ページ 124 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
GCIXP1200GA	Intel	IC MPU STRONGARM 166MHZ 432BGA Core Processor: StrongARM Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: Data; Microengine RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 432-LBGA Supplier Device Package: 432-BGA (40x40)	パッケージ: 432-LBGA	在庫9,108
EPC4QI100	Intel	IC CONFIG DEVICE 4MBIT 100QFP Programmable Type: In System Programmable Memory Size: 4MB Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	パッケージ: 100-BQFP	在庫6,960
HC1S40F780NAF	Intel	IC FPGA APEX 780FBGA Number of LABs/CLBs: 4125 Number of Logic Elements/Cells: 41250 Total RAM Bits: 2244096 Number of I/O: 613 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫6,048
EP20K1000CF33C7N	Intel	IC FPGA APEX 20KC 1020-FBGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 327680 Number of I/O: 708 Number of Gates: 1772000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	パッケージ: 1020-BBGA	在庫6,304
EPF10K200SBC356-2X	Intel	IC FPGA 274 I/O 356BGA Number of LABs/CLBs: 1248 Number of Logic Elements/Cells: 9984 Total RAM Bits: 98304 Number of I/O: 274 Number of Gates: 513000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	パッケージ: 356-LBGA	在庫3,184
EP4SE530H40C3ES	Intel	IC FPGA 976 I/O 1517HBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (42.5x42.5)	パッケージ: 1517-BBGA, FCBGA	在庫4,560
EP3SE80F780I4LN	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 3200 Number of Logic Elements/Cells: 80000 Total RAM Bits: 6843392 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫4,176
5SGXMABK3H40I3LN	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	パッケージ: 1517-BBGA, FCBGA	在庫3,792
EP2AGX260FF35C6	Intel	IC FPGA 612 I/O 1152FBGA Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Total RAM Bits: 12038144 Number of I/O: 612 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫2,848
5AGXBB1D6F31C6N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	パッケージ: 896-BBGA, FCBGA	在庫6,224
5CGTFD7D5F31C7N	Intel	IC FPGA 480 I/O 896FBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	パッケージ: 896-BGA	在庫3,968
EP3C10E144I7N	Intel	IC FPGA 94 I/O 144EQFP Number of LABs/CLBs: 645 Number of Logic Elements/Cells: 10320 Total RAM Bits: 423936 Number of I/O: 94 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	パッケージ: 144-LQFP Exposed Pad	在庫11,928
5SGXEB5R3F43I4G	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	パッケージ: -	Request a Quote
5SGSMD5H2F35C2G	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 39936000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
5AGZME1E2H29I3LG	Intel	IC FPGA 342 I/O 780HBGA Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Total RAM Bits: 15282176 Number of I/O: 342 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: -	Request a Quote
AGFB012R24C3E3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
AGFA014R24C2E3VAA	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
TS80L188EC13	Intel	IC MPU I186 13MHZ 100SQFP Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 13MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 100-QFP Supplier Device Package: 100-SQFP	パッケージ: -	Request a Quote
1SG040HH3F35I3VG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 378000 Total RAM Bits: 31457280 Number of I/O: 374 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
5SGXMA5N2F45I3WN	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: -	Request a Quote
AGFB022R24C2E1V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGSMD4H3F35C3WN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 19456000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
EP4SGX360HF35C4G	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
RH80530GZ866512	Intel	IC MPU INTEL 866MHZ 478PPGA Core Processor: Mobile Intel® Pentium® III Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 866MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V Operating Temperature: 100°C (TJ) Security Features: - Package / Case: 478-PGA Supplier Device Package: 478-PPGA (35x35)	パッケージ: -	Request a Quote
R82061	Intel	ERROR DETECTION AND CORRECTION U Logic Type: Error Detection and Correction Supply Voltage: 4.5V ~ 5.5V Number of Bits: 16 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 68-CLCC Supplier Device Package: 68-CLCC	パッケージ: -	Request a Quote
AGFD023R31C2E4X	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	パッケージ: -	Request a Quote
A5ED065BB32AE5SR0	Intel	IC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MD2148H3	Intel	IC SRAM 4KBIT PARALLEL 18CDIP Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Asynchronous Memory Size: 4Kbit Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: 55ns Access Time: 55 ns Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Through Hole Package / Case: 18-CDIP Supplier Device Package: 18-CDIP	パッケージ: -	Request a Quote

GCIXP1200GA

Intel

IC MPU STRONGARM 166MHZ 432BGA

Core Processor: StrongARM
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 166MHz
Co-Processors/DSP: Data; Microengine
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 432-LBGA
Supplier Device Package: 432-BGA (40x40)

パッケージ: 432-LBGA

在庫9,108

EPC4QI100

Intel

IC CONFIG DEVICE 4MBIT 100QFP

Programmable Type: In System Programmable
Memory Size: 4MB
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

パッケージ: 100-BQFP

在庫6,960

HC1S40F780NAF

Intel

IC FPGA APEX 780FBGA

Number of LABs/CLBs: 4125
Number of Logic Elements/Cells: 41250
Total RAM Bits: 2244096
Number of I/O: 613
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫6,048

EP20K1000CF33C7N

Intel

IC FPGA APEX 20KC 1020-FBGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 327680
Number of I/O: 708
Number of Gates: 1772000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

パッケージ: 1020-BBGA

在庫6,304

EPF10K200SBC356-2X

Intel

IC FPGA 274 I/O 356BGA

Number of LABs/CLBs: 1248
Number of Logic Elements/Cells: 9984
Total RAM Bits: 98304
Number of I/O: 274
Number of Gates: 513000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 356-LBGA
Supplier Device Package: 356-BGA (35x35)

パッケージ: 356-LBGA

在庫3,184

EP4SE530H40C3ES

Intel

IC FPGA 976 I/O 1517HBGA

Number of LABs/CLBs: 21248
Number of Logic Elements/Cells: 531200
Total RAM Bits: 28033024
Number of I/O: 976
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (42.5x42.5)

パッケージ: 1517-BBGA, FCBGA

在庫4,560

EP3SE80F780I4LN

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 3200
Number of Logic Elements/Cells: 80000
Total RAM Bits: 6843392
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫4,176

5SGXMABK3H40I3LN

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

パッケージ: 1517-BBGA, FCBGA

在庫3,792

EP2AGX260FF35C6

Intel

IC FPGA 612 I/O 1152FBGA

Number of LABs/CLBs: 10260
Number of Logic Elements/Cells: 244188
Total RAM Bits: 12038144
Number of I/O: 612
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫2,848

5AGXBB1D6F31C6N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

パッケージ: 896-BBGA, FCBGA

在庫6,224

5CGTFD7D5F31C7N

Intel

IC FPGA 480 I/O 896FBGA

Number of LABs/CLBs: 56480
Number of Logic Elements/Cells: 149500
Total RAM Bits: 7880704
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

パッケージ: 896-BGA

在庫3,968

EP3C10E144I7N

Intel

IC FPGA 94 I/O 144EQFP

Number of LABs/CLBs: 645
Number of Logic Elements/Cells: 10320
Total RAM Bits: 423936
Number of I/O: 94
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

パッケージ: 144-LQFP Exposed Pad

在庫11,928

5SGXEB5R3F43I4G

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 41984000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

パッケージ: -

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5SGSMD5H2F35C2G

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 39936000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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5AGZME1E2H29I3LG

Intel

IC FPGA 342 I/O 780HBGA

Number of LABs/CLBs: 10377
Number of Logic Elements/Cells: 220000
Total RAM Bits: 15282176
Number of I/O: 342
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

パッケージ: -

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AGFB012R24C3E3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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AGFA014R24C2E3VAA

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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TS80L188EC13

Intel

IC MPU I186 13MHZ 100SQFP

Core Processor: 80C186
Number of Cores/Bus Width: 1 Core, 16-Bit
Speed: 13MHz
Co-Processors/DSP: -
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 100-QFP
Supplier Device Package: 100-SQFP

パッケージ: -

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1SG040HH3F35I3VG

Intel

IC FPGA STRATIX10GX 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 378000
Total RAM Bits: 31457280
Number of I/O: 374
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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5SGXMA5N2F45I3WN

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: -

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AGFB022R24C2E1V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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5SGSMD4H3F35C3WN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 19456000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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EP4SGX360HF35C4G

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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RH80530GZ866512

Intel

IC MPU INTEL 866MHZ 478PPGA

Core Processor: Mobile Intel® Pentium® III Processor
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 866MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V
Operating Temperature: 100°C (TJ)
Security Features: -
Package / Case: 478-PGA
Supplier Device Package: 478-PPGA (35x35)

パッケージ: -

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R82061

Intel

ERROR DETECTION AND CORRECTION U

Logic Type: Error Detection and Correction
Supply Voltage: 4.5V ~ 5.5V
Number of Bits: 16
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 68-CLCC
Supplier Device Package: 68-CLCC

パッケージ: -

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AGFD023R31C2E4X

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

パッケージ: -

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A5ED065BB32AE5SR0

Intel

IC

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MD2148H3

Intel

IC SRAM 4KBIT PARALLEL 18CDIP

Memory Type: Volatile
Memory Format: SRAM
Technology: SRAM - Asynchronous
Memory Size: 4Kbit
Memory Interface: Parallel
Clock Frequency: -
Write Cycle Time - Word, Page: 55ns
Access Time: 55 ns
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TC)
Mounting Type: Through Hole
Package / Case: 18-CDIP
Supplier Device Package: 18-CDIP

パッケージ: -

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