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組み込みーシステムオンチップ(SoC)

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在庫
数量
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
A2F060M3E-1CS288
Microsemi Corporation

IC FPGA 60K GATES 128KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
パッケージ: 288-TFBGA, CSPBGA
在庫128
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
10AS048E1F29I1HG
Altera

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
パッケージ: 780-BBGA, FCBGA
在庫441
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 480K Logic Elements
-40°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
10AS027E2F29I1HG
Altera

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
パッケージ: 780-BBGA, FCBGA
在庫258
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
-40°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
XCZU19EG-2FFVE1924E
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
パッケージ: 1924-BBGA, FCBGA
在庫153
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
0°C ~ 100°C (TJ)
1924-BBGA, FCBGA
1924-FCBGA (45x45)
XCZU9EG-2FFVC900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
パッケージ: 900-BBGA, FCBGA
在庫209
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 599K+ Logic Cells
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCZU7EG-2FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
パッケージ: 900-BBGA, FCBGA
在庫178
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 504K+ Logic Cells
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCZU4EV-3FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
パッケージ: 900-BBGA, FCBGA
在庫285
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 192K+ Logic Cells
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XC7Z045-L2FBG676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
パッケージ: 676-BBGA, FCBGA
在庫425
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex?-7 FPGA, 350K Logic Cells
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCZU5EV-1SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
パッケージ: 784-BBGA, FCBGA
在庫387
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 256K+ Logic Cells
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCZU4EV-1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
パッケージ: 784-BBGA, FCBGA
在庫325
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 192K+ Logic Cells
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCZU3CG-1SFVA625I
Xilinx Inc.

XCZU3CG-1SFVA625I

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
パッケージ: 625-BFBGA, FCBGA
在庫230
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 154K+ Logic Cells
-40°C ~ 100°C (TJ)
625-BFBGA, FCBGA
625-FCBGA (21x21)
M2S150-1FCG1152I
Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
パッケージ: 1152-BBGA, FCBGA
在庫330
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
M2S090-1FG676I
Microsemi Corporation

IC FPGA SOC 90K LUTS 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
パッケージ: 676-BGA
在庫411
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 90K Logic Modules
-40°C ~ 100°C (TJ)
676-BGA
676-FBGA (27x27)
XC7Z015-2CL485I
Xilinx Inc.

IC FPGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 766MHz
  • Primary Attributes: Artix?-7 FPGA, 74K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
パッケージ: 484-LFBGA, CSPBGA
在庫321
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
766MHz
Artix?-7 FPGA, 74K Logic Cells
-40°C ~ 100°C (TJ)
484-LFBGA, CSPBGA
484-CSPBGA (19x19)
XC7Z010-2CLG225E
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 225BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 766MHz
  • Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
パッケージ: 225-LFBGA, CSPBGA
在庫122
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
766MHz
Artix?-7 FPGA, 28K Logic Cells
0°C ~ 100°C (TJ)
225-LFBGA, CSPBGA
225-CSPBGA (13x13)
A2F500M3G-1FG256
Microsemi Corporation

IC FPGA 500K GATES 512KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
パッケージ: 256-LBGA
在庫116
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FPBGA (17x17)
M2S005S-1FGG484T2
Microsemi Corporation

IC FPGA SOC

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
パッケージ: 484-BGA
在庫310
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
-40°C ~ 125°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S005-1VFG400
Microsemi Corporation

IC FPGA SOC 5K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
パッケージ: 400-LFBGA
在庫480
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
XCZU9CG-2FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
パッケージ: 1156-BBGA, FCBGA
在庫290
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 599K+ Logic Cells
-40°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
BCM33843MVKFSBG
Broadcom Limited

CABLE MODEM

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
在庫486
-
-
-
-
-
-
-
-
-
-
1SX250LH2F55I2LG
Intel

2912-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
在庫171
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2500K Logic Elements
-40°C ~ 100°C (TJ)
-
-
5ASTFD5G3F35I5N
Intel

IC FPGA 350 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
パッケージ: 1152-BBGA, FCBGA
在庫312
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 462K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
10AS057N4F40I3LG
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
パッケージ: 1517-BBGA, FCBGA
在庫498
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
10AS066H3F34E2LG
Intel

IC SOC FPGA 492 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
パッケージ: 1152-BBGA, FCBGA
在庫303
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
0°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
10AS048K3F35E2LG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
在庫393
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 480K Logic Elements
0°C ~ 100°C (TJ)
-
-
10AS027E1F29E1HG
Intel

IC SOC FPGA 360 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
パッケージ: 780-BBGA, FCBGA
在庫187
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
0°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
10AS027H4F35I3SG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
パッケージ: -
在庫320
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 270K Logic Elements
-40°C ~ 100°C (TJ)
-
-
5CSXFC4C6U23A7N
Intel

IC FPGA 188 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 40K Logic Elements
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
パッケージ: 672-FBGA
在庫388
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
700MHz
FPGA - 40K Logic Elements
-40°C ~ 125°C (TJ)
672-FBGA
672-UBGA (23x23)
5CSXFC4C6U23C6N
Intel

IC FPGA 224 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 925MHz
  • Primary Attributes: FPGA - 40K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
パッケージ: 672-FBGA
在庫438
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
925MHz
FPGA - 40K Logic Elements
0°C ~ 85°C (TJ)
672-FBGA
672-UBGA (23x23)
5CSTFD5D5F31I7N
Intel

IC FPGA 288 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 85K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FBGA (31x31)
パッケージ: 896-BGA
在庫532
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 85K Logic Elements
-40°C ~ 100°C (TJ)
896-BGA
896-FBGA (31x31)