画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol FCI |
CONN IC DIP SOCKET 16POS TINLEAD
|
パッケージ: - |
在庫7,902 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
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Amphenol FCI |
CONN SOCKET SIP 25POS TIN
|
パッケージ: - |
在庫4,716 |
|
25 (1 x 25) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
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Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 32POS TIN-LEAD
|
パッケージ: - |
在庫8,784 |
|
32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin-Lead | 100µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
パッケージ: - |
在庫4,608 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 299POS GOLD
|
パッケージ: - |
在庫5,850 |
|
299 (20 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
PGA SOLDER TAIL
|
パッケージ: - |
在庫3,420 |
|
132 (13 x 13) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS
|
パッケージ: - |
在庫7,164 |
|
40 (2 x 20) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 18POS GOLD
|
パッケージ: - |
在庫7,884 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 36POS TIN
|
パッケージ: - |
在庫2,772 |
|
36 (1 x 36) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
PGA SOLDER TAIL
|
パッケージ: - |
在庫5,472 |
|
133 (14 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 14POS GOLD
|
パッケージ: - |
在庫6,408 |
|
14 (1 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 46POS GOLD
|
パッケージ: - |
在庫4,698 |
|
46 (1 x 46) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
パッケージ: - |
在庫3,544 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
PGA SOLDER TAIL
|
パッケージ: - |
在庫8,928 |
|
68 (10 x 10) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 177POS GOLD
|
パッケージ: - |
在庫7,956 |
|
177 (15 x 15) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 52POS GOLD
|
パッケージ: - |
在庫6,156 |
|
52 (2 x 26) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 12POS TIN
|
パッケージ: - |
在庫8,082 |
|
12 (1 x 12) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Samtec Inc. |
ADAPTOR PLUG
|
パッケージ: - |
在庫8,676 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
パッケージ: - |
在庫8,496 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Harwin Inc. |
CONN IC DIP SOCKET 28POS GOLD
|
パッケージ: - |
在庫7,128 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | 196.8µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 20POS GOLD
|
パッケージ: - |
在庫6,318 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 6POS TIN-LEAD
|
パッケージ: - |
在庫5,166 |
|
6 (1 x 6) | 0.100" (2.54mm) | Tin-Lead | 150µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 150µin (3.81µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
|
パッケージ: - |
在庫4,554 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
SIP IC SKT 20 SSR SN/AU FLH ROHS
|
パッケージ: - |
在庫2,250 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 6POS GOLD
|
パッケージ: - |
在庫8,928 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Preci-Dip |
CONN ZIG-ZAG 20POS GOLD
|
パッケージ: - |
在庫8,028 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
パッケージ: - |
在庫7,092 |
|
21 (1 x 21) | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.070" (1.78mm) | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
パッケージ: - |
在庫6,708 |
|
3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |