NXP 製品

BF1202,215

NXP

MOSFET 2N-CH 10V 30MA SOT143B

• Transistor Type: N-Channel Dual Gate
• Frequency: 400MHz
• Gain: 30.5dB
• Voltage - Test: 5V
• Current Rating: 30mA
• Noise Figure: 0.9dB
• Current - Test: 12mA
• Power - Output: -
• Voltage - Rated: 10V
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

パッケージ: TO-253-4, TO-253AA

PRF957,115

NXP

TRANSISTOR SOT323

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 10V
• Frequency - Transition: 8.5GHz
• Noise Figure (dB Typ @ f): 1.3dB ~ 1.8dB @ 1GHz ~ 2GHz
• Gain: -
• Power - Max: 270mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
• Current - Collector (Ic) (Max): 100mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

BFG198,115

NXP

TRANS NPN 10V 8GHZ SC73

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 10V
• Frequency - Transition: 8GHz
• Noise Figure (dB Typ @ f): -
• Gain: -
• Power - Max: 1W
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 50mA, 5V
• Current - Collector (Ic) (Max): 100mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-261-4, TO-261AA
• Supplier Device Package: SOT-223

パッケージ: TO-261-4, TO-261AA

LD6836TD/22P,125

NXP

IC REG LINEAR 2.2V 300MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.2V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.2V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

パッケージ: SC-74A, SOT-753

LD6806TD/13P,125

NXP

IC REG LINEAR 1.3V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

パッケージ: SC-74A, SOT-753

PCF2119RU/2/F2Z

NXP

IC LCD CTLR/DRIVER UNCASED

• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
• Interface: I2C, Parallel
• Digits or Characters: 16 Characters, 32 Characters, 40 Elements
• Current - Supply: 35µA
• Voltage - Supply: 1.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

パッケージ: Die

NTB0102DP-Q100H

NXP

IC TXRX TRANSLATING 2BIT 8TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1.2V ~ 3.6V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 100Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

74ABT16841ADL,512

NXP

IC 20BIT BUS INTFC LATCH 56SSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 10:10
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 2
• Delay Time - Propagation: 2.2ns
• Current - Output High, Low: 32mA, 64mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

パッケージ: 56-BSSOP (0.295", 7.50mm Width)

74ALVT16240DL,112

NXP

IC BUFF DVR TRI-ST 16BIT 48SSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 48-SSOP

パッケージ: 48-BSSOP (0.295", 7.50mm Width)

TDA8933BTW/N2,512

NXP

IC AMP AUDIO 20.6W STER 32TSSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 20.6W x 1 @ 16 Ohm; 10.3W x 2 @ 8 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 32-HTSSOP
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

パッケージ: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

74HCT4066N,112

NXP

IC SWITCH QUAD 1X1 14DIP

• Switch Circuit: SPST - NO
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 4
• On-State Resistance (Max): 20 Ohm (Typ)
• Channel-to-Channel Matching (ΔRon): 3 Ohm
• Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 44ns, 30ns
• -3db Bandwidth: 200MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 1µA
• Crosstalk: -60dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

パッケージ: 14-DIP (0.300", 7.62mm)

MCIMX283DJM4A

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 454MHz
• Co-Processors/DSP: Data; DCP
• RAM Controllers: LVDDR, LVDDR2, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, Touchscreen
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -20°C ~ 70°C (TA)
• Security Features: Boot Security, Cryptography, Hardware ID
• Package / Case: 289-LFBGA
• Supplier Device Package: -

パッケージ: 289-LFBGA

MPC8321ZQAFDC

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

P5021NXN7VNC

NXP

IC SOC 64BIT 2X2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (10), 10 Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.1V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

MCIMX6G3CVM05AB

NXP

IC MPU I.MX6UL 289BGA

• Core Processor: ARM? Cortex?-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, LVDS
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

MC908GT16CFBER

NXP

IC MCU 8BIT 16KB FLASH 44QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

パッケージ: 44-QFP

MC68HC908AB32MPB

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM
• Number of I/O: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

MPC5125YVN400R

NXP

IC MCU 32BIT ROMLESS 324TEPBGA

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: -
• Package / Case: 324-BBGA
• Supplier Device Package: 324-TEPBGA (23x23)

パッケージ: 324-BBGA

MC68L11F1CFNE3

NXP

IC MCU 8BIT ROMLESS 68PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 30
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

パッケージ: 68-LCC (J-Lead)

MC9S08PT16VWJ

NXP

IC MCU 8BIT 16KB FLASH 20SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

パッケージ: 20-SOIC (0.295", 7.50mm Width)

LPC1820FBD144,551

NXP

IC MCU 32BIT ROMLESS 144LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 83
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 168K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

LS1043AXN8PQB

NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

MCIMX6S4AVM10AC

NXP

I.MX 6 SERIES 32-BIT MPU ARM CO

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

パッケージ: 624-LFBGA

MC9S08PA8AVTGR

NXP

S08PA 8-BIT MCU S08 CORE 8KB F

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

SPC5747CFK0AVMJ6

NXP

DUAL CORE 4M FLASH 512

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

S912XHY128F0VLLR

NXP

16-BIT MCU S12 CORE 128KB FLAS

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 76
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 8K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

S9S12GNA16F0WLF

NXP

16-BIT MCU S12 CORE 16KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

MFS2303BMBA3EP

NXP

IC

• Applications: System Basis Chip
• Current - Supply: 40µA
• Voltage - Supply: 5.5V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

SAF3561HV-V1101-51

NXP

IC DGTL RADIO PROCESSOR 144HLQFP

• Type: Digital Radio Processor
• Interface: I2C, I2S, SPI, UART
• Clock Rate: 96kHz
• Non-Volatile Memory: -
• On-Chip RAM: 64kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)

パッケージ: -

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MFS2631AMDA0AD

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

パッケージ: -

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