ページ 52 - 組み込み - マイクロコントローラ、マイクロプロセッサ、FPGAモジュール | 集積回路（IC）

部品番号	メーカ	説明	パッケージ	在庫	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
DC-ME-01T-MF-50	Digi International	MODULE ME 8MB 2MB FLASH 50PK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫6,176	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
CC-9P-V236-Z1-B	Digi International	MODULE 9P 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	パッケージ: -	在庫3,456	-	-	-	-	-	-	-	-
CC-9P-T237-Z1-B	Digi International	MODULE 9P 64MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	パッケージ: -	在庫3,040	-	-	-	-	-	-	-	-
CC-9C-V212-Z6-B	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫7,728	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
SOMOMAP3530-11-1672IFCR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	パッケージ: -	在庫7,856	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
DC-ME-Y401-JT	Digi International	MOD ME 9210 8MB SDRAM 2MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	パッケージ: -	在庫2,864	ARM926EJ-S, NS9210	-	75MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
101-0453	Digi International	MODULE RABBITCORE RCM2300 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x26 Size / Dimension: 1.15" x 1.6" (29mm x 41mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫7,168	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x26	1.15" x 1.6" (29mm x 41mm)	-40°C ~ 85°C
SOMAM1808-10-1602QHIR	Logic	SYSTEM ON MODULE AM1808 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: - Speed: 450MHz Flash Size: 8MB RAM Size: 128MB Connector Type: - Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫7,760	ARM926EJ-S, AM1808	-	450MHz	8MB	128MB	-	1.18" x 1.57" (30mm x 40mm)	-40°C ~ 85°C
20-101-1195	Digi International	MODULE RABBITCORE RCM3319 ROHS Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫4,768	Rabbit 3000	-	44.2MHz	512KB (Internal), 4MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 85°C
CC-9P-V524-LX	Digi International	MODULE 9P 32MB SDRAM 16MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫3,728	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
SOMAM3517-10-1780RJCR	Logic	IC SOM AM3517 MODULE Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3517 Co-Processor: - Speed: 600MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm) Operating Temperature: 0°C ~ 70°C	パッケージ: -	在庫6,752	ARM? Cortex?-A8, AM3517	-	600MHz	512MB	256MB	Board-to-Board (BTB) Socket - 300	1.61" x 2.02" (40.9mm x 51.2mm)	0°C ~ 70°C
DC-SP-01-C	Digi International	ADAPTER SP CUSTOMIZABLE MODEL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫4,096	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
DC-ME4-01T-VTY-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫6,432	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0803-01-02EG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU2EG-1S 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	パッケージ: -	在庫7,904	-	-	-	-	-	-	-	-
A10S-P7-XXD-RC-SA	Critical Link LLC	IC MODULE CORTEX-A9 1.2GHZ 2GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 2GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4" x 4" (101.5mm x 101.5mm) Operating Temperature: 0°C ~ 70°C	パッケージ: -	在庫4,176	ARM® Cortex®-A9, Arria 10 SX	NEON™ SIMD	1.2GHz	-	2GB	Board-to-Board (BTB)	4" x 4" (101.5mm x 101.5mm)	0°C ~ 70°C
G400S-SM-480	GHI Electronics, LLC	IC MOD ARM926EJ-S 400MHZ 32KB Module/Board Type: MPU Core Core Processor: ARM926EJ-S Co-Processor: - Speed: 400MHz Flash Size: 4MB (External) RAM Size: 32KB (Internal), 128MB (External) Connector Type: - Size / Dimension: 1.90" x 1.30" (48.3mm x 33.1mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	在庫5,808	ARM926EJ-S	-	400MHz	4MB (External)	32KB (Internal), 128MB (External)	-	1.90" x 1.30" (48.3mm x 33.1mm)	-40°C ~ 85°C
OSD32MP157F-512M-BAA	Octavo Systems LLC	SIP: 157F, 512MB, BAA Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 800MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	パッケージ: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	800MHz	-	512MB	302-BGA	0.710" L x 0.710" W (18.00mm x 18.00mm)	0°C ~ 85°C
FORLINX-FET1012A-C-10512MOE01IA11	Forlinx Embedded	NXP LS1012ASOM,512MB DDR3L 8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.0GHz Flash Size: 8GB eMMC, 16Mb QSPI RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 80°C	パッケージ: -	Request a Quote	ARM® Cortex®-A53	-	1.0GHz	8GB eMMC, 16Mb QSPI	512MB	Board-to-Board (BTB) Socket - 160	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 80°C
FORLINX-FET6254-C-142GSE8GIB11	Forlinx Embedded	TI AM6254SOM,2GB DDR4, 8GB eMMC Module/Board Type: MPU Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Co-Processor: - Speed: 1.4GHz Flash Size: 8GB eMMC RAM Size: 2GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 1.496" L x 2.360" W (38.00mm x 60.00mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-M4F	-	1.4GHz	8GB eMMC	2GB	Board-to-Board (BTB) 4 x 80 Pin	1.496" L x 2.360" W (38.00mm x 60.00mm)	-40°C ~ 85°C
AM0010-02-3BE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU3EG-1E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	パッケージ: -	Request a Quote	Zynq™ UltraScale+™ ZU3EG-1E	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	0°C ~ 85°C
RK3328-SOM-2G	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: 2GB Connector Type: USB Size / Dimension: - Operating Temperature: -	パッケージ: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	-	2GB	USB	-	-
TE0720-03-62I33FL	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-04-15-1EE-S	Trenz Electronic GmbH	IC MOD SOM MPSOC Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	パッケージ: -	Request a Quote	-	-	-	-	-	-	-	-
EC-VA-H264-8B-60-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	パッケージ: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0720-04-31C33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: 766MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	パッケージ: -	Request a Quote	ARM® Cortex®-A9	-	766MHz	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
DC-VA-H264-10B-60-4K-OPVIC-0000	System-On-Chip (SOC) Technologies Inc.	DECODER H264 4K VID/AUD 10BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	パッケージ: -	Request a Quote	-	-	-	-	-	-	-	-
5746-PX-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5746 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	パッケージ: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C
TE0630-02IV-DWS	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	パッケージ: -	Request a Quote	-	-	-	-	-	-	-	-

DC-ME-01T-MF-50

Digi International

MODULE ME 8MB 2MB FLASH 50PK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫6,176

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

CC-9P-V236-Z1-B

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

パッケージ: -

在庫3,456

-

CC-9P-T237-Z1-B

Digi International

MODULE 9P 64MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

パッケージ: -

在庫3,040

-

CC-9C-V212-Z6-B

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫7,728

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

SOMOMAP3530-11-1672IFCR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: TMS320C64x (DSP)
Speed: 600MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

パッケージ: -

在庫7,856

ARM? Cortex?-A8, OMAP3530

TMS320C64x (DSP)

600MHz

256MB (NAND), 8MB (NOR)

128MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

DC-ME-Y401-JT

Digi International

MOD ME 9210 8MB SDRAM 2MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

パッケージ: -

在庫2,864

ARM926EJ-S, NS9210

-

75MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

101-0453

Digi International

MODULE RABBITCORE RCM2300

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x26
Size / Dimension: 1.15" x 1.6" (29mm x 41mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫7,168

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x26

1.15" x 1.6" (29mm x 41mm)

-40°C ~ 85°C

SOMAM1808-10-1602QHIR

Logic

SYSTEM ON MODULE AM1808

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: -
Speed: 450MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: -
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫7,760

ARM926EJ-S, AM1808

-

450MHz

8MB

128MB

-

1.18" x 1.57" (30mm x 40mm)

-40°C ~ 85°C

20-101-1195

Digi International

MODULE RABBITCORE RCM3319 ROHS

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫4,768

Rabbit 3000

-

44.2MHz

512KB (Internal), 4MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 85°C

CC-9P-V524-LX

Digi International

MODULE 9P 32MB SDRAM 16MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫3,728

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

SOMAM3517-10-1780RJCR

Logic

IC SOM AM3517 MODULE

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3517
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
Operating Temperature: 0°C ~ 70°C

パッケージ: -

在庫6,752

ARM? Cortex?-A8, AM3517

-

600MHz

512MB

256MB

Board-to-Board (BTB) Socket - 300

1.61" x 2.02" (40.9mm x 51.2mm)

0°C ~ 70°C

DC-SP-01-C

Digi International

ADAPTER SP CUSTOMIZABLE MODEL

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫4,096

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

DC-ME4-01T-VTY-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫6,432

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0803-01-02EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

パッケージ: -

在庫7,904

-

A10S-P7-XXD-RC-SA

Critical Link LLC

IC MODULE CORTEX-A9 1.2GHZ 2GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Arria 10 SX
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 2GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
Operating Temperature: 0°C ~ 70°C

パッケージ: -

在庫4,176

ARM® Cortex®-A9, Arria 10 SX

NEON™ SIMD

1.2GHz

-

2GB

Board-to-Board (BTB)

4" x 4" (101.5mm x 101.5mm)

0°C ~ 70°C

G400S-SM-480

GHI Electronics, LLC

IC MOD ARM926EJ-S 400MHZ 32KB

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S
Co-Processor: -
Speed: 400MHz
Flash Size: 4MB (External)
RAM Size: 32KB (Internal), 128MB (External)
Connector Type: -
Size / Dimension: 1.90" x 1.30" (48.3mm x 33.1mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

在庫5,808

ARM926EJ-S

-

400MHz

4MB (External)

32KB (Internal), 128MB (External)

-

1.90" x 1.30" (48.3mm x 33.1mm)

-40°C ~ 85°C

OSD32MP157F-512M-BAA

Octavo Systems LLC

SIP: 157F, 512MB, BAA

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

パッケージ: -

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

800MHz

-

512MB

302-BGA

0.710" L x 0.710" W (18.00mm x 18.00mm)

0°C ~ 85°C

FORLINX-FET1012A-C-10512MOE01IA11

Forlinx Embedded

NXP LS1012ASOM,512MB DDR3L 8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.0GHz
Flash Size: 8GB eMMC, 16Mb QSPI
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 80°C

パッケージ: -

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ARM® Cortex®-A53

-

1.0GHz

8GB eMMC, 16Mb QSPI

512MB

Board-to-Board (BTB) Socket - 160

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 80°C

FORLINX-FET6254-C-142GSE8GIB11

Forlinx Embedded

TI AM6254SOM,2GB DDR4, 8GB eMMC

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Co-Processor: -
Speed: 1.4GHz
Flash Size: 8GB eMMC
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 1.496" L x 2.360" W (38.00mm x 60.00mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

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ARM® Cortex®-A53, ARM® Cortex®-M4F

-

1.4GHz

8GB eMMC

2GB

Board-to-Board (BTB) 4 x 80 Pin

1.496" L x 2.360" W (38.00mm x 60.00mm)

-40°C ~ 85°C

AM0010-02-3BE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU3EG-1E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

パッケージ: -

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Zynq™ UltraScale+™ ZU3EG-1E

-

128MB

4GB

Board-to-Board (BTB) Socket

2.205" L x 1.575" W (56.00mm x 40.00mm)

0°C ~ 85°C

RK3328-SOM-2G

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.5GHz
Flash Size: -
RAM Size: 2GB
Connector Type: USB
Size / Dimension: -
Operating Temperature: -

パッケージ: -

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ARM® Cortex®-A53

-

1.5GHz

-

2GB

USB

-

TE0720-03-62I33FL

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

4GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0808-04-15-1EE-S

Trenz Electronic GmbH

IC MOD SOM MPSOC

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

パッケージ: -

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-

EC-VA-H264-8B-60-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

パッケージ: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0720-04-31C33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: 766MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

パッケージ: -

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ARM® Cortex®-A9

-

766MHz

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

DC-VA-H264-10B-60-4K-OPVIC-0000

System-On-Chip (SOC) Technologies Inc.

DECODER H264 4K VID/AUD 10BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

パッケージ: -

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-

5746-PX-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5746 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

パッケージ: -

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C

TE0630-02IV-DWS

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

パッケージ: -

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-