画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Amphenol FCI |
CONN SOCKET SIP 4POS GOLD
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パッケージ: - |
在庫7,668 |
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4 (1 x 4) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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TE Connectivity AMP Connectors |
CONN SOCKET SIP 15POS TIN
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パッケージ: - |
在庫8,352 |
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15 (1 x 15) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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Assmann WSW Components |
CONN SOCKET PLCC 32POS GOLD
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パッケージ: - |
在庫7,254 |
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32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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Preci-Dip |
BGA SURFACE MOUNT 1.27MM
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パッケージ: - |
在庫2,952 |
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652 (35 x 35) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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Aries Electronics |
CONN SOCKET PGA ZIF GOLD
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パッケージ: - |
在庫2,664 |
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- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
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Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD
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パッケージ: - |
在庫3,276 |
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478 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD
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パッケージ: - |
在庫6,012 |
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356 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
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パッケージ: - |
在庫6,786 |
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24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
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Aries Electronics |
CONN SOCKET SIP 30POS TIN
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パッケージ: - |
在庫7,020 |
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30 (1 x 30) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
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パッケージ: - |
在庫4,986 |
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24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
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パッケージ: - |
在庫8,550 |
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22 (2 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
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パッケージ: - |
在庫2,124 |
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22 (2 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 61POS GOLD
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パッケージ: - |
在庫5,976 |
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61 (1 x 61) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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Aries Electronics |
CONN SOCKET SIP 9POS TIN
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パッケージ: - |
在庫5,724 |
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9 (1 x 9) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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Aries Electronics |
CONN SOCKET SIP 1POS GOLD
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パッケージ: - |
在庫3,490 |
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1 (1 x 1) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
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パッケージ: - |
在庫4,716 |
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10 (2 x 5) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 26POS GOLD
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パッケージ: - |
在庫2,250 |
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26 (1 x 26) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
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パッケージ: - |
在庫8,460 |
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18 (2 x 9) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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Preci-Dip |
CONN SOCKET PGA 88POS GOLD
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パッケージ: - |
在庫8,208 |
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88 (12 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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Aries Electronics |
CONN SOCKET SIP 4POS TIN
|
パッケージ: - |
在庫3,906 |
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4 (1 x 4) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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Preci-Dip |
CONN IC DIP SOCKET 16POS GOLD
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パッケージ: - |
在庫5,058 |
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16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 1POS GOLD
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パッケージ: - |
在庫6,606 |
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1 (1 x 1) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
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パッケージ: - |
在庫8,694 |
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28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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CNC Tech |
CONN IC DIP SOCKET 20POS GOLD
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パッケージ: - |
在庫4,914 |
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20 (2 x 10) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
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Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD
|
パッケージ: - |
在庫8,172 |
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20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
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パッケージ: - |
在庫6,678 |
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10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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3M |
CONN IC DIP SOCKET ZIF 32POS GLD
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パッケージ: - |
在庫5,796 |
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32 (2 x 16) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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Assmann WSW Components |
CONN IC DIP SOCKET 16POS GOLD
|
パッケージ: - |
在庫22,332 |
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16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
