Intel 製品

EPC4QI100N

Intel

IC CONFIG DEVICE 4MBIT 100QFP

• Programmable Type: In System Programmable
• Memory Size: 4MB
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

パッケージ: 100-BQFP

HC1S80F1020AR

Intel

IC FPGA APEX 1020FBGA

• Number of LABs/CLBs: 7904
• Number of Logic Elements/Cells: 79040
• Total RAM Bits: 5658048
• Number of I/O: 782
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

パッケージ: 1020-BBGA

EPF8820ATC144-3

Intel

IC FPGA 112 I/O 144TQFP

• Number of LABs/CLBs: 84
• Number of Logic Elements/Cells: 672
• Total RAM Bits: -
• Number of I/O: 112
• Number of Gates: 8000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

EP20K200EBC652-1

Intel

IC FPGA 376 I/O 652BGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 376
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 652-BBGA
• Supplier Device Package: 652-BGA (45x45)

パッケージ: 652-BBGA

EPF6016QC240-3

Intel

IC FPGA 199 I/O 240QFP

• Number of LABs/CLBs: 132
• Number of Logic Elements/Cells: 1320
• Total RAM Bits: -
• Number of I/O: 199
• Number of Gates: 16000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

パッケージ: 240-BQFP

5SGXEBBR1H43I2N

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

パッケージ: 1760-BBGA, FCBGA

5SGXEB6R3F43C2L

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 61688832
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

パッケージ: 1760-BBGA, FCBGA

5SGXEA7N3F40I3

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

10AX090N3F45I2LG

Intel

IC FPGA 768 I/O 1932FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: 1932-BBGA, FCBGA

EP4SE230F29C3N

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 9120
• Number of Logic Elements/Cells: 228000
• Total RAM Bits: 17544192
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

5SGXEA4K3F40I4

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 43983872
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

10AX057K2F35I1HG

Intel

IC FPGA 396 I/O 1152FCBGA

• Number of LABs/CLBs: 217080
• Number of Logic Elements/Cells: 570000
• Total RAM Bits: 42082304
• Number of I/O: 492
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

5SGXMA5K2F40I3N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 53105664
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

EP3SL70F484I3N

Intel

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA, FCBGA

EP4CGX150CF23C8N

Intel

IC FPGA 270 I/O 484FBGA

• Number of LABs/CLBs: 9360
• Number of Logic Elements/Cells: 149760
• Total RAM Bits: 6635520
• Number of I/O: 270
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BGA

EP4CE15E22I8L

Intel

IC FPGA 81 I/O 144EQFP

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 81
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

パッケージ: 144-LQFP Exposed Pad

EPM7512BBC256-5

Intel

IC CPLD 512MC 5.5NS 256BGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 10000
• Number of I/O: 212
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-BGA (27x27)

パッケージ: 256-LBGA

5AGXMB1G4F31I3G

Intel

IC FPGA 384 I/O 896FBGA

• Number of LABs/CLBs: 14151
• Number of Logic Elements/Cells: 300000
• Total RAM Bits: 17358848
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 1.12V ~ 1.18V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

パッケージ: 896-BBGA, FCBGA

AGFD019R24C2I3V

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

パッケージ: -

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10CL016YE144A7G

Intel

IC FPGA 78 I/O 144EQFP

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 78
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

パッケージ: -

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1SG210HN3F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 262500
• Number of Logic Elements/Cells: 2100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

パッケージ: -

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FWIXP422BB

Intel

IC MPU 266MHZ 492BGA

• Core Processor: Xscale
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100Mbps (2)
• SATA: -
• USB: USB 1.1 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Cryptography
• Package / Case: 492-BBGA
• Supplier Device Package: 492-BGA (35x35)

パッケージ: -

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AGIB027R29A1E2VB

Intel

IC FPGA AGILEX-I 2957BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2957-BFBGA Exposed Pad
• Supplier Device Package: 2957-BGA (56x45)

パッケージ: -

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5SGXMA7N1F45C1G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: -

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RD38F2240WWYTQ0

Intel

WIRELESS FLASH MEMORY

• Memory Type: -
• Memory Format: -
• Technology: -
• Memory Size: -
• Memory Interface: -
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

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S87C511

Intel

MICROCONTROLLER, 8 BIT, OTPROM

• Core Processor: MCS 51
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: Serial Port
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: EPROM
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4V ~ 6V
• Data Converters: -
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP

パッケージ: -

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1ST280EY2F55I2LGAS

Intel

IC FPGA 296 I/O 2912BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

パッケージ: -

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1SX250HH1F55E2VG

Intel

IC FPGA STRATIX 10 2912FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2500K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

パッケージ: -

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