ページ 6 - Epson Electronics America Inc-Semiconductor Div 製品

部品番号	メーカ	説明	パッケージ	在庫
S1F75540F5A0000	Epson Electronics America Inc-Semiconductor Div	IC DC/DC CONV W/VOLT REG 64-QFN Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 64-QFN Supplier Device Package: -	パッケージ: 64-QFN	在庫5,952
S1F77603Y0A000L	Epson Electronics America Inc-Semiconductor Div	IC BATTERY LEAK PREVENTION SOT89 Function: - Battery Chemistry: - Number of Cells: - Fault Protection: - Interface: - Operating Temperature: - Package / Case: - Supplier Device Package: SOT-89-3	パッケージ: -	在庫3,104
S2D13513F01A100	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,336
S1D13T04F10E100	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC EPD CTRLR 48SQFN Type: Graphic Controller Applications: EPD Panel Mounting Type: - Package / Case: - Supplier Device Package: 48-SQFN (7x7)	パッケージ: -	在庫4,880
S2D13782F00A100	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 100BFQFP Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 100-BFQFP Supplier Device Package: 100-QFP (14x14)	パッケージ: 100-BFQFP	在庫4,608
S1D13706F00A200	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 100TQFP Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP	パッケージ: 100-TQFP	在庫15,432
S1D13700F02A100	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 64TQFP Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: -	パッケージ: 64-TQFP	在庫6,704
S1R72C05B10E100	Epson Electronics America Inc-Semiconductor Div	IC CONTROLLER USB 121BGA Protocol: USB Function: Host Controller Interface: USB Standards: USB 2.0 Voltage - Supply: 1.8V, 3.3V Current - Supply: 75mA Operating Temperature: -40°C ~ 85°C Package / Case: 121-TFBGA Supplier Device Package: 121-TFBGA (10x10)	パッケージ: 121-TFBGA	在庫7,232
S1R72C05F15E100	Epson Electronics America Inc-Semiconductor Div	IC CONTROLLER USB 128QFP Protocol: USB Function: Host Controller Interface: USB Standards: USB 2.0 Voltage - Supply: 1.8V, 3.3V Current - Supply: 75mA Operating Temperature: -40°C ~ 85°C Package / Case: 128-LQFP Supplier Device Package: 128-LQFP (14x14)	パッケージ: 128-LQFP	在庫6,560
S1R72V27F14H100	Epson Electronics America Inc-Semiconductor Div	IC CONTROLLER USB 80QFP Protocol: USB Function: Host Controller Interface: USB Standards: USB 2.0 Voltage - Supply: 1.8V, 3.3V Current - Supply: 40.2mA Operating Temperature: -40°C ~ 85°C Package / Case: 80-LQFP Supplier Device Package: 80-QFP (12x12)	パッケージ: 80-LQFP	在庫7,072
S1C17704F101100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 64KB FLASH 144TQFP Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: - Package / Case: 144-TQFP Supplier Device Package: -	パッケージ: 144-TQFP	在庫5,088
S1C17704B102100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 64KB FLASH 161VFBGA Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: - Package / Case: 161-VFBGA Supplier Device Package: 161-VFBGA (7x7)	パッケージ: 161-VFBGA	在庫4,656
S1C17W15F002100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 64KB FLASH 100QFP Core Processor: S1C17 Core Size: 16-Bit Speed: 4.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: LCD, POR, PWM, RFC, SNDA, WDT Number of I/O: 35 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-QFP (14x14)	パッケージ: 100-LQFP	在庫4,624
S1C17611D101000	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 32KB FLASH 48TQFP Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 19 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -25°C ~ 70°C (TA) Mounting Type: - Package / Case: 48-TQFP Supplier Device Package: -	パッケージ: 48-TQFP	在庫5,008
S1C17W22D101100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 64KB FLASH DIE Core Processor: S1C17 Core Size: 16-Bit Speed: 4.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: LCD, PWM, RFC, WDT Number of I/O: 41 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: Die Supplier Device Package: Die	パッケージ: Die	在庫5,424
S1C17F57F401100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 32KB FLASH 128QFP Core Processor: S1C17 Core Size: 16-Bit Speed: 4.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: PWM, WDT Number of I/O: 29 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 128-LQFP Supplier Device Package: -	パッケージ: 128-LQFP	在庫18,108
S7U4E0020030000	Epson Electronics America Inc-Semiconductor Div	MICRO GPS EVALUATION MODULE Type: GPS Receiver Frequency: 1575MHz For Use With/Related Products: - Supplied Contents: Module	パッケージ: -	在庫3,780
S1V3G340F00A900-160	Epson Electronics America Inc-Semiconductor Div	VOICE GUIDANCE IC (ROMLESS) Function: Voice Processor Applications: Signal Mixing Number of Channels: 1 Interface: SPI Voltage - Supply: 2.2 V ~ 5.5 V Operating Temperature: - Specifications: - Package / Case: 52-LQFP Supplier Device Package: 52-QFP13 (10x10)	パッケージ: 52-LQFP	在庫3,872
S1C17W18F102100-260	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ 128KB FLASH 8K Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,648
S1C17W16F102100	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ 64KB FLASH 8KB Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,320
S1C17M12F101100-250	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 16.8MHZ16KB FLASH 2K Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,024
S1C17M10F101100	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 16MHZ 64KB FLASH 4K R Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,968
S1D13515F00A100-36	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER UP TO 64MB EXTERN Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-QFP22 (28x28)	パッケージ: 256-LQFP	在庫2,512
S1D13748B00B100-240	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER BUILT-IN 1024KB S Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-PFBGA (10x10)	パッケージ: 121-TFBGA	在庫3,376
S1D13513F01A100-36	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER UP TO 16MB EXTERN Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 208-LQFP Supplier Device Package: 208-QFP22 (28x28)	パッケージ: 208-LQFP	在庫4,800
S1D13705F00A200	Epson Electronics America Inc-Semiconductor Div	CONTROLLER LCD COLOUR Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,080
S1D13517F00A100-90	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER UP TO 16MB SDRAM Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 128-LQFP Supplier Device Package: 128-QFP15 (14x14)	パッケージ: 128-LQFP	在庫4,592
S1C17M40F701100-160	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 48KB FLASH 64QFP13 Core Processor: S1C17 Core Size: 16-Bit Speed: 16.8MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT Number of I/O: - Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-QFP13 (10x10)	パッケージ: -	Request a Quote
S1C31D01B101000	Epson Electronics America Inc-Semiconductor Div	IC MCU 32BT 256KB FLSH 81VFBGA5H Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 21MHz Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT Number of I/O: 57 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 8x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 81-VFBGA Supplier Device Package: 81-VFBGA5H	パッケージ: -	Request a Quote
S1C17M25F001100-250	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 32KB FLASH 48TQFP12 Core Processor: S1C17 Core Size: 16-Bit Speed: 21MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 8x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-TQFP Supplier Device Package: 48-TQFP12 (7x7)	パッケージ: -	Request a Quote

S1F75540F5A0000

Epson Electronics America Inc-Semiconductor Div

IC DC/DC CONV W/VOLT REG 64-QFN

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 64-QFN
Supplier Device Package: -

パッケージ: 64-QFN

在庫5,952

S1F77603Y0A000L

Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

Function: -
Battery Chemistry: -
Number of Cells: -
Fault Protection: -
Interface: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: SOT-89-3

パッケージ: -

在庫3,104

S2D13513F01A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,336

S1D13T04F10E100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC EPD CTRLR 48SQFN

Type: Graphic Controller
Applications: EPD Panel
Mounting Type: -
Package / Case: -
Supplier Device Package: 48-SQFN (7x7)

パッケージ: -

在庫4,880

S2D13782F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100BFQFP

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 100-BFQFP
Supplier Device Package: 100-QFP (14x14)

パッケージ: 100-BFQFP

在庫4,608

S1D13706F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100TQFP

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP

パッケージ: 100-TQFP

在庫15,432

S1D13700F02A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 64TQFP

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Supplier Device Package: -

パッケージ: 64-TQFP

在庫6,704

S1R72C05B10E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 121BGA

Protocol: USB
Function: Host Controller
Interface: USB
Standards: USB 2.0
Voltage - Supply: 1.8V, 3.3V
Current - Supply: 75mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 121-TFBGA
Supplier Device Package: 121-TFBGA (10x10)

パッケージ: 121-TFBGA

在庫7,232

S1R72C05F15E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 128QFP

Protocol: USB
Function: Host Controller
Interface: USB
Standards: USB 2.0
Voltage - Supply: 1.8V, 3.3V
Current - Supply: 75mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 128-LQFP
Supplier Device Package: 128-LQFP (14x14)

パッケージ: 128-LQFP

在庫6,560

S1R72V27F14H100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

Protocol: USB
Function: Host Controller
Interface: USB
Standards: USB 2.0
Voltage - Supply: 1.8V, 3.3V
Current - Supply: 40.2mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 80-LQFP
Supplier Device Package: 80-QFP (12x12)

パッケージ: 80-LQFP

在庫7,072

S1C17704F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144TQFP

Core Processor: S1C17
Core Size: 16-Bit
Speed: 8.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: LCD, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -20°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 144-TQFP
Supplier Device Package: -

パッケージ: 144-TQFP

在庫5,088

S1C17704B102100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 161VFBGA

Core Processor: S1C17
Core Size: 16-Bit
Speed: 8.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: LCD, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -20°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 161-VFBGA
Supplier Device Package: 161-VFBGA (7x7)

パッケージ: 161-VFBGA

在庫4,656

S1C17W15F002100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 100QFP

Core Processor: S1C17
Core Size: 16-Bit
Speed: 4.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
Number of I/O: 35
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-QFP (14x14)

パッケージ: 100-LQFP

在庫4,624

S1C17611D101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 48TQFP

Core Processor: S1C17
Core Size: 16-Bit
Speed: 8.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: LCD, PWM, WDT
Number of I/O: 19
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -25°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 48-TQFP
Supplier Device Package: -

パッケージ: 48-TQFP

在庫5,008

S1C17W22D101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

Core Processor: S1C17
Core Size: 16-Bit
Speed: 4.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: LCD, PWM, RFC, WDT
Number of I/O: 41
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: Die
Supplier Device Package: Die

パッケージ: Die

在庫5,424

S1C17F57F401100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 128QFP

Core Processor: S1C17
Core Size: 16-Bit
Speed: 4.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: PWM, WDT
Number of I/O: 29
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 128-LQFP
Supplier Device Package: -

パッケージ: 128-LQFP

在庫18,108

S7U4E0020030000

Epson Electronics America Inc-Semiconductor Div

MICRO GPS EVALUATION MODULE

Type: GPS Receiver
Frequency: 1575MHz
For Use With/Related Products: -
Supplied Contents: Module

パッケージ: -

在庫3,780

S1V3G340F00A900-160

Epson Electronics America Inc-Semiconductor Div

VOICE GUIDANCE IC (ROMLESS)

Function: Voice Processor
Applications: Signal Mixing
Number of Channels: 1
Interface: SPI
Voltage - Supply: 2.2 V ~ 5.5 V
Operating Temperature: -
Specifications: -
Package / Case: 52-LQFP
Supplier Device Package: 52-QFP13 (10x10)

パッケージ: 52-LQFP

在庫3,872

S1C17W18F102100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,648

S1C17W16F102100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 8KB

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,320

S1C17M12F101100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16.8MHZ16KB FLASH 2K

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,024

S1C17M10F101100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16MHZ 64KB FLASH 4K R

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,968

S1D13515F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 64MB EXTERN

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 256-LQFP
Supplier Device Package: 256-QFP22 (28x28)

パッケージ: 256-LQFP

在庫2,512

S1D13748B00B100-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 1024KB S

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 121-TFBGA
Supplier Device Package: 121-PFBGA (10x10)

パッケージ: 121-TFBGA

在庫3,376

S1D13513F01A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Supplier Device Package: 208-QFP22 (28x28)

パッケージ: 208-LQFP

在庫4,800

S1D13705F00A200

Epson Electronics America Inc-Semiconductor Div

CONTROLLER LCD COLOUR

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,080

S1D13517F00A100-90

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB SDRAM

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Supplier Device Package: 128-QFP15 (14x14)

パッケージ: 128-LQFP

在庫4,592

S1C17M40F701100-160

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 64QFP13

Core Processor: S1C17
Core Size: 16-Bit
Speed: 16.8MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Number of I/O: -
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-QFP13 (10x10)

パッケージ: -

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S1C31D01B101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BT 256KB FLSH 81VFBGA5H

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 21MHz
Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
Number of I/O: 57
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 8x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 81-VFBGA
Supplier Device Package: 81-VFBGA5H

パッケージ: -

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S1C17M25F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 48TQFP12

Core Processor: S1C17
Core Size: 16-Bit
Speed: 21MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Number of I/O: 39
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 8x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Supplier Device Package: 48-TQFP12 (7x7)

パッケージ: -

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