画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS TIN
|
パッケージ: - |
在庫3,400 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper Alloy | - | -55°C ~ 105°C |
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TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS
|
パッケージ: - |
在庫4,590 |
|
18 (2 x 9) | 0.100" (2.54mm) | - | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Copper Alloy | - | -55°C ~ 105°C |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS
|
パッケージ: - |
在庫2,700 |
|
40 (2 x 20) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 36POS GLD
|
パッケージ: - |
在庫3,582 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 50POS GOLD
|
パッケージ: - |
在庫7,650 |
|
50 (2 x 25) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
パッケージ: - |
在庫4,662 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 36POS GOLD
|
パッケージ: - |
在庫7,434 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
パッケージ: - |
在庫4,284 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
|
パッケージ: - |
在庫2,628 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 64POS GOLD
|
パッケージ: - |
在庫3,258 |
|
64 (2 x 32) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
パッケージ: - |
在庫7,434 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 12POS GOLD
|
パッケージ: - |
在庫5,598 |
|
12 (1 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
パッケージ: - |
在庫5,274 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 40POS GOLD
|
パッケージ: - |
在庫4,140 |
|
40 (1 x 40) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
パッケージ: - |
在庫5,076 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
|
パッケージ: - |
在庫3,348 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 22POS GOLD
|
パッケージ: - |
在庫7,344 |
|
22 (1 x 22) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
パッケージ: - |
在庫8,856 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY(G/F) W/EMBOSS TAPE,
|
パッケージ: - |
在庫3,078 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
510AG91D16ESL=SOCKET ASSY.
|
パッケージ: - |
在庫6,534 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
パッケージ: - |
在庫4,968 |
|
32 (2 x 16) | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Samtec Inc. |
ADAPTOR PLUG
|
パッケージ: - |
在庫8,658 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN IC DIP SOCKET 6POS GOLD
|
パッケージ: - |
在庫6,300 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
On Shore Technology Inc. |
CONN SOCKET PLCC 32POS
|
パッケージ: - |
在庫4,878 |
|
32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 170°C |
||
CNC Tech |
CONN SOCKET PLCC 32POS TIN
|
パッケージ: - |
在庫7,776 |
|
32 (4 x 8) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 8POS GOLD
|
パッケージ: - |
在庫2,790 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 24POS GOLD
|
パッケージ: - |
在庫14,328 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Assmann WSW Components |
CONN IC DIP SOCKET 28POS GOLD
|
パッケージ: - |
在庫9,324 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |