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ASU02DXTB

Sullins Connector Solutions

CONN SOCKET AXIAL 2POS GOLD

Type: Axial
Number of Positions or Pins (Grid): 2 (Rectangular)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Board Guide
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫6,066

2 (Rectangular)

-

Gold

10µin (0.25µm)

-

Through Hole

Board Guide

Solder

-

Gold

10µin (0.25µm)

-

SIP1X32-001BLF

Amphenol FCI

CONN SOCKET SIP 32POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 32 (1 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

パッケージ: -

在庫3,454

32 (1 x 32)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

390263-5

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 42POS TINLEAD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: -
Operating Temperature: -40°C ~ 105°C

パッケージ: -

在庫5,868

42 (2 x 21)

0.100" (2.54mm)

Tin-Lead

-

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Phosphor Bronze

-

-40°C ~ 105°C

240-4846-00-3303

3M

CONN IC DIP SOCKET ZIF 40POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250µin (6.35µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyether Imide (PEI), Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫6,192

40 (2 x 20)

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Polyether Imide (PEI), Glass Filled

-55°C ~ 105°C

510-93-241-18-075002

Mill-Max Manufacturing Corp.

CONN SOCKET PGA 241POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 241 (18 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,726

241 (18 x 18)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

126-93-642-41-003000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 42POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,082

42 (2 x 21)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

510-83-262-20-091101

Preci-Dip

CONN SOCKET PGA 262POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 262 (20 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,600

262 (20 x 20)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-93-650-41-007000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 50POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 50 (2 x 25)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,678

50 (2 x 25)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

25-7787-10

Aries Electronics

CONN SOCKET SIP 25POS TIN

Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫5,418

25 (1 x 25)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

101-93-306-41-560000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫2,592

6 (2 x 3)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

20-7770-10

Aries Electronics

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫8,658

20 (1 x 20)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

19-0503-30

Aries Electronics

CONN SOCKET SIP 19POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA), Nylon, Glass Filled
Operating Temperature: -

パッケージ: -

在庫2,034

19 (1 x 19)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA), Nylon, Glass Filled

-

APA-648-T-M

Samtec Inc.

ADAPTOR PLUG

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫3,654

-

550-80-068-11-071101

Preci-Dip

PGA SOLDER TAIL

Type: PGA
Number of Positions or Pins (Grid): 68 (11 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,338

68 (11 x 11)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

05-7650-10

Aries Electronics

CONN SOCKET SIP 5POS TIN

Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫5,310

5 (1 x 5)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

10-8937-610C

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫8,892

10 (2 x 5)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

06-0501-30

Aries Electronics

CONN SOCKET SIP 6POS TIN

Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫7,776

6 (1 x 6)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

08-6823-90T

Aries Electronics

CONN IC DIP SOCKET 8POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -

パッケージ: -

在庫6,966

8 (2 x 4)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6

-

110-91-304-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 4POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 4 (2 x 2)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,644

4 (2 x 2)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

APA-628-T-A

Samtec Inc.

ADAPTOR PLUG

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

パッケージ: -

在庫3,562

-

116-83-420-41-001101

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,158

20 (2 x 10)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-83-636-41-001101

Preci-Dip

CONN IC DIP SOCKET 36POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,932

36 (2 x 18)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

643646-6

TE Connectivity AMP Connectors

CONN SOCKET SIP 14POS TIN

Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

パッケージ: -

在庫6,084

14 (1 x 14)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

116-83-624-41-018101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,354

24 (2 x 12)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

115-83-320-41-001101

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫5,454

20 (2 x 10)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

10-1518-10T

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

パッケージ: -

在庫4,860

10 (2 x 5)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

8059-2G8

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 8 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,838

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

D0816-42

Harwin Inc.

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.8µin (5.00µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫13,248

16 (2 x 8)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

-55°C ~ 125°C