ページ 269 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
10AS048K1F35E1SG	Intel	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,448
10AS016E4F29I3SG	Intel	IC SOC FPGA 288 I/O 780FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 160K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫5,344
EPC1PC8	Intel	IC CONFIG DEVICE 1MBIT 8DIP Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	パッケージ: 8-DIP (0.300", 7.62mm)	在庫324,000
EP20K200CB652C7ES	Intel	IC FPGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: - Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 652-BBGA Supplier Device Package: 652-BGA (45x45)	パッケージ: 652-BBGA	在庫6,000
EP20K1000CF672C8ES	Intel	IC FPGA Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 38400 Total RAM Bits: 327680 Number of I/O: 508 Number of Gates: 1772000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA, FCBGA	在庫4,800
10AX066K3F35I3SGES	Intel	IC FPGA 396 I/O 1152FCBGA Number of LABs/CLBs: 250540 Number of Logic Elements/Cells: 660000 Total RAM Bits: 49610752 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫2,400
EP1K30TC144-1N	Intel	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 24576 Number of I/O: 102 Number of Gates: 119000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: 144-LQFP	在庫5,776
EP3SE260F1517C3	Intel	IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫5,232
5SGSMD5K1F40C2N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 46769152 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫5,424
EP4SGX230DF29I4N	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 9120 Number of Logic Elements/Cells: 228000 Total RAM Bits: 17544192 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫2,096
5SGSMD4K2F40I3LN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 23946240 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫6,880
5SGSMD3E1H29C2L	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 16937984 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: 780-BBGA, FCBGA	在庫4,096
5AGXFB3H4F35I3N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.12 V ~ 1.18 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA Exposed Pad	在庫6,336
5AGXBB3D6F35C6N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA Exposed Pad	在庫2,256
5AGXMA5G4F31C4N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	パッケージ: 896-BBGA, FCBGA	在庫6,960
EP3SL50F780C4G	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA	在庫2,688
EP2C35F672C6	Intel	IC FPGA 475 I/O 672FBGA Number of LABs/CLBs: 2076 Number of Logic Elements/Cells: 33216 Total RAM Bits: 483840 Number of I/O: 475 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BGA	在庫7,312
EPM570GT100C5	Intel	IC CPLD 440MC 5.4NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 76 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	パッケージ: 100-TQFP	在庫6,464
5M160ZM68C5N	Intel	IC CPLD 128MC 7.5NS 68MBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 160 Number of Macrocells: 128 Number of Gates: - Number of I/O: 52 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 68-TFBGA Supplier Device Package: 68-MBGA (5x5)	パッケージ: 68-TFBGA	在庫21,384
5AGXF31NTI	Intel	IC FPGA FLIPCHIP Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,768
HH80547PE0831MN	Intel	INTEL PENTIUM 4 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXMA7H3F35C3WN	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
AGFC023R24C2I2VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	パッケージ: -	Request a Quote
5SGXEA4H2F35C3G	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
AGFA023R25A1I1V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
HGLXT17001ME-A1	Intel	LXT17001 - 10 GBPS LASER DRIVER Type: - Data Rate: - Number of Channels: - Voltage - Supply: - Current - Supply: - Current - Modulation: - Current - Bias: - Operating Temperature: - Package / Case: - Supplier Device Package: - Mounting Type: -	パッケージ: -	Request a Quote
1SG280HH3F55I2LG	Intel	IC FPGA 1160 I/O 2912BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 1160 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	パッケージ: -	Request a Quote
E28F004BVB80	Intel	IC FLASH 4MBIT CUI 40TSOP Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - Boot Block Memory Size: 4Mbit Memory Interface: CUI Clock Frequency: - Write Cycle Time - Word, Page: 80ns Access Time: 80 ns Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 40-TFSOP (0.724", 18.40mm Width) Supplier Device Package: 40-TSOP	パッケージ: -	Request a Quote

10AS048K1F35E1SG

Intel

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 480K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,448

10AS016E4F29I3SG

Intel

IC SOC FPGA 288 I/O 780FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 160K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫5,344

EPC1PC8

Intel

IC CONFIG DEVICE 1MBIT 8DIP

Programmable Type: OTP
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

パッケージ: 8-DIP (0.300", 7.62mm)

在庫324,000

EP20K200CB652C7ES

Intel

IC FPGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: -
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 652-BBGA
Supplier Device Package: 652-BGA (45x45)

パッケージ: 652-BBGA

在庫6,000

EP20K1000CF672C8ES

Intel

IC FPGA

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 38400
Total RAM Bits: 327680
Number of I/O: 508
Number of Gates: 1772000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA, FCBGA

在庫4,800

10AX066K3F35I3SGES

Intel

IC FPGA 396 I/O 1152FCBGA

Number of LABs/CLBs: 250540
Number of Logic Elements/Cells: 660000
Total RAM Bits: 49610752
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫2,400

EP1K30TC144-1N

Intel

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 24576
Number of I/O: 102
Number of Gates: 119000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

在庫5,776

EP3SE260F1517C3

Intel

IC FPGA 976 I/O 1517FBGA

Number of LABs/CLBs: 10200
Number of Logic Elements/Cells: 255000
Total RAM Bits: 16672768
Number of I/O: 976
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫5,232

5SGSMD5K1F40C2N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 46769152
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫5,424

EP4SGX230DF29I4N

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 9120
Number of Logic Elements/Cells: 228000
Total RAM Bits: 17544192
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫2,096

5SGSMD4K2F40I3LN

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 23946240
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫6,880

5SGSMD3E1H29C2L

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 16937984
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

パッケージ: 780-BBGA, FCBGA

在庫4,096

5AGXFB3H4F35I3N

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.12 V ~ 1.18 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA Exposed Pad

在庫6,336

5AGXBB3D6F35C6N

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA Exposed Pad

在庫2,256

5AGXMA5G4F31C4N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 8962
Number of Logic Elements/Cells: 190000
Total RAM Bits: 13284352
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

パッケージ: 896-BBGA, FCBGA

在庫6,960

EP3SL50F780C4G

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA

在庫2,688

EP2C35F672C6

Intel

IC FPGA 475 I/O 672FBGA

Number of LABs/CLBs: 2076
Number of Logic Elements/Cells: 33216
Total RAM Bits: 483840
Number of I/O: 475
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BGA

在庫7,312

EPM570GT100C5

Intel

IC CPLD 440MC 5.4NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 76
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

パッケージ: 100-TQFP

在庫6,464

5M160ZM68C5N

Intel

IC CPLD 128MC 7.5NS 68MBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 160
Number of Macrocells: 128
Number of Gates: -
Number of I/O: 52
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 68-TFBGA
Supplier Device Package: 68-MBGA (5x5)

パッケージ: 68-TFBGA

在庫21,384

5AGXF31NTI

Intel

IC FPGA FLIPCHIP

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,768

HH80547PE0831MN

Intel

INTEL PENTIUM 4

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

5SGXMA7H3F35C3WN

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

Request a Quote

AGFC023R24C2I2VB

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

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5SGXEA4H2F35C3G

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

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AGFA023R25A1I1V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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HGLXT17001ME-A1

Intel

LXT17001 - 10 GBPS LASER DRIVER

Type: -
Data Rate: -
Number of Channels: -
Voltage - Supply: -
Current - Supply: -
Current - Modulation: -
Current - Bias: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

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1SG280HH3F55I2LG

Intel

IC FPGA 1160 I/O 2912BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 1160
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

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E28F004BVB80

Intel

IC FLASH 4MBIT CUI 40TSOP

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - Boot Block
Memory Size: 4Mbit
Memory Interface: CUI
Clock Frequency: -
Write Cycle Time - Word, Page: 80ns
Access Time: 80 ns
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Supplier Device Package: 40-TSOP

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