ページ 326 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BLF6G27LS-50BN,112	NXP	TRANSISTOR RF PWR LDMOS SOT1112B Transistor Type: LDMOS (Dual) Frequency: 2.5GHz ~ 2.7GHz Gain: 16.5dB Voltage - Test: 28V Current Rating: 12A Noise Figure: - Current - Test: 430mA Power - Output: 3W Voltage - Rated: 65V Package / Case: SOT-1112B Supplier Device Package: CDFM6	パッケージ: SOT-1112B	在庫3,568
MRF7S19100NR1	NXP	FET RF 65V 1.99GHZ TO270-4 Transistor Type: LDMOS Frequency: 1.93GHz ~ 1.99GHz Gain: 17.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1A Power - Output: 29W Voltage - Rated: 65V Package / Case: TO-270AB Supplier Device Package: TO-270 WB-4	パッケージ: TO-270AB	在庫3,248
PBLS1504V,115	NXP	TRANS NPN PREBIAS/PNP SOT666 Transistor Type: 1 NPN Pre-Biased, 1 PNP Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 15V Resistor - Base (R1) (Ohms): 22k Resistor - Emitter Base (R2) (Ohms): 22k DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA, 100nA Frequency - Transition: 280MHz Power - Max: 300mW Mounting Type: Surface Mount Package / Case: SOT-563, SOT-666 Supplier Device Package: SOT-666	パッケージ: SOT-563, SOT-666	在庫4,224
PZM13NB2,115	NXP	DIODE ZENER 13V 300MW SMT3 Voltage - Zener (Nom) (Vz): 13V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 10V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫4,608
MMPF0100F4ANES	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 12 Voltage - Output: Multiple Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	パッケージ: 56-VFQFN Exposed Pad	在庫3,008
N74F161AD,602	NXP	IC COUNTER 4BIT BINARY 16SOIC Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: Synchronous Count Rate: 130MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫5,472
74LVCH16245ABQ,518	NXP	TXRX 16BIT NON-INV 3ST 60HUQFN Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 60-UFQFN Dual Rows, Exposed Pad Supplier Device Package: 60-HUQFN (4x6)	パッケージ: 60-UFQFN Dual Rows, Exposed Pad	在庫3,424
TDA18271HD/C2,557	NXP	IC TV SILICON TUNER 64-HLQFN Type: Silicon Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 64-LFQFN Exposed Pad Supplier Device Package: 64-HLFQFN (9x9)	パッケージ: 64-LFQFN Exposed Pad	在庫4,368
MCZ33903CS3EK	NXP	IC SBC CAN HS 3.3V 32SOIC Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫6,368
MCZ33904C5EKR2	NXP	IC SBC CAN HS 5.0V 32SOIC Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	在庫6,016
TDA8034AT/C1,118	NXP	IC SMART CARD INTERFACE 16SOIC Applications: - Interface: Analog Voltage - Supply: 3V, 5V Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Mounting Type: Surface Mount	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫2,112
PCA9556PW,112	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 20mA Clock Frequency: 100kHz Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫25,716
PPC8306VMADDCA	NXP	IC MPU MPC83XX 266MHZ 369BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19x19)	パッケージ: 369-LFBGA	在庫5,184
P4080PSE1MZA	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 8 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 10 Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫10,704
MC68EN302CAG20BT	NXP	IC MPU M683XX 20MHZ 144LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,160
KMPC860PVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫3,728
LPC2138FHN64/01,55	NXP	IC MCU 32BIT 512KB FLASH 64HVQFN Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 47 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-HVQFN (9x9)	パッケージ: 64-VFQFN Exposed Pad	在庫7,712
MCF51JF128VLH	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 17x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫22,104
LPC11U24FHI33/301,	NXP	IC MCU 32BIT 32KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 26 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫38,094
MPX2200A	NXP	SENSOR ABS PRESS 29PSI MAX Pressure Type: Absolute Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: ±1% Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 116.03 PSI (800 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	パッケージ: 4-SIP Module	在庫18,180
MMA7455LT	NXP	ACCELEROMETER 2-8G I2C/SPI 14LGA Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) Sensitivity (mV/g): - Bandwidth: 62.5Hz ~ 125Hz Output Type: I2C, SPI Voltage - Supply: 2.4 V ~ 3.6 V Features: Adjustable Bandwidth, Selectable Scale Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 14-VFLGA Supplier Device Package: 14-LGA (3x5)	パッケージ: 14-VFLGA	在庫5,472
NCF2960VHN/T0B040J	NXP	IC REMOTE KEYLESS ENTRY 24HVQFN Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,724
SA616BS,115	NXP	IC MIXER FM IF SYSTEM LV 20HVQFN RF Type: General Purpose Frequency: 150MHz Number of Mixers: 2 Gain: 17dB Noise Figure: 6.8dB Secondary Attributes: With Amplifier Current - Supply: 3.5mA Voltage - Supply: 2.7 V ~ 7 V Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4x4)	パッケージ: 20-VFQFN Exposed Pad	在庫8,910
MC35FS4501NAE	NXP	FS4500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫5,616
S9S12GA240F0VLLR	NXP	16-BIT MCU S12 CORE 240KB FLAS Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 240KB (240K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫7,248
MFS8631BMBA0ES	NXP	IC FS86 SYSTEM BASIS CHIP ASIL Applications: Camera Current - Supply: - Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: -	Request a Quote
MC33FS6516NAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
S9S12GN48J0VLH	NXP	S12 CORE,48K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote

BLF6G27LS-50BN,112

NXP

TRANSISTOR RF PWR LDMOS SOT1112B

Transistor Type: LDMOS (Dual)
Frequency: 2.5GHz ~ 2.7GHz
Gain: 16.5dB
Voltage - Test: 28V
Current Rating: 12A
Noise Figure: -
Current - Test: 430mA
Power - Output: 3W
Voltage - Rated: 65V
Package / Case: SOT-1112B
Supplier Device Package: CDFM6

パッケージ: SOT-1112B

在庫3,568

MRF7S19100NR1

NXP

FET RF 65V 1.99GHZ TO270-4

Transistor Type: LDMOS
Frequency: 1.93GHz ~ 1.99GHz
Gain: 17.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1A
Power - Output: 29W
Voltage - Rated: 65V
Package / Case: TO-270AB
Supplier Device Package: TO-270 WB-4

パッケージ: TO-270AB

在庫3,248

PBLS1504V,115

NXP

TRANS NPN PREBIAS/PNP SOT666

Transistor Type: 1 NPN Pre-Biased, 1 PNP
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Resistor - Base (R1) (Ohms): 22k
Resistor - Emitter Base (R2) (Ohms): 22k
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
Frequency - Transition: 280MHz
Power - Max: 300mW
Mounting Type: Surface Mount
Package / Case: SOT-563, SOT-666
Supplier Device Package: SOT-666

パッケージ: SOT-563, SOT-666

在庫4,224

PZM13NB2,115

NXP

DIODE ZENER 13V 300MW SMT3

Voltage - Zener (Nom) (Vz): 13V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 10V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫4,608

MMPF0100F4ANES

NXP

IC PWR MGMT I.MX6 56QFN

Applications: Converter, i.MX6
Voltage - Input: 2.8 V ~ 4.5 V
Number of Outputs: 12
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

パッケージ: 56-VFQFN Exposed Pad

在庫3,008

N74F161AD,602

NXP

IC COUNTER 4BIT BINARY 16SOIC

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 4
Reset: Asynchronous
Timing: Synchronous
Count Rate: 130MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫5,472

74LVCH16245ABQ,518

NXP

TXRX 16BIT NON-INV 3ST 60HUQFN

Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Supplier Device Package: 60-HUQFN (4x6)

パッケージ: 60-UFQFN Dual Rows, Exposed Pad

在庫3,424

TDA18271HD/C2,557

NXP

IC TV SILICON TUNER 64-HLQFN

Type: Silicon Tuner
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 64-LFQFN Exposed Pad
Supplier Device Package: 64-HLFQFN (9x9)

パッケージ: 64-LFQFN Exposed Pad

在庫4,368

MCZ33903CS3EK

NXP

IC SBC CAN HS 3.3V 32SOIC

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫6,368

MCZ33904C5EKR2

NXP

IC SBC CAN HS 5.0V 32SOIC

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

在庫6,016

TDA8034AT/C1,118

NXP

IC SMART CARD INTERFACE 16SOIC

Applications: -
Interface: Analog
Voltage - Supply: 3V, 5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO
Mounting Type: Surface Mount

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫2,112

PCA9556PW,112

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: 10mA, 20mA
Clock Frequency: 100kHz
Voltage - Supply: 3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫25,716

PPC8306VMADDCA

NXP

IC MPU MPC83XX 266MHZ 369BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 369-LFBGA
Supplier Device Package: 369-PBGA (19x19)

パッケージ: 369-LFBGA

在庫5,184

P4080PSE1MZA

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 8 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 10 Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫10,704

MC68EN302CAG20BT

NXP

IC MPU M683XX 20MHZ 144LQFP

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 20MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,160

KMPC860PVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫3,728

LPC2138FHN64/01,55

NXP

IC MCU 32BIT 512KB FLASH 64HVQFN

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 47
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-HVQFN (9x9)

パッケージ: 64-VFQFN Exposed Pad

在庫7,712

MCF51JF128VLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 17x12b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫22,104

LPC11U24FHI33/301,

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 26
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫38,094

MPX2200A

NXP

SENSOR ABS PRESS 29PSI MAX

Pressure Type: Absolute
Operating Pressure: 29.01 PSI (200 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: ±1%
Voltage - Supply: 10 V ~ 16 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 116.03 PSI (800 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 4-SIP Module
Supplier Device Package: -

パッケージ: 4-SIP Module

在庫18,180

MMA7455LT

NXP

ACCELEROMETER 2-8G I2C/SPI 14LGA

Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Sensitivity (mV/g): -
Bandwidth: 62.5Hz ~ 125Hz
Output Type: I2C, SPI
Voltage - Supply: 2.4 V ~ 3.6 V
Features: Adjustable Bandwidth, Selectable Scale
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-VFLGA
Supplier Device Package: 14-LGA (3x5)

パッケージ: 14-VFLGA

在庫5,472

NCF2960VHN/T0B040J

NXP

IC REMOTE KEYLESS ENTRY 24HVQFN

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,724

SA616BS,115

NXP

IC MIXER FM IF SYSTEM LV 20HVQFN

RF Type: General Purpose
Frequency: 150MHz
Number of Mixers: 2
Gain: 17dB
Noise Figure: 6.8dB
Secondary Attributes: With Amplifier
Current - Supply: 3.5mA
Voltage - Supply: 2.7 V ~ 7 V
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-HVQFN (4x4)

パッケージ: 20-VFQFN Exposed Pad

在庫8,910

MC35FS4501NAE

NXP

FS4500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫5,616

S9S12GA240F0VLLR

NXP

16-BIT MCU S12 CORE 240KB FLAS

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 240KB (240K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 11K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫7,248

MFS8631BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

Applications: Camera
Current - Supply: -
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: -

Request a Quote

MC33FS6516NAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

Request a Quote

S9S12GN48J0VLH

NXP

S12 CORE,48K FLASH

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

Request a Quote