ページ 276 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BUK9Y3R0-40E/CX	NXP	MOSFET N-CH LFPAK Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,360
BZX84-C36/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 36V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 50nA @ 23.1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,904
BAS216,115	NXP	DIODE GEN PURP 75V 250MA SOD2 Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 75V Current - Average Rectified (Io): 250mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 1µA @ 75V Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110 Operating Temperature - Junction: 150°C (Max)	パッケージ: SOD-110	在庫6,560
MC33882DHR2	NXP	IC SW LO SIDE 6-OUTPUT 30-HSOP Switch Type: General Purpose Number of Outputs: 6 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: SPI, Parallel Voltage - Load: 8 V ~ 25 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): - Rds On (Typ): 400 mOhm Input Type: - Features: - Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 30-HSOP	パッケージ: 30-BSOP (0.433", 11.00mm Width) Exposed Pad	在庫5,104
HEF4002BP,652	NXP	IC GATE NOR 2CH 4-INP 14-DIP Logic Type: NOR Gate Number of Circuits: 2 Number of Inputs: 4 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 4µA Current - Output High, Low: 3mA, 3mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	パッケージ: 14-DIP (0.300", 7.62mm)	在庫4,032
N74F51D,602	NXP	IC GATE AND/OR/INVERT 2IN 14SOIC Logic Type: AND/OR/INVERT Gate Number of Circuits: 2 Number of Inputs: 10 Input (3, 3, 2, 2) Schmitt Trigger Input: No Output Type: Differential Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫3,872
74HC74N,652	NXP	IC D-TYPE POS TRG DUAL 14DIP Function: Set(Preset) and Reset Type: D-Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 82MHz Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 5.2mA, 5.2mA Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Iq): 40µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm)	パッケージ: 14-DIP (0.300", 7.62mm)	在庫6,816
74LVTH32245EC,557	NXP	IC BUS TRSCVR 3-ST 32BIT 96LFBGA Logic Type: Transceiver, Non-Inverting Number of Elements: 4 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	パッケージ: 96-LFBGA	在庫4,912
PCA9675DK,118	NXP	IC I/O EXPANDER I2C 16B 24SSOP Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.154", 3.90mm Width) Supplier Device Package: 24-SSOP	パッケージ: 24-SSOP (0.154", 3.90mm Width)	在庫3,712
SC16IS762IBS-T	NXP	IC UART DUAL I2C/SPI 32-HVQFN Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 2mA Operating Temperature: -40°C ~ 95°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫2,464
MCIMX356AJM5B	NXP	IC MPU I.MX35 532MHZ 400MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 532MHz Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Secure Fusebox, Secure JTAG Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫4,544
P5020NSN7QMB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫5,872
P2020NXE2HHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫4,944
MPC8245LVV300D	NXP	IC MPU MPC82XX 300MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	パッケージ: 352-LBGA	在庫9,564
MCIMX6Y1CVM05AA	NXP	I.MX 32-BIT MPU, ARM CORTEX-A7 C Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	パッケージ: 289-LFBGA	在庫6,448
PXAG37KFA,512	NXP	IC MCU 16BIT 32KB OTP 44PLCC Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: UART/USART Peripherals: PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	パッケージ: 44-LCC (J-Lead)	在庫5,024
SC511663MZP40	NXP	IC MCU 32BIT 448KB FLASH 272BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 40MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 101 Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 26K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: - Mounting Type: - Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27x27)	パッケージ: 272-BBGA	在庫7,472
MCF5208CAB166	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 166.67MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 50 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	パッケージ: 160-BQFP	在庫4,768
MC908JL3ECDWE	NXP	IC MCU 8BIT 4KB FLASH 28SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 23 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	パッケージ: 28-SOIC (0.295", 7.50mm Width)	在庫15,480
KMC8144SVT800A	NXP	IC DSP 783FCBGA Type: SC3400 Core Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫5,536
TEA6321T/V1,512	NXP	IC SOUND FADER CONTROL 32SO Function: Volume Control Applications: Pre-Amplifier Number of Channels: 2 Interface: I2C Voltage - Supply: 7.5 V ~ 9.5 V Operating Temperature: -40°C ~ 85°C (TA) Specifications: 110dB, 20dB Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	パッケージ: 32-SOIC (0.295", 7.50mm Width)	在庫5,280
SL3S1203FTB0,115	NXP	IC UCODE G2XL SOT886 Type: RFID Transponder Frequency: 840MHz ~ 960MHz Standards: ISO 18000-6, EPC Interface: - Voltage - Supply: 1.8V Operating Temperature: -40°C ~ 85°C Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	パッケージ: 6-XFDFN	在庫3,096
MC32PF1550A2EP	NXP	POWER MANAGEMENT IC: 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	パッケージ: 40-VFQFN Exposed Pad	在庫7,456
SPC5673FK0MVY2	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	パッケージ: 516-BBGA	在庫3,712
MK22FN512VLH12R	NXP	KINETIS K 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 22x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,824
S912ZVL64F0MFM	NXP	S12Z CPU, 64K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫7,536
S32G234MSBK0VUCT	NXP	S32G234M ARM CORTEX-M7, HSE W/PR Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (4) SATA: - USB: - Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: -	Request a Quote
MIMXRT1021DAG5B	NXP	IC MCU 32BIT EXT MEM 144LQFP Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 500MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 96 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 19x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: -	Request a Quote

BUK9Y3R0-40E/CX

NXP

MOSFET N-CH LFPAK

Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Power - Max: -
Frequency - Transition: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,360

BZX84-C36/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 36V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 23.1V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,904

BAS216,115

NXP

DIODE GEN PURP 75V 250MA SOD2

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 75V
Current - Average Rectified (Io): 250mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 1µA @ 75V
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110
Operating Temperature - Junction: 150°C (Max)

パッケージ: SOD-110

在庫6,560

MC33882DHR2

NXP

IC SW LO SIDE 6-OUTPUT 30-HSOP

Switch Type: General Purpose
Number of Outputs: 6
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: SPI, Parallel
Voltage - Load: 8 V ~ 25 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): -
Rds On (Typ): 400 mOhm
Input Type: -
Features: -
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 30-HSOP

パッケージ: 30-BSOP (0.433", 11.00mm Width) Exposed Pad

在庫5,104

HEF4002BP,652

NXP

IC GATE NOR 2CH 4-INP 14-DIP

Logic Type: NOR Gate
Number of Circuits: 2
Number of Inputs: 4
Features: -
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): 4µA
Current - Output High, Low: 3mA, 3mA
Logic Level - Low: 1.5 V ~ 4 V
Logic Level - High: 3.5 V ~ 11 V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

パッケージ: 14-DIP (0.300", 7.62mm)

在庫4,032

N74F51D,602

NXP

IC GATE AND/OR/INVERT 2IN 14SOIC

Logic Type: AND/OR/INVERT Gate
Number of Circuits: 2
Number of Inputs: 10 Input (3, 3, 2, 2)
Schmitt Trigger Input: No
Output Type: Differential
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫3,872

74HC74N,652

NXP

IC D-TYPE POS TRG DUAL 14DIP

Function: Set(Preset) and Reset
Type: D-Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 82MHz
Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2 V ~ 6 V
Current - Quiescent (Iq): 40µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)

パッケージ: 14-DIP (0.300", 7.62mm)

在庫6,816

74LVTH32245EC,557

NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

パッケージ: 96-LFBGA

在庫4,912

PCA9675DK,118

NXP

IC I/O EXPANDER I2C 16B 24SSOP

Number of I/O: 16
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Supplier Device Package: 24-SSOP

パッケージ: 24-SSOP (0.154", 3.90mm Width)

在庫3,712

SC16IS762IBS-T

NXP

IC UART DUAL I2C/SPI 32-HVQFN

Protocol: RS232, RS485
Function: Controller
Interface: I2C, SPI, UART
Standards: -
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Operating Temperature: -40°C ~ 95°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫2,464

MCIMX356AJM5B

NXP

IC MPU I.MX35 532MHZ 400MAPBGA

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 532MHz
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: Secure Fusebox, Secure JTAG
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫4,544

P5020NSN7QMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫5,872

P2020NXE2HHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫4,944

MPC8245LVV300D

NXP

IC MPU MPC82XX 300MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

パッケージ: 352-LBGA

在庫9,564

MCIMX6Y1CVM05AA

NXP

I.MX 32-BIT MPU, ARM CORTEX-A7 C

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 528MHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

パッケージ: 289-LFBGA

在庫6,448

PXAG37KFA,512

NXP

IC MCU 16BIT 32KB OTP 44PLCC

Core Processor: XA
Core Size: 16-Bit
Speed: 30MHz
Connectivity: UART/USART
Peripherals: PWM, WDT
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

パッケージ: 44-LCC (J-Lead)

在庫5,024

SC511663MZP40

NXP

IC MCU 32BIT 448KB FLASH 272BGA

Core Processor: PowerPC
Core Size: 32-Bit
Speed: 40MHz
Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 101
Program Memory Size: 448KB (448K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 26K x 8
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
Data Converters: A/D 32x10b
Oscillator Type: External
Operating Temperature: -
Mounting Type: -
Package / Case: 272-BBGA
Supplier Device Package: 272-PBGA (27x27)

パッケージ: 272-BBGA

在庫7,472

MCF5208CAB166

NXP

IC MCU 32BIT ROMLESS 160QFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 166.67MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 50
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 160-BQFP
Supplier Device Package: 160-QFP (28x28)

パッケージ: 160-BQFP

在庫4,768

MC908JL3ECDWE

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LED, LVD, POR, PWM
Number of I/O: 23
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
Data Converters: A/D 12x8b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

パッケージ: 28-SOIC (0.295", 7.50mm Width)

在庫15,480

KMC8144SVT800A

NXP

IC DSP 783FCBGA

Type: SC3400 Core
Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫5,536

TEA6321T/V1,512

NXP

IC SOUND FADER CONTROL 32SO

Function: Volume Control
Applications: Pre-Amplifier
Number of Channels: 2
Interface: I2C
Voltage - Supply: 7.5 V ~ 9.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Specifications: 110dB, 20dB
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SO

パッケージ: 32-SOIC (0.295", 7.50mm Width)

在庫5,280

SL3S1203FTB0,115

NXP

IC UCODE G2XL SOT886

Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Standards: ISO 18000-6, EPC
Interface: -
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

パッケージ: 6-XFDFN

在庫3,096

MC32PF1550A2EP

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

パッケージ: 40-VFQFN Exposed Pad

在庫7,456

SPC5673FK0MVY2

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

在庫3,712

MK22FN512VLH12R

NXP

KINETIS K 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 22x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,824

S912ZVL64F0MFM

NXP

S12Z CPU, 64K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN-EP (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫7,536

S32G234MSBK0VUCT

NXP

S32G234M ARM CORTEX-M7, HSE W/PR

Core Processor: ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Speed: 400MHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (4)
SATA: -
USB: -
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: -

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MIMXRT1021DAG5B

NXP

IC MCU 32BIT EXT MEM 144LQFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 500MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 96
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 19x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: -

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