ページ 76 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
NG80960JC66	Intel	IC MPU I960 66MHZ 132QFP Core Processor: i960 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 100°C (TC) Security Features: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	パッケージ: 132-BQFP Bumpered	在庫4,928
5CSEBA2U19C8N	Intel	IC FPGA 240 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	パッケージ: 484-FBGA	在庫6,336
MPM7128ELC84AA	Intel	IC FPGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,032
EP20K200FC484-1	Intel	IC FPGA 382 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 382 Number of Gates: 526000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA	在庫4,528
EP4SGX230FF35C3ES	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: 9120 Number of Logic Elements/Cells: 228000 Total RAM Bits: 17544192 Number of I/O: 564 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,704
EP20K100EQC240-2N	Intel	IC FPGA 183 I/O 240QFP Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 183 Number of Gates: 263000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	パッケージ: 240-BQFP	在庫6,208
EPF10K50VRC240-1	Intel	IC FPGA 189 I/O 240RQFP Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 20480 Number of I/O: 189 Number of Gates: 116000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-RQFP (32x32)	パッケージ: 240-BFQFP Exposed Pad	在庫5,920
EP4SGX530KF43C3	Intel	IC FPGA 880 I/O 1760FBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 880 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	パッケージ: 1760-BBGA, FCBGA	在庫4,080
5SGXMB6R2F40C2LN	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫4,640
EP4SGX360KF43C3	Intel	IC FPGA 880 I/O 1760FBGA Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 Total RAM Bits: 23105536 Number of I/O: 880 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	パッケージ: 1760-BBGA, FCBGA	在庫4,240
10AX066N4F40E3SG	Intel	IC FPGA 588 I/O 1517FCBGA Number of LABs/CLBs: 250540 Number of Logic Elements/Cells: 660000 Total RAM Bits: 49610752 Number of I/O: 588 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫7,088
10AX022E3F27I1HG	Intel	IC FPGA 240 I/O 672FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA, FCBGA	在庫2,640
EP2S15F484C5N	Intel	IC FPGA 342 I/O 484FBGA Number of LABs/CLBs: 780 Number of Logic Elements/Cells: 15600 Total RAM Bits: 419328 Number of I/O: 342 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA	在庫9,396
EP3C55F780C7N	Intel	IC FPGA 377 I/O 780FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 377 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BGA	在庫5,680
5CGXFC4C6U19C7N	Intel	IC FPGA 224 I/O 484UBGA Number of LABs/CLBs: 18868 Number of Logic Elements/Cells: 50000 Total RAM Bits: 2862080 Number of I/O: 224 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	パッケージ: 484-FBGA	在庫5,296
EPM3128AFI256-10	Intel	IC CPLD 128MC 10NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 98 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-BGA	在庫7,552
EPM7064STC44-10	Intel	IC CPLD 64MC 10NS 44TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 36 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	パッケージ: 44-TQFP	在庫9,168
EPM570GF256C4	Intel	IC CPLD 440MC 5.4NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 160 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-BGA	在庫7,392
5CSEBA2U19I7LN	Intel	484-PIN UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	パッケージ: 484-FBGA	在庫4,896
EP3SL70F484C4LG	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 2700 Number of Logic Elements/Cells: 67500 Total RAM Bits: 2699264 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA, FCBGA	在庫5,040
5SGSED8K3F40C2G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
UG80960HA4016	Intel	RISC MICROCONTROLLER, 32BIT, I96 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXAF45NAD	Intel	IC FPGA 1932FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 38797312 Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: - Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: -	Request a Quote
FWIXP425ABB	Intel	IC MPU IXP425 266MHZ PBGA492 Core Processor: Intel® IXP42X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100Mbps (2) SATA: - USB: USB 1.1 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, SHA-1 Package / Case: 492-BBGA Supplier Device Package: 492-PBGA (35x35)	パッケージ: -	Request a Quote
NK80530VZ733256	Intel	MOBILE CELERON PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXEB6R1F40C2G	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
FAGD1655348BA	Intel	MUX/DEMUX, 1-FUNC, PQFP48 Type: Multiplexer Circuit: 1 x 4:1 Independent Circuits: 1 Current - Output High, Low: 60mA, 8mA Voltage Supply Source: Single Supply Voltage - Supply: -4.7V ~ -5.5V Operating Temperature: 0°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-TQFP-EDQUAD (7x7)	パッケージ: -	Request a Quote
1ST085ES2F50I2VG	Intel	IC FPGA STRATIX10TX 2397FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 841000 Total RAM Bits: 71303168 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	パッケージ: -	Request a Quote

NG80960JC66

Intel

IC MPU I960 66MHZ 132QFP

Core Processor: i960
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 100°C (TC)
Security Features: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

パッケージ: 132-BQFP Bumpered

在庫4,928

5CSEBA2U19C8N

Intel

IC FPGA 240 I/O 484UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz
Primary Attributes: FPGA - 25K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

パッケージ: 484-FBGA

在庫6,336

MPM7128ELC84AA

Intel

IC FPGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,032

EP20K200FC484-1

Intel

IC FPGA 382 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 382
Number of Gates: 526000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA

在庫4,528

EP4SGX230FF35C3ES

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: 9120
Number of Logic Elements/Cells: 228000
Total RAM Bits: 17544192
Number of I/O: 564
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,704

EP20K100EQC240-2N

Intel

IC FPGA 183 I/O 240QFP

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 183
Number of Gates: 263000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

パッケージ: 240-BQFP

在庫6,208

EPF10K50VRC240-1

Intel

IC FPGA 189 I/O 240RQFP

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 20480
Number of I/O: 189
Number of Gates: 116000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-RQFP (32x32)

パッケージ: 240-BFQFP Exposed Pad

在庫5,920

EP4SGX530KF43C3

Intel

IC FPGA 880 I/O 1760FBGA

Number of LABs/CLBs: 21248
Number of Logic Elements/Cells: 531200
Total RAM Bits: 28033024
Number of I/O: 880
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

パッケージ: 1760-BBGA, FCBGA

在庫4,080

5SGXMB6R2F40C2LN

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫4,640

EP4SGX360KF43C3

Intel

IC FPGA 880 I/O 1760FBGA

Number of LABs/CLBs: 14144
Number of Logic Elements/Cells: 353600
Total RAM Bits: 23105536
Number of I/O: 880
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

パッケージ: 1760-BBGA, FCBGA

在庫4,240

10AX066N4F40E3SG

Intel

IC FPGA 588 I/O 1517FCBGA

Number of LABs/CLBs: 250540
Number of Logic Elements/Cells: 660000
Total RAM Bits: 49610752
Number of I/O: 588
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫7,088

10AX022E3F27I1HG

Intel

IC FPGA 240 I/O 672FBGA

Number of LABs/CLBs: 80330
Number of Logic Elements/Cells: 220000
Total RAM Bits: 13752320
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA, FCBGA

在庫2,640

EP2S15F484C5N

Intel

IC FPGA 342 I/O 484FBGA

Number of LABs/CLBs: 780
Number of Logic Elements/Cells: 15600
Total RAM Bits: 419328
Number of I/O: 342
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA

在庫9,396

EP3C55F780C7N

Intel

IC FPGA 377 I/O 780FBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 377
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BGA

在庫5,680

5CGXFC4C6U19C7N

Intel

IC FPGA 224 I/O 484UBGA

Number of LABs/CLBs: 18868
Number of Logic Elements/Cells: 50000
Total RAM Bits: 2862080
Number of I/O: 224
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

パッケージ: 484-FBGA

在庫5,296

EPM3128AFI256-10

Intel

IC CPLD 128MC 10NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 98
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-BGA

在庫7,552

EPM7064STC44-10

Intel

IC CPLD 64MC 10NS 44TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 36
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-TQFP (10x10)

パッケージ: 44-TQFP

在庫9,168

EPM570GF256C4

Intel

IC CPLD 440MC 5.4NS 256FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 160
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-BGA

在庫7,392

5CSEBA2U19I7LN

Intel

484-PIN UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 25K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

パッケージ: 484-FBGA

在庫4,896

EP3SL70F484C4LG

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 2700
Number of Logic Elements/Cells: 67500
Total RAM Bits: 2699264
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA, FCBGA

在庫5,040

5SGSED8K3F40C2G

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: -

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UG80960HA4016

Intel

RISC MICROCONTROLLER, 32BIT, I96

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

5SGXAF45NAD

Intel

IC FPGA 1932FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 38797312
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: -

Request a Quote

FWIXP425ABB

Intel

IC MPU IXP425 266MHZ PBGA492

Core Processor: Intel® IXP42X
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100Mbps (2)
SATA: -
USB: USB 1.1 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: 3DES, AES, DES, MD5, SHA-1
Package / Case: 492-BBGA
Supplier Device Package: 492-PBGA (35x35)

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NK80530VZ733256

Intel

MOBILE CELERON PROCESSOR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

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5SGXEB6R1F40C2G

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-FBGA (40x40)
Supplier Device Package: 1517-FBGA (40x40)

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FAGD1655348BA

Intel

MUX/DEMUX, 1-FUNC, PQFP48

Type: Multiplexer
Circuit: 1 x 4:1
Independent Circuits: 1
Current - Output High, Low: 60mA, 8mA
Voltage Supply Source: Single Supply
Voltage - Supply: -4.7V ~ -5.5V
Operating Temperature: 0°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-TQFP-EDQUAD (7x7)

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1ST085ES2F50I2VG

Intel

IC FPGA STRATIX10TX 2397FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 841000
Total RAM Bits: 71303168
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

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