ページ 232 - IC用ソケット、トランジスタ | コネクタ、相互接続

0009483031

Molex, LLC

CONN SOCKET TRANSIST TO-220 3POS

Type: Transistor, TO-220
Number of Positions or Pins (Grid): 3 (Rectangular)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA66), Nylon 6/6
Operating Temperature: -40°C ~ 80°C

パッケージ: -

在庫2,304

3 (Rectangular)

-

Tin

100µin (2.54µm)

Brass

Through Hole

Closed Frame

Solder

-

Tin

100µin (2.54µm)

Brass

Polyamide (PA66), Nylon 6/6

-40°C ~ 80°C

558-10-478M26-131104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,562

478 (26 x 26)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-357M19-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 357 (19 x 19)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,444

357 (19 x 19)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

156-PLS16011-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

パッケージ: -

在庫8,532

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

546-87-528-21-121147

Preci-Dip

CONN SOCKET PGA 528POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 528 (21 x 21)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Bronze
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫5,724

528 (21 x 21)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin

-

Bronze

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

36-3553-16

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

パッケージ: -

在庫8,010

36 (2 x 18)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

180-PGM18007-41

Aries Electronics

CONN SOCKET PGA GOLD

Type: PGA
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,964

-

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 125°C

34-0501-31

Aries Electronics

CONN SOCKET SIP 34POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 34 (1 x 34)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,330

34 (1 x 34)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10µin (0.25µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 125°C

324-13-120-41-002000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 20POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,806

20 (1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

126-93-322-41-002000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 22POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫5,310

22 (2 x 11)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

115-93-642-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 42POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,176

42 (2 x 21)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

123-93-306-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫7,308

6 (2 x 3)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

28-1508-30

Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫4,284

28 (2 x 14)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6

-55°C ~ 105°C

16-8250-310C

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫7,380

16 (2 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

14-823-90TWR

Aries Electronics

CONN IC DIP SOCKET 14POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -

パッケージ: -

在庫4,176

14 (2 x 7)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6

-

30-0518-00

Aries Electronics

CONN SOCKET SIP 30POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 30 (1 x 30)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

パッケージ: -

在庫2,052

30 (1 x 30)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

24-3518-102

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

パッケージ: -

在庫5,706

24 (2 x 12)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

32-6518-11

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

パッケージ: -

在庫4,968

32 (2 x 16)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

122-83-322-41-001101

Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,104

22 (2 x 11)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

1825375-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,356

40 (2 x 20)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 125°C

116-83-308-41-006101

Preci-Dip

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,712

8 (2 x 4)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

04-1518-10T

Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

パッケージ: -

在庫8,910

4 (2 x 2)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

115-83-304-41-001101

Preci-Dip

CONN IC DIP SOCKET 4POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫5,094

4 (2 x 2)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

D01-9970542

Harwin Inc.

CONN SOCKET SIP 5POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.8µin (5.00µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,906

5 (1 x 5)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

-55°C ~ 125°C

ICF-316-T-O

Samtec Inc.

SURFACE MOUNT DIP SOCKETS

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫9,528

-

228-1290-00-0602J

3M

CONN IC DIP SOCKET ZIF 28POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,660

28 (2 x 14)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

210-1-06-003

CNC Tech

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polybutylene Terephthalate (PBT)
Operating Temperature: -40°C ~ 105°C

パッケージ: -

在庫76,704

6 (2 x 3)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polybutylene Terephthalate (PBT)

-40°C ~ 105°C

110-43-640-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫21,972

40 (2 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C