画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLIC 1CH P RV 32PLCC
|
パッケージ: 32-LCC (J-Lead) |
在庫5,216 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microsemi Corporation |
IC LINE DRIVER 2CH ADSL+ 24QFN
|
パッケージ: - |
在庫5,904 |
|
- | 2 | 10 V ~ 24 V, ±5 V ~ 12 V | - | - | - | - | - | 24-QFN |
||
Maxim Integrated |
IC LINE INTERFACE 5V T1/J1 PLCC
|
パッケージ: 28-LCC (J-Lead) |
在庫5,200 |
|
LIU | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 44TQFP
|
パッケージ: 44-LQFP |
在庫54,336 |
|
LIU | 1 | 4.75 V ~ 5.25 V | 180mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
Texas Instruments |
IC QUAD PHONE RELAY DRVR 14-SOIC
|
パッケージ: 14-SOIC (0.154", 3.90mm Width) |
在庫3,248 |
|
- | 4 | - | - | - | 0°C ~ 70°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Maxim Integrated |
IC LIU E1/T1/J1 4X 5V LONG144BGA
|
パッケージ: 144-BGA, CSPBGA |
在庫7,184 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-CSBGA (17x17) |
||
Microsemi Corporation |
IC TDM SWITCH 1024X1024 256BGA
|
パッケージ: 256-BGA |
在庫2,864 |
|
- | 1 | 1.71 V ~ 1.89 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC SLIC 1CH 63DB LGBAL 32PLCC
|
パッケージ: 32-LCC (J-Lead) |
在庫3,840 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
NXP |
SI TUNER FOR SINGLE DVB-T STB AP
|
パッケージ: - |
在庫5,856 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
DATA MODEM
|
パッケージ: - |
在庫5,264 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
DOCSIS EOC MAC
|
パッケージ: - |
在庫6,944 |
|
SFI | - | - | - | - | 0°C ~ 85°C (TJ) | - | - | - |
||
Microchip Technology |
40G VT/TU SWITCHING ELEMENT
|
パッケージ: - |
在庫6,288 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
パッケージ: 36-BSOP (0.295", 7.50mm Width) |
在庫2,224 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | 90mW | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA
|
パッケージ: 272-BGA |
在庫4,416 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC DGTL SWITCH ISO-CMOS 44PLCC
|
パッケージ: 44-LCC (J-Lead) |
在庫6,464 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
パッケージ: - |
在庫6,880 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68-QFN
|
パッケージ: 68-VFQFN Exposed Pad |
在庫7,356 |
|
GMII, MII, RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Broadcom Limited |
TRANSCEIVER
|
パッケージ: - |
Request a Quote |
|
Serial | 8 | - | - | - | - | - | - | - |
||
Broadcom Limited |
212, BONDED 106, V/ADSL, 10G GW,
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ITU CO/PABX SLIC
|
パッケージ: - |
Request a Quote |
|
- | 1 | 4.75V ~ 5.25V | - | 1.5 W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
LSSGR/TR57 CO/LOOP CARRIER SLIC
|
パッケージ: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.8mA | - | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Microchip Technology |
Freedm84A1024L, High Density HDL
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
12X10GE/48GE+8X10GE
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON HGU
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MGIG CAPABLE ENTERPRISE SWITCH W
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
INFINEON PMB7860V1.1E TELECOM IC
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
パッケージ: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 10.8V ~ 13.2V | - | 580 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Broadcom Limited |
RANGER+ 20 X 10GE
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
INTEGRATED GBE MOBILE MAC/PHY
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |