Microchip Technology 製品

DSC1123BI5-125.0000T

Microchip Technology

OSC MEMS 125.000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 125MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

パッケージ: 6-SMD, No Lead

MCP1727-0802E/SN

Microchip Technology

IC REG LINEAR 0.8V 1.5A 8SOIC

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 0.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.55V @ 1.5A
• Current - Output: 1.5A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 220µA
• PSRR: 60dB (100Hz)
• Control Features: Enable, Power Good
• Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.154", 3.90mm Width)

UCS2112T-1-V/G4

Microchip Technology

IC POWER SWITCH DUAL USB 20QFN

• Switch Type: USB Switch
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: -
• Interface: I2C, SMBus
• Voltage - Load: 2.9 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 3A
• Rds On (Typ): 40 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Adjustable), UVLO
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

パッケージ: 20-VFQFN Exposed Pad

SY88212LMG

Microchip Technology

IC LASER DRVR 2.5GBPS 3.6V 24MLF

• Type: Laser Diode Driver (Fiber Optic)
• Data Rate: 2.5Gbps
• Number of Channels: 1
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 55mA
• Current - Modulation: 85mA
• Current - Bias: 70mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-VFQFN Exposed Pad, 24-MLF?
• Supplier Device Package: 24-MLF? (4x4)
• Mounting Type: Surface Mount

パッケージ: 24-VFQFN Exposed Pad, 24-MLF?

AT93C46-10TU-2.7-T

Microchip Technology

IC EEPROM 1KBIT 2MHZ 8TSSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8 , 64 x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: -
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

パッケージ: 8-TSSOP (0.173", 4.40mm Width)

SY10EL05ZG TR

Microchip Technology

IC GATE AND/NAND DIFF 2INP 8SOIC

• Logic Type: AND/NAND Gate
• Number of Circuits: 1
• Number of Inputs: 2 Input (1, 1)
• Schmitt Trigger Input: No
• Output Type: Differential
• Current - Output High, Low: -
• Voltage - Supply: 4.75 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.154", 3.90mm Width)

LPC47N207-JV

Microchip Technology

IC CTRLR SUPER I/O LPC 64STQFP

• Applications: Controller
• Interface: LPC
• Voltage - Supply: 3.3V
• Package / Case: 64-LQFP
• Supplier Device Package: 64-STQFP (7x7)
• Mounting Type: Surface Mount

パッケージ: 64-LQFP

MCP2025-500E/P

Microchip Technology

IC TXRX LIN 5V 70MA 8DIP

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 6 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP

パッケージ: 8-DIP (0.300", 7.62mm)

AT32UC3A4256HHB-C1UR

Microchip Technology

EDBG - EDBG

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

PIC24FV08KM204T-I/MV

Microchip Technology

IC MCU 16BIT 8KB FLASH 48UQFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 8KB (2.75K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5 V
• Data Converters: A/D 22x10b/12b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-UFQFN Exposed Pad
• Supplier Device Package: 48-UQFN (6x6)

パッケージ: 48-UFQFN Exposed Pad

PIC16LF87T-I/ML

Microchip Technology

IC MCU 8BIT 7KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 368 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

パッケージ: 28-VQFN Exposed Pad

PIC16LC57C-04/SP

Microchip Technology

IC MCU 8BIT 3KB OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 20
• Program Memory Size: 3KB (2K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 72 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

パッケージ: 28-DIP (0.300", 7.62mm)

PIC16F1579T-I/SO

Microchip Technology

IC MCU 8BIT 14KB FLASH 20SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: LIN, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 12x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

パッケージ: 20-SOIC (0.295", 7.50mm Width)

PIC16F18854-I/MV

Microchip Technology

IC MCU 8BIT 7KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 24x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-UFQFN Exposed Pad
• Supplier Device Package: 28-UQFN (4x4)

パッケージ: 28-UFQFN Exposed Pad

PIC24FJ128GB202-I/SO

Microchip Technology

IC MCU 16BIT 128KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SmartCard, SPI, UART/USART
• Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, HLVD, POR, PWM, WDT
• Number of I/O: 20
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

パッケージ: 28-SOIC (0.295", 7.50mm Width)

ATF1500ABV-12AC

Microchip Technology

IC CPLD 32 MACROCELL 12NS 44TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 12.0ns
• Voltage Supply - Internal: 3 V ~ 5.25 V
• Number of Logic Elements/Blocks: -
• Number of Macrocells: 32
• Number of Gates: -
• Number of I/O: 32
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

パッケージ: 44-TQFP

SY89645LK4G

Microchip Technology

IC CLK BUFFER 1:4 650MHZ 20TSSOP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:4
• Differential - Input:Output: No/Yes
• Input: LVCMOS, LVTTL
• Output: LVDS
• Frequency - Max: 650MHz
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

PIC18F26K83T-I/SO

Microchip Technology

FLASH

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 24x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

パッケージ: 28-SOIC (0.295", 7.50mm Width)

DSPIC33CH256MP208-I/PT

Microchip Technology

IC MCU 16BIT 328KB FLASH 80TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit Dual-Core
• Speed: 180MHz, 200MHz
• Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
• Number of I/O: 69
• Program Memory Size: 328kB (328k x 8)
• Program Memory Type: FLASH, PRAM
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 34x12b; D/A 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

パッケージ: 80-TQFP

1N4973US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 43 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 32.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: E-MELF

パッケージ: -

UM4310SM

Microchip Technology

SI PPIN HERMETIC MELF

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 1000V
• Current - Max: -
• Capacitance @ Vr, F: 2.2pF @ 100V, 1MHz
• Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 15 W
• Operating Temperature: -
• Package / Case: SQ-MELF
• Supplier Device Package: -

パッケージ: -

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JANTXV1N2808RB

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 10 V
• Tolerance: ±5%
• Power - Max: 25 W
• Impedance (Max) (Zzt): 0.6 Ohms
• Current - Reverse Leakage @ Vr: 25 µA @ 6.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-204AD
• Supplier Device Package: TO-204AD (TO-3)

パッケージ: -

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MPF050TL-FCSG325E

Microchip Technology

MPF050TL-FCSG325E

• Number of LABs/CLBs: 48000
• Number of Logic Elements/Cells: 3774874
• Total RAM Bits: -
• Number of I/O: 164
• Number of Gates: -
• Voltage - Supply: 0.97V ~ 1.08V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 325-TFBGA
• Supplier Device Package: 325-BGA (11x11)

パッケージ: -

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GC1610-85

Microchip Technology

SI TVAR HERMETIC PILL

• Capacitance @ Vr, F: 5.6pF @ 4V, 1MHz
• Capacitance Ratio: 5.5
• Capacitance Ratio Condition: C0/C45
• Voltage - Peak Reverse (Max): 45 V
• Diode Type: Single
• Q @ Vr, F: 1700 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

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JANSR2N3501UB-TR

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

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JAN1N2843RB

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 150 V
• Tolerance: ±5%
• Power - Max: 10 W
• Impedance (Max) (Zzt): 75 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 114 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-204AD
• Supplier Device Package: TO-204AD (TO-3)

パッケージ: -

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JANTXV1N5816R

Microchip Technology

DIODE GEN PURP 150V 20A DO203AA

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 150 V
• Current - Average Rectified (Io): 20A
• Voltage - Forward (Vf) (Max) @ If: 950 mV @ 20 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 150 V
• Capacitance @ Vr, F: 300pF @ 10V, 1MHz
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-203AA (DO-4)
• Operating Temperature - Junction: -65°C ~ 175°C

パッケージ: -

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MPFS460T-FCG1152EPP

Microchip Technology

IC SOC RISC-V 1152FCBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 3.95MB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 461K Logic Modules
• Operating Temperature: 0°C ~ 100°C
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

パッケージ: -

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