacing	22	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
228-1277-39-0602J	3M	RECEPTACLE DIP SOCKET 28POS .6" Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	パッケージ: -	在庫8,406	DIP, 0.6" (15.24mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
PA-TS1D6SM18-32	Logical Systems Inc.	ADAPTER 32TSOP TO 32DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫8,532	DIP	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-QFP0.65-64	Aries Electronics	SOCKET ADAPTER MULT PKG TO 64QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	パッケージ: -	在庫6,132	QFP	64	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
224-1275-29-0602J	3M	RECEPTACLE DIP SOCKET 24POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫7,596	-	-	-	-	-	-	-	-	-	-
232-1285-29-0602J	3M	RECEPTACLE DIP SOCKET 32POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫7,128	-	-	-	-	-	-	-	-	-	-
16-351000-11-RC	Aries Electronics	SOCKET ADAPTER SSOP TO 16DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫4,086	DIP, 0.3" (7.62mm) Row Spacing	16	0.026" (0.65mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
PA-SSD3SM18-28	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 28DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫4,896	DIP	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-QFP0.8-44	Aries Electronics	SOCKET ADAPTER MULT PKG TO 44QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 44 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	パッケージ: -	在庫5,580	QFP	44	0.031" (0.80mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
28-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 28DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫8,496	DIP, 0.3" (7.62mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1110748	Aries Electronics	SOCKET ADAPTER SOT25 TO 6DIP 0.3 Convert From (Adapter End): SOT-25 Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫4,680	DIP, 0.3" (7.62mm) Row Spacing	6	0.037" (0.95mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
PA-SOD3SM18-18	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 18DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	パッケージ: -	在庫6,048	DIP	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
216-3340-09-0602J	3M	SOCKET ADAPTER 16DIP TO 16DIP Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	パッケージ: -	在庫7,614	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
LCQT-SOIC28	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	パッケージ: -	在庫21,228	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
1109814	Aries Electronics	SOCKET ADAPTER SOIC TO TO-8 Convert From (Adapter End): SOIC Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	パッケージ: -	在庫14,616	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
08-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	パッケージ: -	在庫12,390	DIP, 0.3" (7.62mm) Row Spacing	8	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)

64-304121-00

Aries Electronics

SOCKET ADAPTER TQFP TO 64QFP

Convert From (Adapter End): TQFP
Convert To (Adapter End): QFP
Number of Pins: 64
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.031" (0.80mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫2,736

QFP

64

0.031" (0.80mm)

-

Through Hole

Solder

0.031" (0.80mm)

Tin-Lead

-

FR4 Epoxy Glass

44-653000-10

Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫8,766

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

97-AQ132D

Aries Electronics

SOCKET ADAPTER PQFP TO 132PGA

Convert From (Adapter End): PQFP
Convert To (Adapter End): PGA
Number of Pins: 132
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫4,194

PGA

132

0.025" (0.64mm)

Gold

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

264-1300-09-0602J

3M

RECEPTACLE DIP SOCKET 64POS .8"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫8,694

-

240-3639-09-0602J

3M

RECEPTACLE DIP SOCKET 40POS 1.0"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫6,480

-

32-652000-10-P

Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫5,346

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

18-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 18SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 18
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

パッケージ: -

在庫3,798

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

28-555000-00

Aries Electronics

SOCKET ADAPTER SSOP TO 28SOWIC

Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫6,858

SOWIC

28

0.026" (0.65mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

28-665000-00

Aries Electronics

SCK ADAPT 28P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫6,012

SOIC

28

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

22-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 22SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 22
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫3,580

SOWIC

22

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

1106396-32

Aries Electronics

SOCKET ADAPTER DIP TO 32DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

パッケージ: -

在庫2,664

DIP, 0.6" (15.24mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

44-505-110

Aries Electronics

SOCKET ADAPTER PLCC TO 44PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 44
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫3,436

PGA

44

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

LCQT-QFP0.5-80

Aries Electronics

SOCKET ADAPTER MULT PKG TO 80QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 80
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫6,930

QFP

80

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

1106396-14

Aries Electronics

SOCKET ADAPTER DIP TO 14DIP 0.6

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 14
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

パッケージ: -

在庫8,820

DIP, 0.6" (15.24mm) Row Spacing

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

22-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 22
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

パッケージ: -

在庫5,958

DIP, 0.3" (7.62mm) Row Spacing

22

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

228-1277-39-0602J

3M

RECEPTACLE DIP SOCKET 28POS .6"

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

パッケージ: -

在庫8,406

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

PA-TS1D6SM18-32

Logical Systems Inc.

ADAPTER 32TSOP TO 32DIP

Convert From (Adapter End): TSOP
Convert To (Adapter End): DIP
Number of Pins: 32
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫8,532

DIP

32

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-QFP0.65-64

Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 64
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫6,132

QFP

64

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

224-1275-29-0602J

3M

RECEPTACLE DIP SOCKET 24POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫7,596

-

232-1285-29-0602J

3M

RECEPTACLE DIP SOCKET 32POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫7,128

-

16-351000-11-RC

Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫4,086

DIP, 0.3" (7.62mm) Row Spacing

16

0.026" (0.65mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

PA-SSD3SM18-28

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 28DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫4,896

DIP

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-QFP0.8-44

Aries Electronics

SOCKET ADAPTER MULT PKG TO 44QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 44
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫5,580

QFP

44

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

28-351000-10

Aries Electronics

SOCKET ADAPTER SSOP TO 28DIP 0.3

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫8,496

DIP, 0.3" (7.62mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

1110748

Aries Electronics

SOCKET ADAPTER SOT25 TO 6DIP 0.3

Convert From (Adapter End): SOT-25
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 6
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫4,680

DIP, 0.3" (7.62mm) Row Spacing

6

0.037" (0.95mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

PA-SOD3SM18-18

Logical Systems Inc.

SOCKET ADAPTER SOIC TO 18DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP
Number of Pins: 18
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

パッケージ: -

在庫6,048

DIP

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

216-3340-09-0602J

3M

SOCKET ADAPTER 16DIP TO 16DIP

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

パッケージ: -

在庫7,614

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

LCQT-SOIC28

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫21,228

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

1109814

Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

Convert From (Adapter End): SOIC
Convert To (Adapter End): JEDEC
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

パッケージ: -

在庫14,616

JEDEC

8

0.050" (1.27mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

08-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

パッケージ: -

在庫12,390

DIP, 0.3" (7.62mm) Row Spacing

8

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)