ページ 215 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
5CSEBA2U23C8N	Intel	IC FPGA 188 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	パッケージ: 672-FBGA	在庫5,472
EPC1PC8CC	Intel	IC CONFIG DEVICE Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫4,000
EPC16UC88SS	Intel	IC CONFIG DEVICE Programmable Type: In System Programmable Memory Size: 16Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 88-LFBGA Supplier Device Package: 88-UBGA (11x8)	パッケージ: 88-LFBGA	在庫2,912
EP4SE530F43C4ES	Intel	IC FPGA 1120 I/O 1760FBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 1120 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	パッケージ: 1760-BBGA, FCBGA	在庫6,368
EP1C6Q240C6	Intel	IC FPGA 185 I/O 240QFP Number of LABs/CLBs: 598 Number of Logic Elements/Cells: 5980 Total RAM Bits: 92160 Number of I/O: 185 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	パッケージ: 240-BFQFP	在庫60,000
EP3SE260H780I3	Intel	IC FPGA 488 I/O 780HBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: 780-BBGA, FCBGA	在庫4,640
5SGXEA7K3F35C3N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫2,304
EP3SE110F780C3N	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 4300 Number of Logic Elements/Cells: 107500 Total RAM Bits: 8936448 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫7,376
10AX090H4F34E3SG	Intel	IC FPGA 504 I/O 1152FCBGA Number of LABs/CLBs: 339620 Number of Logic Elements/Cells: 900000 Total RAM Bits: 59234304 Number of I/O: 504 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫3,872
10AX027H2F34I2LG	Intel	1152-PIN FBGA Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Total RAM Bits: 17870848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫6,816
10AX048E3F29E2SG	Intel	780-PIN FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫5,952
EP1AGX90EF1152I6	Intel	IC FPGA 538 I/O 1152FBGA Number of LABs/CLBs: 4511 Number of Logic Elements/Cells: 90220 Total RAM Bits: 4477824 Number of I/O: 538 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,800
EP2C35U484C8	Intel	IC FPGA 322 I/O 484UBGA Number of LABs/CLBs: 2076 Number of Logic Elements/Cells: 33216 Total RAM Bits: 483840 Number of I/O: 322 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	パッケージ: 484-FBGA	在庫7,568
10CX085YU484E5G	Intel	484-PIN UBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,704
EPM7256SQC208-12	Intel	IC CPLD 256MC 12NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	パッケージ: 208-BFQFP	在庫3,632
EPM570GT100C3N	Intel	IC CPLD 440MC 5.4NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 76 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	パッケージ: 100-TQFP	在庫5,632
5AGXFB3H4F35C5G	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫6,448
5SGXEB5R3F40C2G	Intel	IC FPGA 432 I/O 1517FCBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
5SGXEB5R3F43C4G	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	パッケージ: -	Request a Quote
5SGXMA7H1F35C1G	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
EWIXP460BAD	Intel	IC MPU INTEL 533MHZ PBGA544 Core Processor: Intel® IXP45X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: Mll (3), SMII (3) SATA: - USB: USB 1.1 (1), USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Package / Case: 544-BBGA Supplier Device Package: 544-PBGA (35x35)	パッケージ: -	Request a Quote
AGFB012R24C2E3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
1SG040HH3F35E1VG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 378000 Total RAM Bits: 31457280 Number of I/O: 374 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
5SGXMB6R2F40I2G	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
5SGSMD4K1F40I2WN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 19456000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
5SGXMABN3F45I3G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: -	Request a Quote
D3232	Intel	IC MULTIPLEXER 24CDIP Type: Multiplexer Applications: - Mounting Type: Through Hole Package / Case: 24-CDIP Supplier Device Package: 24-CDIP	パッケージ: -	Request a Quote
RB80526RX566128	Intel	IC MPU 1 566MHZ 370PPGA Core Processor: Intel® Celeron® Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 566MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.7V, 1.75V Operating Temperature: 90°C (TC) Security Features: - Package / Case: 370-PGA Supplier Device Package: 370-PPGA (49x49)	パッケージ: -	Request a Quote
AGFA014R24C2I3E	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXMA4K3F35I4WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote

5CSEBA2U23C8N

Intel

IC FPGA 188 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz
Primary Attributes: FPGA - 25K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

パッケージ: 672-FBGA

在庫5,472

EPC1PC8CC

Intel

IC CONFIG DEVICE

Programmable Type: OTP
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫4,000

EPC16UC88SS

Intel

IC CONFIG DEVICE

Programmable Type: In System Programmable
Memory Size: 16Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 88-LFBGA
Supplier Device Package: 88-UBGA (11x8)

パッケージ: 88-LFBGA

在庫2,912

EP4SE530F43C4ES

Intel

IC FPGA 1120 I/O 1760FBGA

Number of LABs/CLBs: 21248
Number of Logic Elements/Cells: 531200
Total RAM Bits: 28033024
Number of I/O: 1120
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

パッケージ: 1760-BBGA, FCBGA

在庫6,368

EP1C6Q240C6

Intel

IC FPGA 185 I/O 240QFP

Number of LABs/CLBs: 598
Number of Logic Elements/Cells: 5980
Total RAM Bits: 92160
Number of I/O: 185
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

パッケージ: 240-BFQFP

在庫60,000

EP3SE260H780I3

Intel

IC FPGA 488 I/O 780HBGA

Number of LABs/CLBs: 10200
Number of Logic Elements/Cells: 255000
Total RAM Bits: 16672768
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

パッケージ: 780-BBGA, FCBGA

在庫4,640

5SGXEA7K3F35C3N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫2,304

EP3SE110F780C3N

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 8936448
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫7,376

10AX090H4F34E3SG

Intel

IC FPGA 504 I/O 1152FCBGA

Number of LABs/CLBs: 339620
Number of Logic Elements/Cells: 900000
Total RAM Bits: 59234304
Number of I/O: 504
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫3,872

10AX027H2F34I2LG

Intel

1152-PIN FBGA

Number of LABs/CLBs: 101620
Number of Logic Elements/Cells: 270000
Total RAM Bits: 17870848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫6,816

10AX048E3F29E2SG

Intel

780-PIN FBGA

Number of LABs/CLBs: 183590
Number of Logic Elements/Cells: 480000
Total RAM Bits: 5664768
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫5,952

EP1AGX90EF1152I6

Intel

IC FPGA 538 I/O 1152FBGA

Number of LABs/CLBs: 4511
Number of Logic Elements/Cells: 90220
Total RAM Bits: 4477824
Number of I/O: 538
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,800

EP2C35U484C8

Intel

IC FPGA 322 I/O 484UBGA

Number of LABs/CLBs: 2076
Number of Logic Elements/Cells: 33216
Total RAM Bits: 483840
Number of I/O: 322
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

パッケージ: 484-FBGA

在庫7,568

10CX085YU484E5G

Intel

484-PIN UBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,704

EPM7256SQC208-12

Intel

IC CPLD 256MC 12NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 12.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

パッケージ: 208-BFQFP

在庫3,632

EPM570GT100C3N

Intel

IC CPLD 440MC 5.4NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 76
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

パッケージ: 100-TQFP

在庫5,632

5AGXFB3H4F35C5G

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫6,448

5SGXEB5R3F40C2G

Intel

IC FPGA 432 I/O 1517FCBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 41984000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-FBGA (40x40)
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: -

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5SGXEB5R3F43C4G

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 41984000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

パッケージ: -

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5SGXMA7H1F35C1G

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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EWIXP460BAD

Intel

IC MPU INTEL 533MHZ PBGA544

Core Processor: Intel® IXP45X
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: Mll (3), SMII (3)
SATA: -
USB: USB 1.1 (1), USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
Package / Case: 544-BBGA
Supplier Device Package: 544-PBGA (35x35)

パッケージ: -

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AGFB012R24C2E3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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1SG040HH3F35E1VG

Intel

IC FPGA STRATIX10GX 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 378000
Total RAM Bits: 31457280
Number of I/O: 374
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

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5SGXMB6R2F40I2G

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-FBGA (40x40)
Supplier Device Package: 1517-FBGA (40x40)

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5SGSMD4K1F40I2WN

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 19456000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

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5SGXMABN3F45I3G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

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D3232

Intel

IC MULTIPLEXER 24CDIP

Type: Multiplexer
Applications: -
Mounting Type: Through Hole
Package / Case: 24-CDIP
Supplier Device Package: 24-CDIP

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RB80526RX566128

Intel

IC MPU 1 566MHZ 370PPGA

Core Processor: Intel® Celeron®
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 566MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.7V, 1.75V
Operating Temperature: 90°C (TC)
Security Features: -
Package / Case: 370-PGA
Supplier Device Package: 370-PPGA (49x49)

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AGFA014R24C2I3E

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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5SGXMA4K3F35I4WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

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