ページ 164 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
5CSXFC2C6U23I7LN	Intel	672-PIN UBGA Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,120
EPXA1F484C1ES	Intel	IC EXCALIBUR ARM 484FBGA Core Type: 32-Bit ARM9 Speed: 266MHz Interface: EBI/EMI, UART/USART Program SRAM Bytes: 32K FPGA SRAM: - EEPROM Size: - Data SRAM Bytes: 16K FPGA Core Cells: 4160 FPGA Gates: 100K FPGA Registers: - Voltage - Supply: 1.8V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA	在庫5,728
EP20K60ETC144-1	Intel	IC FPGA 92 I/O 144TQFP Number of LABs/CLBs: 2560 Number of Logic Elements/Cells: 2560 Total RAM Bits: 32768 Number of I/O: 92 Number of Gates: 162000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: 144-LQFP	在庫6,560
EP1K10QC208-3	Intel	IC FPGA 120 I/O 208QFP Number of LABs/CLBs: 72 Number of Logic Elements/Cells: 576 Total RAM Bits: 12288 Number of I/O: 120 Number of Gates: 56000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	パッケージ: 208-BFQFP	在庫7,408
EP3SL200H780C4L	Intel	IC FPGA 488 I/O 780HBGA Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 200000 Total RAM Bits: 10901504 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: 780-BBGA, FCBGA	在庫2,672
5SGXEA7H3F35C2LN	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫7,280
10AX027H3F34I2SG	Intel	1152-PIN FBGA Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Total RAM Bits: 17870848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫5,920
EP3SL70F780I4	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 2700 Number of Logic Elements/Cells: 67500 Total RAM Bits: 2699264 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫4,048
EP2SGX30DF780C3N	Intel	IC FPGA 361 I/O 780FBGA Number of LABs/CLBs: 1694 Number of Logic Elements/Cells: 33880 Total RAM Bits: 1369728 Number of I/O: 361 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA	在庫3,376
EP3SL50F780I4N	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫2,640
EP3C25F256C7	Intel	IC FPGA 156 I/O 256FBGA Number of LABs/CLBs: 1539 Number of Logic Elements/Cells: 24624 Total RAM Bits: 608256 Number of I/O: 156 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-LBGA	在庫6,800
EP4CGX22CF19C8	Intel	IC FPGA 150 I/O 324FBGA Number of LABs/CLBs: 1330 Number of Logic Elements/Cells: 21280 Total RAM Bits: 774144 Number of I/O: 150 Number of Gates: - Voltage - Supply: 1.16 V ~ 1.24 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LBGA Supplier Device Package: 324-FBGA (19x19)	パッケージ: 324-LBGA	在庫5,104
EPM7128SQC160-10	Intel	IC CPLD 128MC 10NS 160QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 100 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	パッケージ: 160-BQFP	在庫6,960
EPM570T144C4N	Intel	IC CPLD 440MC 5.4NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 116 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: 144-LQFP	在庫7,404
5AGXF35I3NAC	Intel	IC FPGA FLIPCHIP Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,616
EP4SGX110HF35C2G	Intel	IC FPGA 488 I/O 1152FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,464
5SGXMA4H3F35I3G	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
AGFC019R24C2E2VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	パッケージ: -	Request a Quote
AGFB012R24C2I2V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXMBBR2H40I2N	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	パッケージ: -	Request a Quote
5SGXMA3H1F35C2WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
AGFD019R24C3E3V	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	パッケージ: -	Request a Quote
FAGD1652248BA	Intel	CLOCK RECOVERY CIRCUIT, 1-FUNC PLL: Yes Main Purpose: Gigabit Ethernet, SONET/SDH, STM Input: CML, LVTTL Output: Clock, CML Number of Circuits: 1 Ratio - Input:Output: 4:7 Differential - Input:Output: Yes/Yes Frequency - Max: 2.488GHz Voltage - Supply: 2.97V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-TQFP-EDQUAD (7x7)	パッケージ: -	Request a Quote
1SG280HU3F50E2LG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	パッケージ: -	Request a Quote
1SG210HU1F50E2VGAS	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	パッケージ: -	Request a Quote
5AGZME7K2F40I3LG	Intel	IC FPGA 674 I/O 1517FBGA Number of LABs/CLBs: 21225 Number of Logic Elements/Cells: 450000 Total RAM Bits: 40249344 Number of I/O: 674 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
AGFA006R24C2E4F	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 573K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXEA7H1F35I2G	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote

5CSXFC2C6U23I7LN

Intel

672-PIN UBGA

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,120

EPXA1F484C1ES

Intel

IC EXCALIBUR ARM 484FBGA

Core Type: 32-Bit ARM9
Speed: 266MHz
Interface: EBI/EMI, UART/USART
Program SRAM Bytes: 32K
FPGA SRAM: -
EEPROM Size: -
Data SRAM Bytes: 16K
FPGA Core Cells: 4160
FPGA Gates: 100K
FPGA Registers: -
Voltage - Supply: 1.8V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA

在庫5,728

EP20K60ETC144-1

Intel

IC FPGA 92 I/O 144TQFP

Number of LABs/CLBs: 2560
Number of Logic Elements/Cells: 2560
Total RAM Bits: 32768
Number of I/O: 92
Number of Gates: 162000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

在庫6,560

EP1K10QC208-3

Intel

IC FPGA 120 I/O 208QFP

Number of LABs/CLBs: 72
Number of Logic Elements/Cells: 576
Total RAM Bits: 12288
Number of I/O: 120
Number of Gates: 56000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

パッケージ: 208-BFQFP

在庫7,408

EP3SL200H780C4L

Intel

IC FPGA 488 I/O 780HBGA

Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 200000
Total RAM Bits: 10901504
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

パッケージ: 780-BBGA, FCBGA

在庫2,672

5SGXEA7H3F35C2LN

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫7,280

10AX027H3F34I2SG

Intel

1152-PIN FBGA

Number of LABs/CLBs: 101620
Number of Logic Elements/Cells: 270000
Total RAM Bits: 17870848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫5,920

EP3SL70F780I4

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 2700
Number of Logic Elements/Cells: 67500
Total RAM Bits: 2699264
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫4,048

EP2SGX30DF780C3N

Intel

IC FPGA 361 I/O 780FBGA

Number of LABs/CLBs: 1694
Number of Logic Elements/Cells: 33880
Total RAM Bits: 1369728
Number of I/O: 361
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA

在庫3,376

EP3SL50F780I4N

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫2,640

EP3C25F256C7

Intel

IC FPGA 156 I/O 256FBGA

Number of LABs/CLBs: 1539
Number of Logic Elements/Cells: 24624
Total RAM Bits: 608256
Number of I/O: 156
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-LBGA

在庫6,800

EP4CGX22CF19C8

Intel

IC FPGA 150 I/O 324FBGA

Number of LABs/CLBs: 1330
Number of Logic Elements/Cells: 21280
Total RAM Bits: 774144
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 1.16 V ~ 1.24 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LBGA
Supplier Device Package: 324-FBGA (19x19)

パッケージ: 324-LBGA

在庫5,104

EPM7128SQC160-10

Intel

IC CPLD 128MC 10NS 160QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 100
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

パッケージ: 160-BQFP

在庫6,960

EPM570T144C4N

Intel

IC CPLD 440MC 5.4NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 116
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

在庫7,404

5AGXF35I3NAC

Intel

IC FPGA FLIPCHIP

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,616

EP4SGX110HF35C2G

Intel

IC FPGA 488 I/O 1152FBGA

Number of LABs/CLBs: 4224
Number of Logic Elements/Cells: 105600
Total RAM Bits: 9793536
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,464

5SGXMA4H3F35I3G

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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AGFC019R24C2E2VB

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

パッケージ: -

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AGFB012R24C2I2V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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5SGXMBBR2H40I2N

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

パッケージ: -

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5SGXMA3H1F35C2WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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AGFD019R24C3E3V

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

パッケージ: -

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FAGD1652248BA

Intel

CLOCK RECOVERY CIRCUIT, 1-FUNC

PLL: Yes
Main Purpose: Gigabit Ethernet, SONET/SDH, STM
Input: CML, LVTTL
Output: Clock, CML
Number of Circuits: 1
Ratio - Input:Output: 4:7
Differential - Input:Output: Yes/Yes
Frequency - Max: 2.488GHz
Voltage - Supply: 2.97V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TC)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-TQFP-EDQUAD (7x7)

パッケージ: -

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1SG280HU3F50E2LG

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

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1SG210HU1F50E2VGAS

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 262500
Number of Logic Elements/Cells: 2100000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

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5AGZME7K2F40I3LG

Intel

IC FPGA 674 I/O 1517FBGA

Number of LABs/CLBs: 21225
Number of Logic Elements/Cells: 450000
Total RAM Bits: 40249344
Number of I/O: 674
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

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AGFA006R24C2E4F

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 573K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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5SGXEA7H1F35I2G

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

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