画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
IC SW CTRLR TANTOS-3G LFBGA-225
|
パッケージ: 225-LFBGA |
在庫5,888 |
|
TX / FX | 1 | 3.3V | - | - | - | Surface Mount | 225-LFBGA | PG-LFBGA-225 |
|
|
Silicon Labs |
IC SLIC PROG DUAL-CH 64TQFP
|
パッケージ: 64-TQFP |
在庫5,424 |
|
ISDN | 2 | 3.13 V ~ 3.47 V | 28mA | 280mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
|
|
Cirrus Logic Inc. |
IC LIU T1/E1 28PLCC
|
パッケージ: 28-LCC (J-Lead) |
在庫5,104 |
|
E1, T1 | 1 | 4.75 V ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
|
|
Exar Corporation |
IC LIU E1 QUAD 68PLCC
|
パッケージ: 68-LCC (J-Lead) |
在庫6,368 |
|
LIU | - | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
|
|
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
パッケージ: 256-LBGA Exposed Pad |
在庫7,376 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
|
|
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
パッケージ: 256-LBGA Exposed Pad |
在庫9,588 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
|
|
Silicon Labs |
IC ISOMOD LINE-SIDE DAA 16TSSOP
|
パッケージ: 16-TSSOP (0.173", 4.40mm Width) |
在庫14,544 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
|
|
IXYS Integrated Circuits Division |
IC RECEIVER DTMF CMOS LP 18-SOIC
|
パッケージ: 18-SOIC (0.295", 7.50mm Width) |
在庫6,592 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | 35mW | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
|
|
|
IXYS Integrated Circuits Division |
IC MOD PHONE LINE HALF 1.07" PCB
|
パッケージ: 18-DIP Module (0.850", 21.59mm), 9 Leads |
在庫3,552 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
|
|
Maxim Integrated |
IC TRANSCEIVER T1 40-DIP
|
パッケージ: 40-DIP (0.600", 15.24mm) |
在庫6,864 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
|
|
|
IXYS Integrated Circuits Division |
IC MOD PHONE LINE WIRE 1.07" PCB
|
パッケージ: 18-DIP Module (0.850", 21.59mm), 9 Leads |
在庫5,152 |
|
- | 1 | 5V | 5mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
|
|
|
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
パッケージ: 32-LCC (J-Lead) |
在庫66,324 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
|
|
|
Microsemi Corporation |
IC ABS VOICEPORT 2CH FXS 64QFN
|
パッケージ: 64-VFQFN Exposed Pad |
在庫7,856 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
|
|
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
パッケージ: 38-VFQFN Exposed Pad |
在庫87,912 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
|
|
Microsemi Corporation |
IC ECHO CANCELLER DUAL 28PLCC
|
パッケージ: 28-LCC (J-Lead) |
在庫7,504 |
|
Serial | 2 | 4.5 V ~ 5.5 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
|
|
|
Microsemi Solutions Sdn Bhd. |
QUAD 10/100/1000BASE-T & 100BASE
|
パッケージ: - |
在庫5,424 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
|
|
Texas Instruments |
IC TONE DECODR PHAS LOC LP 8SOIC
|
パッケージ: 8-SOIC (0.154", 3.90mm Width) |
在庫13,872 |
|
- | 1 | 4.75 V ~ 9 V | 12mA | 1.10W | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Microchip Technology |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F
|
パッケージ: - |
在庫5,696 |
|
- | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
QFN48, GREEN, IND, MRLB, NO FLAS
|
パッケージ: 48-VFQFN Exposed Pad |
在庫29,424 |
|
SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
|
|
|
Broadcom Limited |
MULTI LAYER SWITCH - 1588 DISA
|
パッケージ: - |
在庫6,176 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
パッケージ: 18-SOIC (0.295", 7.50mm Width) |
在庫5,456 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
|
|
|
Microchip Technology |
IC SYNCHRONIZER T1/E1 48SSOP
|
パッケージ: 48-BSSOP (0.295", 7.50mm Width) |
在庫3,280 |
|
T1 | 1 | 3V ~ 3.6V | 1.8mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
|
|
|
Broadcom Limited |
VDSL 24-LINE 35B DSP
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
200G ENTERPRISE ETHERNET SWITCH
|
パッケージ: - |
在庫57 |
|
SPI | - | - | - | - | 0°C ~ 105°C | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
|
|
|
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Infineon Technologies |
TELEPHONY INTERFACE CIRCUIT
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Broadcom Limited |
8P VDSL 35B AFE
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Infineon Technologies |
INCA-IP SOLUTION
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | Surface Mount | 324-LBGA | PG-LBGA-324-3 |
