ページ 13 - Microchip Technology 製品 - インタフェース - テレコム

部品番号	メーカ	説明	パッケージ	在庫	Interface	Number of Circuits	Voltage - Supply	Current - Supply	Power (Watts)	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
PM5397-FGI	Microchip Technology	ARROW 2XGE PB FREE Function: Ethernet, SONET/SDH Interface: GMII, SerDes Number of Circuits: 2 Voltage - Supply: 1.8V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 896-BGA Supplier Device Package: 896-FCBGA	パッケージ: 896-BGA	在庫6,240	GMII, SerDes	2	1.8V	-	-	-40°C ~ 85°C	Surface Mount	896-BGA	896-FCBGA
PM5397-FEI	Microchip Technology	ARROW 2XGE PB FREE Function: Ethernet, SONET/SDH Interface: GMII, SerDes Number of Circuits: 2 Voltage - Supply: 1.8V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 896-BGA Supplier Device Package: 896-FCBGA	パッケージ: 896-BGA	在庫5,952	GMII, SerDes	2	1.8V	-	-	-40°C ~ 85°C	Surface Mount	896-BGA	896-FCBGA
PM8320-PI	Microchip Technology	TEMUX-84 WITH E3 MAPPERS, DS3/E3 Function: Framer Interface: E1, J1, T1 Number of Circuits: - Voltage - Supply: 1.8V, 3.3V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-PBGA (23x23)	パッケージ: 324-FBGA	在庫3,280	E1, J1, T1	-	1.8V, 3.3V	-	-	-40°C ~ 85°C	Surface Mount	324-FBGA	324-PBGA (23x23)
PM8320-PGI	Microchip Technology	TEMUX-84 WITH E3 MAPPERS, DS3/E3 Function: Framer Interface: E1, J1, T1 Number of Circuits: - Voltage - Supply: 1.8V, 3.3V Current - Supply: - Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-PBGA (23x23)	パッケージ: 324-FBGA	在庫2,576	E1, J1, T1	-	1.8V, 3.3V	-	-	-40°C ~ 85°C	Surface Mount	324-FBGA	324-PBGA (23x23)
ZL50111GAG2	Microchip Technology	IC CESOP PROC 1024CH 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	パッケージ: 552-BGA	在庫5,184	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
PM8324-FXI	Microchip Technology	TEMAP 84FDL, LF BUMP Function: Framer Interface: E1, T1 Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,816	E1, T1	-	-	-	-	-	-	-	-
PM8321-PI	Microchip Technology	HIGH DENSITY FRAMER/MAPPER FOR 8 Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,144	-	-	-	-	-	-	-	-	-
PM5333-FEI	Microchip Technology	ARROW 8XFE PB FREE Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,920	-	-	-	-	-	-	-	-	-
PM5333-FGI	Microchip Technology	8 CHANNEL FAST ETHERNET OVER SON Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,104	-	-	-	-	-	-	-	-	-
PM4390-FEI	Microchip Technology	ARROW M8XFE Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,576	-	-	-	-	-	-	-	-	-
ZL50112GAG2	Microchip Technology	IC CESOP PROCESSOR 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	パッケージ: 552-BGA	在庫3,504	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
PM4390B-FGI	Microchip Technology	8 CHANNEL 10/100 OR 1XGE ETHERNE Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,968	-	-	-	-	-	-	-	-	-
PM8324-FEI	Microchip Technology	TEMAP 84FDL GREEN DUAL PASSIVATI Function: Framer Interface: E1, T1 Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,696	E1, T1	-	-	-	-	-	-	-	-
PM8321-PGI	Microchip Technology	HIGH DENSITY FRAMER/MAPPER FOR 8 Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,184	-	-	-	-	-	-	-	-	-
PM5334A-FEI	Microchip Technology	SINGLE-CHIP SONET/SDH TRANSPORT Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,944	-	-	-	-	-	-	-	-	-
PM7382-PI	Microchip Technology	TELECOM INTERFACE ICS 32 LINK Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,152	-	-	-	-	-	-	-	-	-
ZL50110GAG2	Microchip Technology	IC CESOP PROC 256CH 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	パッケージ: 552-BGA	在庫5,520	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
MT90869AG2	Microchip Technology	IC DGTL SWITCH F16KDX 272BGA Function: Switch Interface: - Number of Circuits: 1 Voltage - Supply: 3V ~ 3.6V Current - Supply: 160mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 272-BGA Supplier Device Package: 272-PBGA (27x27)	パッケージ: 272-BGA	在庫4,416	-	1	3V ~ 3.6V	160mA	-	-40°C ~ 85°C	Surface Mount	272-BGA	272-PBGA (27x27)
PM4332-PGI	Microchip Technology	32 CHANNEL T1/E1 FRAMER Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,816	-	-	-	-	-	-	-	-	-
PM7382-PGI	Microchip Technology	32 LINK, 256 HDLC CHANNEL FRAME Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,904	-	-	-	-	-	-	-	-	-
ZL50117GAG2	Microchip Technology	IC CESOP PROCESSOR 128CH 324BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-PBGA (23x23)	パッケージ: 324-BGA	在庫5,760	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	324-BGA	324-PBGA (23x23)
PM8312-PI	Microchip Technology	32CHANNEL T1/E1 FRAMER DEVICE WI Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,040	-	-	-	-	-	-	-	-	-
PM8312-PGI	Microchip Technology	32CHANNEL T1/E1 FRAMER DEVICE WI Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,224	-	-	-	-	-	-	-	-	-
ZL50114GAG2	Microchip Technology	IC CESOP PROCESSOR 128CH 552BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-PBGA (35x35)	パッケージ: 552-BGA	在庫5,296	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	552-BGA	552-PBGA (35x35)
ZL50116GAG2	Microchip Technology	IC CESOP PROCESSOR 64CH 324BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-PBGA (23x23)	パッケージ: 324-BGA	在庫2,192	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	324-BGA	324-PBGA (23x23)
ZL50232GDG2	Microchip Technology	IC VOICE ECHO CANCELLER 208LBGA Function: Echo Cancellation Interface: - Number of Circuits: 1 Voltage - Supply: 1.6V ~ 2V Current - Supply: 10mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 208-LBGA Supplier Device Package: 208-LBGA (17x17)	パッケージ: 208-LBGA	在庫2,272	-	1	1.6V ~ 2V	10mA	-	-40°C ~ 85°C	Surface Mount	208-LBGA	208-LBGA (17x17)
ZL50118GAG2	Microchip Technology	IC CESOP PROCESSOR 32CH 324BGA Function: Telecom Circuit Interface: TDM Number of Circuits: 1 Voltage - Supply: 1.65V ~ 1.95V Current - Supply: 950mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 324-BGA Supplier Device Package: 324-PBGA (23x23)	パッケージ: 324-BGA	在庫5,200	TDM	1	1.65V ~ 1.95V	950mA	-	-40°C ~ 85°C	Surface Mount	324-BGA	324-PBGA (23x23)
ZL50064QCG1	Microchip Technology	IC DIGITAL SWITCH 16K CH 256LQFP Function: Switch Interface: - Number of Circuits: 1 Voltage - Supply: 1.71V ~ 1.89V Current - Supply: 240mA Power (Watts): - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28x28)	パッケージ: 256-LQFP	在庫7,536	-	1	1.71V ~ 1.89V	240mA	-	-40°C ~ 85°C	Surface Mount	256-LQFP	256-LQFP (28x28)

PM5397-FGI

Microchip Technology

ARROW 2XGE PB FREE

Function: Ethernet, SONET/SDH
Interface: GMII, SerDes
Number of Circuits: 2
Voltage - Supply: 1.8V
Current - Supply: -
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 896-BGA
Supplier Device Package: 896-FCBGA

パッケージ: 896-BGA

在庫6,240

GMII, SerDes

2

1.8V

-

-40°C ~ 85°C

Surface Mount

896-BGA

896-FCBGA

PM5397-FEI

Microchip Technology

ARROW 2XGE PB FREE

Function: Ethernet, SONET/SDH
Interface: GMII, SerDes
Number of Circuits: 2
Voltage - Supply: 1.8V
Current - Supply: -
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 896-BGA
Supplier Device Package: 896-FCBGA

パッケージ: 896-BGA

在庫5,952

GMII, SerDes

2

1.8V

-

-40°C ~ 85°C

Surface Mount

896-BGA

896-FCBGA

PM8320-PI

Microchip Technology

TEMUX-84 WITH E3 MAPPERS, DS3/E3

Function: Framer
Interface: E1, J1, T1
Number of Circuits: -
Voltage - Supply: 1.8V, 3.3V
Current - Supply: -
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 324-FBGA
Supplier Device Package: 324-PBGA (23x23)

パッケージ: 324-FBGA

在庫3,280

E1, J1, T1

-

1.8V, 3.3V

-

-40°C ~ 85°C

Surface Mount

324-FBGA

324-PBGA (23x23)

PM8320-PGI

Microchip Technology

TEMUX-84 WITH E3 MAPPERS, DS3/E3

Function: Framer
Interface: E1, J1, T1
Number of Circuits: -
Voltage - Supply: 1.8V, 3.3V
Current - Supply: -
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 324-FBGA
Supplier Device Package: 324-PBGA (23x23)

パッケージ: 324-FBGA

在庫2,576

E1, J1, T1

-

1.8V, 3.3V

-

-40°C ~ 85°C

Surface Mount

324-FBGA

324-PBGA (23x23)

ZL50111GAG2

Microchip Technology

IC CESOP PROC 1024CH 552BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 552-BGA
Supplier Device Package: 552-PBGA (35x35)

パッケージ: 552-BGA

在庫5,184

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

552-BGA

552-PBGA (35x35)

PM8324-FXI

Microchip Technology

TEMAP 84FDL, LF BUMP

Function: Framer
Interface: E1, T1
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,816

E1, T1

-

PM8321-PI

Microchip Technology

HIGH DENSITY FRAMER/MAPPER FOR 8

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,144

-

PM5333-FEI

Microchip Technology

ARROW 8XFE PB FREE

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,920

-

PM5333-FGI

Microchip Technology

8 CHANNEL FAST ETHERNET OVER SON

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,104

-

PM4390-FEI

Microchip Technology

ARROW M8XFE

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,576

-

ZL50112GAG2

Microchip Technology

IC CESOP PROCESSOR 552BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 552-BGA
Supplier Device Package: 552-PBGA (35x35)

パッケージ: 552-BGA

在庫3,504

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

552-BGA

552-PBGA (35x35)

PM4390B-FGI

Microchip Technology

8 CHANNEL 10/100 OR 1XGE ETHERNE

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,968

-

PM8324-FEI

Microchip Technology

TEMAP 84FDL GREEN DUAL PASSIVATI

Function: Framer
Interface: E1, T1
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,696

E1, T1

-

PM8321-PGI

Microchip Technology

HIGH DENSITY FRAMER/MAPPER FOR 8

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,184

-

PM5334A-FEI

Microchip Technology

SINGLE-CHIP SONET/SDH TRANSPORT

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,944

-

PM7382-PI

Microchip Technology

TELECOM INTERFACE ICS 32 LINK

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,152

-

ZL50110GAG2

Microchip Technology

IC CESOP PROC 256CH 552BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 552-BGA
Supplier Device Package: 552-PBGA (35x35)

パッケージ: 552-BGA

在庫5,520

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

552-BGA

552-PBGA (35x35)

MT90869AG2

Microchip Technology

IC DGTL SWITCH F16KDX 272BGA

Function: Switch
Interface: -
Number of Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 160mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 272-BGA
Supplier Device Package: 272-PBGA (27x27)

パッケージ: 272-BGA

在庫4,416

-

1

3V ~ 3.6V

160mA

-

-40°C ~ 85°C

Surface Mount

272-BGA

272-PBGA (27x27)

PM4332-PGI

Microchip Technology

32 CHANNEL T1/E1 FRAMER

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,816

-

PM7382-PGI

Microchip Technology

32 LINK, 256 HDLC CHANNEL FRAME

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,904

-

ZL50117GAG2

Microchip Technology

IC CESOP PROCESSOR 128CH 324BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 324-BGA
Supplier Device Package: 324-PBGA (23x23)

パッケージ: 324-BGA

在庫5,760

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

324-BGA

324-PBGA (23x23)

PM8312-PI

Microchip Technology

32CHANNEL T1/E1 FRAMER DEVICE WI

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,040

-

PM8312-PGI

Microchip Technology

32CHANNEL T1/E1 FRAMER DEVICE WI

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,224

-

ZL50114GAG2

Microchip Technology

IC CESOP PROCESSOR 128CH 552BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 552-BGA
Supplier Device Package: 552-PBGA (35x35)

パッケージ: 552-BGA

在庫5,296

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

552-BGA

552-PBGA (35x35)

ZL50116GAG2

Microchip Technology

IC CESOP PROCESSOR 64CH 324BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 324-BGA
Supplier Device Package: 324-PBGA (23x23)

パッケージ: 324-BGA

在庫2,192

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

324-BGA

324-PBGA (23x23)

ZL50232GDG2

Microchip Technology

IC VOICE ECHO CANCELLER 208LBGA

Function: Echo Cancellation
Interface: -
Number of Circuits: 1
Voltage - Supply: 1.6V ~ 2V
Current - Supply: 10mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 208-LBGA
Supplier Device Package: 208-LBGA (17x17)

パッケージ: 208-LBGA

在庫2,272

-

1

1.6V ~ 2V

10mA

-

-40°C ~ 85°C

Surface Mount

208-LBGA

208-LBGA (17x17)

ZL50118GAG2

Microchip Technology

IC CESOP PROCESSOR 32CH 324BGA

Function: Telecom Circuit
Interface: TDM
Number of Circuits: 1
Voltage - Supply: 1.65V ~ 1.95V
Current - Supply: 950mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 324-BGA
Supplier Device Package: 324-PBGA (23x23)

パッケージ: 324-BGA

在庫5,200

TDM

1

1.65V ~ 1.95V

950mA

-

-40°C ~ 85°C

Surface Mount

324-BGA

324-PBGA (23x23)

ZL50064QCG1

Microchip Technology

IC DIGITAL SWITCH 16K CH 256LQFP

Function: Switch
Interface: -
Number of Circuits: 1
Voltage - Supply: 1.71V ~ 1.89V
Current - Supply: 240mA
Power (Watts): -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 256-LQFP
Supplier Device Package: 256-LQFP (28x28)

パッケージ: 256-LQFP

在庫7,536

-

1

1.71V ~ 1.89V

240mA

-

-40°C ~ 85°C

Surface Mount

256-LQFP

256-LQFP (28x28)