画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 2GBIT 400MHZ 168FBGA
|
パッケージ: 168-WFBGA |
在庫3,152 |
|
DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-FBGA (12x12) |
||
Microchip Technology |
IC FLASH 16MBIT 85MHZ 8SOIC
|
パッケージ: 8-SOIC (0.209", 5.30mm Width) |
在庫2,243,892 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 85MHz | 8µs, 6ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
STMicroelectronics |
IC EEPROM 128KBIT 400KHZ 8WLCSP
|
パッケージ: 8-UFBGA |
在庫5,776 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA | 8-WLCSP (1.785x1.38) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 144TQFP
|
パッケージ: 144-LQFP Exposed Pad |
在庫2,304 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (256K x 18) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Microchip Technology |
IC EEPROM 256KBIT 20MHZ 8SOIC
|
パッケージ: 8-SOIC (0.154", 3.90mm Width) |
在庫19,788 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 20MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 55NS 68PGA
|
パッケージ: 68-BPGA |
在庫6,496 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 68-BPGA | 68-PGA (29.46x29.46) |
||
Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
|
パッケージ: - |
在庫3,856 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC SDRAM 1GBIT 200MHZ 90VFBGA
|
パッケージ: 90-TFBGA |
在庫7,200 |
|
DRAM | SDRAM - Mobile LPDDR | 1Gb (32M x 32) | Parallel | 200MHz | 15ns | 5ns | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | Surface Mount | 90-TFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8CSP
|
パッケージ: 8-UFBGA, CSPBGA |
在庫4,544 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DFN
|
パッケージ: 8-VDFN Exposed Pad |
在庫5,952 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8MSOP
|
パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
在庫7,632 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.5 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8TDFN
|
パッケージ: 8-WFDFN Exposed Pad |
在庫6,192 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K SPI 2MHZ WAFER
|
パッケージ: Die |
在庫5,184 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC 1 GB FLASH MEMORY
|
パッケージ: - |
在庫7,120 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 64BGA
|
パッケージ: 64-LBGA |
在庫6,080 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 64BGA
|
パッケージ: 64-LBGA |
在庫7,952 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | Parallel | - | 110ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Winbond Electronics |
IC DRAM 2G PARALLEL 667MHZ
|
パッケージ: 78-VFBGA |
在庫7,824 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 667MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Micron Technology Inc. |
LPDDR4 64G 1GX64 FBGA 8DP
|
パッケージ: - |
在庫5,328 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 64G 2133MHZ FBGA
|
パッケージ: - |
在庫7,968 |
|
DRAM | SDRAM - Mobile LPDDR4 | 64Gb (2G x 32) | - | 2133MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 52PLCC
|
パッケージ: 52-LCC (J-Lead) |
在庫4,432 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC FLASH 1G PARALLEL 64LBGA
|
パッケージ: 64-LBGA |
在庫4,224 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8, 64M x 16) | Parallel | - | 60ns | 105ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-LBGA (11x13) |
||
onsemi |
IC EEPROM 1KBIT MICROWIRE 8SOIC
|
パッケージ: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | Microwire | 2 MHz | - | 250 ns | 2.5V ~ 6V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Silicon Motion, Inc. |
IC FLASH 80GBIT EMMC 153BGA
|
パッケージ: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 80Gbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 153-TBGA | 153-BGA (11.5x13) |
||
Infineon Technologies |
IC PSRAM 64MBIT SPI/OCTAL 24FBGA
|
パッケージ: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mbit | SPI - Octal I/O | 166 MHz | 36ns | 36 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
Renesas Electronics Corporation |
IC FLASH 16MBIT SPI/QUAD WAFER
|
パッケージ: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 104 MHz | 5µs, 5ms | - | 2.5V ~ 3.6V | -40°C ~ 85°C (TC) | Surface Mount | Die | Wafer |
||
Infineon Technologies |
IC
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 8GBIT PARALLEL 96FBGA
|
パッケージ: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 8Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (13.5x9) |
||
Micron Technology Inc. |
EMMC 512G LFBGA
|
パッケージ: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |