ページ 376 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF7S19080HR5	NXP	FET RF 65V 1.99GHZ NI-780 Transistor Type: LDMOS Frequency: 1.99GHz Gain: 18dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 750mA Power - Output: 24W Voltage - Rated: 65V Package / Case: NI-780 Supplier Device Package: NI-780	パッケージ: NI-780	在庫4,688
MRF5S21045MR1	NXP	FET RF 68V 2.17GHZ TO270-4 Transistor Type: LDMOS Frequency: 2.11GHz ~ 2.17GHz Gain: 14.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 10W Voltage - Rated: 68V Package / Case: TO-270-4 Supplier Device Package: TO-270 WB-4	パッケージ: TO-270-4	在庫5,264
PZM7.5NB2A,115	NXP	DIODE ZENER 7.5V 220MW SMT3 Voltage - Zener (Nom) (Vz): 7.5V Tolerance: ±2% Power - Max: 220mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 1µA @ 4V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,152
BZX284-C51,115	NXP	DIODE ZENER 51V 400MW SOD2 Voltage - Zener (Nom) (Vz): 51V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 110 Ohms Current - Reverse Leakage @ Vr: 50nA @ 35.7V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	パッケージ: SOD-110	在庫6,752
MC33907AE	NXP	IC SYSTEM BASIS CHIP CAN 48LQFP Applications: Power Supply, Automotive Applications Voltage - Input: -1 V ~ 40 V Number of Outputs: 6 Voltage - Output: Multiple Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫9,600
PIP3103-T,115	NXP	TOPFET LOGIC LVL 50V SOT223 Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 700mA Rds On (Typ): 150 mOhm Input Type: Non-Inverting Features: - Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage Operating Temperature: - Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	パッケージ: TO-261-4, TO-261AA	在庫4,672
TEA1732LTS/1H	NXP	IC CTRLR SMPS DCM/QR SC-74 Output Isolation: Isolated Internal Switch(s): No Voltage - Breakdown: - Topology: Flyback Voltage - Start Up: 21.5V Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V Duty Cycle: 80% Frequency - Switching: 65kHz Power (Watts): 75W Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Control Features: - Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP Mounting Type: Surface Mount	パッケージ: SC-74, SOT-457	在庫5,584
74LVC543AD,118	NXP	IC REGISTERED TXRX 8BIT 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	パッケージ: 24-SOIC (0.295", 7.50mm Width)	在庫6,320
UJA1163TK,118	NXP	IC TRANSCEIVER 14HVSON Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 5V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 14-VFDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	パッケージ: 14-VFDFN Exposed Pad	在庫7,424
NX3L2467HR,115	NXP	IC ANALOG SWITCH DPDT HXQFN16U Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:2 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 70 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 40ns, 20ns -3db Bandwidth: 60MHz Charge Injection: 15pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 16-XFQFN Exposed Pad Supplier Device Package: 16-HXQFN (3x3)	パッケージ: 16-XFQFN Exposed Pad	在庫2,896
MC8641DHX1500KB	NXP	IC MPU MPC86XX 1.5GHZ 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	パッケージ: 1023-BCBGA, FCCBGA	在庫5,600
MCIMX7S3DVK08SC	NXP	NO EPDC, 1 ETH, NO CAN, 1 OTG 1 Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Package / Case: 488-TFBGA Supplier Device Package: 488-FBGA (12x12)	パッケージ: 488-TFBGA	在庫3,520
P2020NXN2KHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫4,448
MC68HC908AP8CB	NXP	IC MCU 8BIT 8KB FLASH 42PSDIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Number of I/O: 32 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 42-SDIP (0.600", 15.24mm) Supplier Device Package: 42-PSDIP	パッケージ: 42-SDIP (0.600", 15.24mm)	在庫2,272
MC9S12D32MFUE	NXP	IC MCU 16BIT 32KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫57,840
LPC1767FBD100,551	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫9,288
MK60DN512ZVLQ10	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫74,820
KMC8144SVT800B	NXP	IC DSP 783FCBGA Type: SC3400 Core Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,304
SA56004ADP,118	NXP	SENSOR TEMP I2C/SMBUS 8TSSOP Sensor Type: Digital, Local/Remote Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Output Type: I2C/SMBus Voltage - Supply: 3 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	在庫2,988
FXTH8709116T1	NXP	IC SENSOR MULTICHIP XZAXIS 24QFN Sensor Type: - Output Type: - Operating Temperature: -	パッケージ: -	在庫6,786
LS1026ASN8P1A	NXP	QORIQ LAYERSCAPE 2XA72 64BIT ARM Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,128
SPC5744PK1AMMM9	NXP	NXP 32-BIT MCU DUAL CORE POWER Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	パッケージ: 257-LFBGA	在庫7,936
FS32K148HET0MLQT	NXP	S32K148 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: I²S, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 32x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫2,912
S9S12G64AMLFR	NXP	S12 CORE64K FLASHAU Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫5,552
LS1017ASN7KQA	NXP	IC MPU QORIQ LAYER 1GHZ 448FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: - RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Graphics Acceleration: - Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: - Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	パッケージ: -	Request a Quote
MFS8632BMDA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote
MC33FS8430G2KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
PTN36002HQX	NXP	DUALPORT 5GBPS USB3.1 GEN1 REDRI Type: - Applications: - Input: - Output: - Data Rate (Max): - Number of Channels: - Delay Time: - Signal Conditioning: - Capacitance - Input: - Voltage - Supply: - Current - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

MRF7S19080HR5

NXP

FET RF 65V 1.99GHZ NI-780

Transistor Type: LDMOS
Frequency: 1.99GHz
Gain: 18dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 750mA
Power - Output: 24W
Voltage - Rated: 65V
Package / Case: NI-780
Supplier Device Package: NI-780

パッケージ: NI-780

在庫4,688

MRF5S21045MR1

NXP

FET RF 68V 2.17GHZ TO270-4

Transistor Type: LDMOS
Frequency: 2.11GHz ~ 2.17GHz
Gain: 14.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 500mA
Power - Output: 10W
Voltage - Rated: 68V
Package / Case: TO-270-4
Supplier Device Package: TO-270 WB-4

パッケージ: TO-270-4

在庫5,264

PZM7.5NB2A,115

NXP

DIODE ZENER 7.5V 220MW SMT3

Voltage - Zener (Nom) (Vz): 7.5V
Tolerance: ±2%
Power - Max: 220mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 1µA @ 4V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,152

BZX284-C51,115

NXP

DIODE ZENER 51V 400MW SOD2

Voltage - Zener (Nom) (Vz): 51V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 110 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 35.7V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

パッケージ: SOD-110

在庫6,752

MC33907AE

NXP

IC SYSTEM BASIS CHIP CAN 48LQFP

Applications: Power Supply, Automotive Applications
Voltage - Input: -1 V ~ 40 V
Number of Outputs: 6
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫9,600

PIP3103-T,115

NXP

TOPFET LOGIC LVL 50V SOT223

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 700mA
Rds On (Typ): 150 mOhm
Input Type: Non-Inverting
Features: -
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Operating Temperature: -
Package / Case: TO-261-4, TO-261AA
Supplier Device Package: SOT-223

パッケージ: TO-261-4, TO-261AA

在庫4,672

TEA1732LTS/1H

NXP

IC CTRLR SMPS DCM/QR SC-74

Output Isolation: Isolated
Internal Switch(s): No
Voltage - Breakdown: -
Topology: Flyback
Voltage - Start Up: 21.5V
Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
Duty Cycle: 80%
Frequency - Switching: 65kHz
Power (Watts): 75W
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Control Features: -
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: SC-74, SOT-457
Supplier Device Package: 6-TSOP
Mounting Type: Surface Mount

パッケージ: SC-74, SOT-457

在庫5,584

74LVC543AD,118

NXP

IC REGISTERED TXRX 8BIT 24SOIC

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

パッケージ: 24-SOIC (0.295", 7.50mm Width)

在庫6,320

UJA1163TK,118

NXP

IC TRANSCEIVER 14HVSON

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 5V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 14-VFDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

パッケージ: 14-VFDFN Exposed Pad

在庫7,424

NX3L2467HR,115

NXP

IC ANALOG SWITCH DPDT HXQFN16U

Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Number of Circuits: 2
On-State Resistance (Max): 750 mOhm
Channel-to-Channel Matching (ΔRon): 70 mOhm
Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
Voltage - Supply, Dual (V±): -
Switch Time (Ton, Toff) (Max): 40ns, 20ns
-3db Bandwidth: 60MHz
Charge Injection: 15pC
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Crosstalk: -90dB @ 100kHz
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 16-XFQFN Exposed Pad
Supplier Device Package: 16-HXQFN (3x3)

パッケージ: 16-XFQFN Exposed Pad

在庫2,896

MC8641DHX1500KB

NXP

IC MPU MPC86XX 1.5GHZ 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

パッケージ: 1023-BCBGA, FCCBGA

在庫5,600

MCIMX7S3DVK08SC

NXP

NO EPDC, 1 ETH, NO CAN, 1 OTG 1

Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Package / Case: 488-TFBGA
Supplier Device Package: 488-FBGA (12x12)

パッケージ: 488-TFBGA

在庫3,520

P2020NXN2KHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫4,448

MC68HC908AP8CB

NXP

IC MCU 8BIT 8KB FLASH 42PSDIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 32
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 42-SDIP (0.600", 15.24mm)
Supplier Device Package: 42-PSDIP

パッケージ: 42-SDIP (0.600", 15.24mm)

在庫2,272

MC9S12D32MFUE

NXP

IC MCU 16BIT 32KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 59
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫57,840

LPC1767FBD100,551

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 100MHz
Connectivity: Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫9,288

MK60DN512ZVLQ10

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫74,820

KMC8144SVT800B

NXP

IC DSP 783FCBGA

Type: SC3400 Core
Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,304

SA56004ADP,118

NXP

SENSOR TEMP I2C/SMBUS 8TSSOP

Sensor Type: Digital, Local/Remote
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Output Type: I2C/SMBus
Voltage - Supply: 3 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

在庫2,988

FXTH8709116T1

NXP

IC SENSOR MULTICHIP XZAXIS 24QFN

Sensor Type: -
Output Type: -
Operating Temperature: -

パッケージ: -

在庫6,786

LS1026ASN8P1A

NXP

QORIQ LAYERSCAPE 2XA72 64BIT ARM

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,128

SPC5744PK1AMMM9

NXP

NXP 32-BIT MCU DUAL CORE POWER

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 2.5MB (2.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

パッケージ: 257-LFBGA

在庫7,936

FS32K148HET0MLQT

NXP

S32K148 32-BIT MCU ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 32x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫2,912

S9S12G64AMLFR

NXP

S12 CORE64K FLASHAU

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫5,552

LS1017ASN7KQA

NXP

IC MPU QORIQ LAYER 1GHZ 448FBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: -
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

パッケージ: -

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MFS8632BMDA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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MC33FS8430G2KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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PTN36002HQX

NXP

DUALPORT 5GBPS USB3.1 GEN1 REDRI

Type: -
Applications: -
Input: -
Output: -
Data Rate (Max): -
Number of Channels: -
Delay Time: -
Signal Conditioning: -
Capacitance - Input: -
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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