ページ 219 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF7S38075HSR5	NXP	FET RF 65V 3.6GHZ NI-780S Transistor Type: LDMOS Frequency: 3.4GHz ~ 3.6GHz Gain: 14dB Voltage - Test: 30V Current Rating: - Noise Figure: - Current - Test: 900mA Power - Output: 12W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫4,352
2N5551,116	NXP	TRANS NPN 160V 0.3A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 300mA Voltage - Collector Emitter Breakdown (Max): 160V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 10mA, 5V Power - Max: 630mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫7,168
PCA8534AH/Q900/1,5	NXP	IC LCD DRIVER 60SEG 80LQFP Display Type: LCD Configuration: 60 Segment Interface: I2C Digits or Characters: - Current - Supply: 80µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	パッケージ: 80-LQFP	在庫3,104
74HC221DB,112	NXP	IC NON-RETRIGGER MULTIVIB 16SSOP Logic Type: Monostable Independent Circuits: 2 Schmitt Trigger Input: Yes Propagation Delay: 19ns Current - Output High, Low: 5.2mA, 5.2mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	パッケージ: 16-SSOP (0.209", 5.30mm Width)	在庫2,976
74ALVT16652DGG,112	NXP	IC 16BIT BUS TXRX 3-ST 56TSSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	パッケージ: 56-TFSOP (0.240", 6.10mm Width)	在庫2,400
I74F657D,112	NXP	IC TRANSCEIVER 8BIT N-INV 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 3mA, 24mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	パッケージ: 24-SOIC (0.295", 7.50mm Width)	在庫2,720
74ABT2240D,118	NXP	IC BUFF INVERT 5.5V 20SOIC Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 12mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫4,832
MC33975ATEKR2	NXP	IC SWITCH DETECT MULT 32-SOIC Applications: Switch Monitoring Interface: SPI Serial Voltage - Supply: - Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫12,600
UJA1078ATW/5V0/1J	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	在庫5,808
MC33663BSEFR2	NXP	TXRX DUAL LINCELL 14SOIC Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,776
MPC8544CVTANG	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,680
MPC8360EZUALFG	NXP	IC MPU MPC83XX 667MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫3,888
MPC8572ELVJAVNE	NXP	IC MPU MPC85XX 1.5GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	パッケージ: 1023-BBGA, FCBGA	在庫4,416
MPC8377VRAJFA	NXP	IC MPU MPC83XX 533MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫16,992
MCF51AC128CVPUE	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 20x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫3,408
MC68376BGMAB20	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 7.5K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	パッケージ: 160-BQFP	在庫2,032
MCF5280CVM66	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 142 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫10,584
MC9S08AW32VFUE	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫4,144
EM783-MC3E	NXP	MCU 32BIT ENERGY METER 32HVQFN Applications: Energy Measurement Core Processor: ARM? Cortex?-M0 Program Memory Type: FLASH (32 kB) Controller Series: - RAM Size: 8K x 8 Interface: I2C, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	パッケージ: 32-VQFN Exposed Pad	在庫2,880
MSC8152SVT1000B	NXP	IC PROCESSOR DUAL DGTL 783FCBGA Type: SC3850 Dual Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫5,504
SA56004HD,118	NXP	SENSOR TEMPERATURE I2C/SMBUS 8SO Sensor Type: Digital, Local/Remote Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Output Type: I2C/SMBus Voltage - Supply: 3 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫7,146
SP5748GHK0AMKU6R	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫2,592
MKL82Z128VMP7	NXP	KINETIS KL82: 72MHZ CORTEX-M0+ S Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 11x16b, D/A 1x6b, 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,952
SPC5746BBK1AMKU6	NXP	IC MCU 32BIT 3MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: -	Request a Quote
TDF8536HH-N1Y	NXP	TDF8536HH Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm Voltage - Supply: 5.5V ~ 45V Features: - Mounting Type: Surface Mount Operating Temperature: - Supplier Device Package: 100-HLQFP (14x14) Package / Case: 100-FQFP Exposed Pad	パッケージ: -	Request a Quote
74LVC2T45GF-115-NXP	NXP	FUNC, 2 BIT, TRUE OUTPUT, CMOS, Translator Type: - Channel Type: - Number of Circuits: - Channels per Circuit: - Voltage - VCCA: - Voltage - VCCB: - Input Signal: - Output Signal: - Output Type: - Data Rate: - Operating Temperature: - Features: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MVR5510AMDAHESR2	NXP	IC PMIC VR5510 ASIL-D Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
TEA2095TE-1Y	NXP	IC SR CTLR SYNCH RECT 8HSOP Applications: Active/Synchronous Rectification Controller Voltage - Input: - Voltage - Supply: 4.75V ~ 38V Current - Supply: 90 µA Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad Supplier Device Package: 8-HSO	パッケージ: -	Request a Quote

MRF7S38075HSR5

NXP

FET RF 65V 3.6GHZ NI-780S

Transistor Type: LDMOS
Frequency: 3.4GHz ~ 3.6GHz
Gain: 14dB
Voltage - Test: 30V
Current Rating: -
Noise Figure: -
Current - Test: 900mA
Power - Output: 12W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫4,352

2N5551,116

NXP

TRANS NPN 160V 0.3A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 300mA
Voltage - Collector Emitter Breakdown (Max): 160V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 10mA, 5V
Power - Max: 630mW
Frequency - Transition: 300MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫7,168

PCA8534AH/Q900/1,5

NXP

IC LCD DRIVER 60SEG 80LQFP

Display Type: LCD
Configuration: 60 Segment
Interface: I2C
Digits or Characters: -
Current - Supply: 80µA
Voltage - Supply: 1.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

在庫3,104

74HC221DB,112

NXP

IC NON-RETRIGGER MULTIVIB 16SSOP

Logic Type: Monostable
Independent Circuits: 2
Schmitt Trigger Input: Yes
Propagation Delay: 19ns
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 16-SSOP

パッケージ: 16-SSOP (0.209", 5.30mm Width)

在庫2,976

74ALVT16652DGG,112

NXP

IC 16BIT BUS TXRX 3-ST 56TSSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

在庫2,400

I74F657D,112

NXP

IC TRANSCEIVER 8BIT N-INV 24SOIC

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 3mA, 24mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

パッケージ: 24-SOIC (0.295", 7.50mm Width)

在庫2,720

74ABT2240D,118

NXP

IC BUFF INVERT 5.5V 20SOIC

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 12mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫4,832

MC33975ATEKR2

NXP

IC SWITCH DETECT MULT 32-SOIC

Applications: Switch Monitoring
Interface: SPI Serial
Voltage - Supply: -
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫12,600

UJA1078ATW/5V0/1J

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

在庫5,808

MC33663BSEFR2

NXP

TXRX DUAL LINCELL 14SOIC

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,776

MPC8544CVTANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,680

MPC8360EZUALFG

NXP

IC MPU MPC83XX 667MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫3,888

MPC8572ELVJAVNE

NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

パッケージ: 1023-BBGA, FCBGA

在庫4,416

MPC8377VRAJFA

NXP

IC MPU MPC83XX 533MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫16,992

MCF51AC128CVPUE

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 20x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫3,408

MC68376BGMAB20

NXP

IC MCU 32BIT ROMLESS 160QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 7.5K x 8
Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 160-BQFP
Supplier Device Package: 160-QFP (28x28)

パッケージ: 160-BQFP

在庫2,032

MCF5280CVM66

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 142
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫10,584

MC9S08AW32VFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫4,144

EM783-MC3E

NXP

MCU 32BIT ENERGY METER 32HVQFN

Applications: Energy Measurement
Core Processor: ARM? Cortex?-M0
Program Memory Type: FLASH (32 kB)
Controller Series: -
RAM Size: 8K x 8
Interface: I2C, IrDA, SPI, UART/USART
Number of I/O: 22
Voltage - Supply: 2.6 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Supplier Device Package: 32-HVQFN (7x7)

パッケージ: 32-VQFN Exposed Pad

在庫2,880

MSC8152SVT1000B

NXP

IC PROCESSOR DUAL DGTL 783FCBGA

Type: SC3850 Dual Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate: 1GHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫5,504

SA56004HD,118

NXP

SENSOR TEMPERATURE I2C/SMBUS 8SO

Sensor Type: Digital, Local/Remote
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Output Type: I2C/SMBus
Voltage - Supply: 3 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫7,146

SP5748GHK0AMKU6R

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫2,592

MKL82Z128VMP7

NXP

KINETIS KL82: 72MHZ CORTEX-M0+ S

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 72MHz
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 41
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 11x16b, D/A 1x6b, 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,952

SPC5746BBK1AMKU6

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: -

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TDF8536HH-N1Y

NXP

TDF8536HH

Type: Class D
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 140W x 4 @ 4Ohm
Voltage - Supply: 5.5V ~ 45V
Features: -
Mounting Type: Surface Mount
Operating Temperature: -
Supplier Device Package: 100-HLQFP (14x14)
Package / Case: 100-FQFP Exposed Pad

パッケージ: -

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74LVC2T45GF-115-NXP

NXP

FUNC, 2 BIT, TRUE OUTPUT, CMOS,

Translator Type: -
Channel Type: -
Number of Circuits: -
Channels per Circuit: -
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: -
Output Signal: -
Output Type: -
Data Rate: -
Operating Temperature: -
Features: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MVR5510AMDAHESR2

NXP

IC PMIC VR5510 ASIL-D

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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TEA2095TE-1Y

NXP

IC SR CTLR SYNCH RECT 8HSOP

Applications: Active/Synchronous Rectification Controller
Voltage - Input: -
Voltage - Supply: 4.75V ~ 38V
Current - Supply: 90 µA
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package: 8-HSO

パッケージ: -

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