画像 |
部品番号 |
メーカ |
説明 |
パッケージ |
在庫 |
数量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
パッケージ: - |
在庫7,038 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
パッケージ: - |
在庫7,776 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
パッケージ: - |
在庫5,400 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
パッケージ: - |
在庫6,336 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
パッケージ: - |
在庫2,952 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
パッケージ: - |
在庫5,436 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
パッケージ: - |
在庫4,068 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
パッケージ: - |
在庫2,304 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
パッケージ: - |
在庫3,834 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
|
パッケージ: - |
在庫7,542 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
|
パッケージ: - |
在庫7,686 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
|
パッケージ: - |
在庫5,382 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, S
|
パッケージ: - |
在庫4,392 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
パッケージ: - |
在庫6,192 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
パッケージ: - |
在庫2,430 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
パッケージ: - |
在庫3,996 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
パッケージ: - |
在庫2,178 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
パッケージ: - |
在庫6,300 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
パッケージ: - |
在庫5,652 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
パッケージ: - |
在庫6,660 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
パッケージ: - |
在庫3,544 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
パッケージ: - |
在庫3,400 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
パッケージ: - |
在庫6,354 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
HEADER PCB
|
パッケージ: - |
在庫7,092 |
|
Male Blade | 0.050" (1.27mm) | Board to Board or Cable | Shrouded - 2 Wall | 8 | All | 1 | - | Surface Mount | Solder | Latch Lock | 0.083" (2.10mm) | - | - | 0.333" (8.45mm) | Rectangular | Tin | 118.1µin (3.00µm) | Tin | Brass | Polyphthalamide (PPA), Glass Filled | - | -40°C ~ 105°C | - | UL94 HB | Black |
||
Molex, LLC |
HS DOCK FIXED CONN 8.74CL 108CKT
|
パッケージ: - |
在庫3,580 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 108 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
||
Molex, LLC |
HS DOCK FIXED ASSY 72CKT NO EARS
|
パッケージ: - |
在庫6,210 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 72 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
||
Molex, LLC |
HS DOCK FIXED CONN 144CKT 4.74CL
|
パッケージ: - |
在庫6,192 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 144 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |
||
Molex, LLC |
HS DOCK FIXED CONN 4.74CL 108CKT
|
パッケージ: - |
在庫4,140 |
|
Male Blade; Male Pin | - | Board to Board | Shrouded - 4 Wall | 108 | All | 3 | - | Through Hole, Right Angle | Solder | Push-Pull | - | 0.112" (2.84mm) | - | - | Rectangular, Square | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - | -20°C ~ 85°C | - | UL94 V-0 | - |