ページ 384 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BFT46,215	NXP	JFET N-CH 10MA 250MW SOT23 FET Type: N-Channel Voltage - Breakdown (V(BR)GSS): - Drain to Source Voltage (Vdss): 25V Current - Drain (Idss) @ Vds (Vgs=0): 200µA @ 10V Current Drain (Id) - Max: 10mA Voltage - Cutoff (VGS off) @ Id: 1.2V @ 0.5nA Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V Resistance - RDS(On): - Power - Max: 250mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT-23 (TO-236AB)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫25,548
PHU11NQ10T,127	NXP	MOSFET N-CH 100V 10.9A SOT533 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 10.9A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 14.7nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 360pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 57.7W (Tc) Rds On (Max) @ Id, Vgs: 180 mOhm @ 9A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I-Pak Package / Case: TO-251-3 Short Leads, IPak, TO-251AA	パッケージ: TO-251-3 Short Leads, IPak, TO-251AA	在庫4,448
MRF6S9130HSR3	NXP	FET RF 68V 880MHZ NI-780S Transistor Type: LDMOS Frequency: 880MHz Gain: 19.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 950mA Power - Output: 27W Voltage - Rated: 68V Package / Case: NI-780S Supplier Device Package: NI-780S	パッケージ: NI-780S	在庫6,496
2N3904,116	NXP	TRANS NPN 40V 0.2A TO92 Transistor Type: NPN Current - Collector (Ic) (Max): 200mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Power - Max: 500mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫4,304
BB208-03,115	NXP	DIODE VAR CAP 10V SOD-323 Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio: 5.2 Capacitance Ratio Condition: C1/C7.5 Voltage - Peak Reverse (Max): 10V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323	パッケージ: SC-76, SOD-323	在庫84,036
MC34VR500V3ES	NXP	IC REG 9OUT BUCK/LDO 56QFN Topology: Step-Down (Buck) (4), Linear (LDO) (5) Function: Communications Processors Number of Outputs: 9 Frequency - Switching: 2MHz Voltage/Current - Output 1: 0.625 V ~ 1.875 V, 4.5A Voltage/Current - Output 2: 0.625 V ~ 1.975 V, 2A Voltage/Current - Output 3: 0.625 V ~ 1.975 V, 2.5A w/LED Driver: No w/Supervisor: No w/Sequencer: No Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	パッケージ: 56-VFQFN Exposed Pad	在庫7,692
74HC258DB,118	NXP	IC QUAD 2-IN MUX 3-ST INV 16SSOP Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	パッケージ: 16-SSOP (0.209", 5.30mm Width)	在庫2,416
HEF4071BP,652	NXP	IC GATE OR 4CH 2-INP 14-DIP Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 4µA Current - Output High, Low: 3.4mA, 3.4mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 35ns @ 15V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	パッケージ: 14-DIP (0.300", 7.62mm)	在庫6,112
74HC85N,652	NXP	IC COMPARATOR MAGNITUDE 4B 16DIP Type: Magnitude Comparator Number of Bits: 4 Output: Active High Output Function: A<B, A=B, A>B Voltage - Supply: 2 V ~ 6 V Current - Output High, Low: 5.2mA, 5.2mA Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF Current - Quiescent (Iq): 8µA Operating Temperature: -40°C ~ 125°C Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole	パッケージ: 16-DIP (0.300", 7.62mm)	在庫4,576
UJA1069TW24/3V0:51	NXP	IC LIN FAIL-SAFE 24-HTSSOP Applications: Automotive Interface: LIN (Local Interconnect Network) Voltage - Supply: 3V Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad Supplier Device Package: 24-HTSSOP Mounting Type: Surface Mount	パッケージ: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad	在庫4,144
PCA9548AD,112	NXP	IC I2C SWITCH 8CH 24-SOIC Applications: Translating Switch Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO Mounting Type: Surface Mount	パッケージ: 24-SOIC (0.295", 7.50mm Width)	在庫13,350
PCA9539PW/Q900,118	NXP	IC I2C BUS/SMBUS 16BIT 24TSSOP Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	パッケージ: 24-TSSOP (0.173", 4.40mm Width)	在庫5,008
MPC8377VRAGD	NXP	IC MPU MPC83XX 400MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫6,064
KMPC8349VVAJFB	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	パッケージ: 672-LBGA	在庫7,472
KMC9328MX1CVM15	NXP	IC MPU I.MX1 150MHZ 256MAPBGA Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 150MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touch Panel Ethernet: - SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫7,424
MPC8548VJAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,568
MPC8270CZUUPEA	NXP	IC MPU MPC82XX 450MHZ 408TBGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 450MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	パッケージ: 480-LBGA	在庫11,004
MK20DX64VMB7	NXP	IC MCU 32BIT 64KB FLASH 81MAPBGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: - Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	パッケージ: 81-LBGA	在庫3,424
MCF5272VF66R2	NXP	IC MCU 32BIT 16KB ROM 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 32 Program Memory Size: 16KB (4K x 32) Program Memory Type: ROM EEPROM Size: - RAM Size: 1K x 32 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	パッケージ: 196-LBGA	在庫6,256
MC908GZ32MFJE	NXP	IC MCU 8BIT 32KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫5,824
MC9S08AC128MFUE	NXP	IC MCU 8BIT 128KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫4,992
SPC5748GSK0AMMJ6	NXP	TRIPLE CORE 6M FLASH 768K RAM Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	パッケージ: 256-LBGA	在庫3,200
SPC5517EBMLQ66R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫6,976
LS1018ASN7PQA	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	パッケージ: -	Request a Quote
SPC5748CSK0AMKU6	NXP	IC MCU 32BIT 6MB FLASH 176LQFP Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: -	Request a Quote
LX2082RE82029B	NXP	IC MPU QORIQ LX 2GHZ 1150FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: SATA 6Gbps (4) USB: USB 3.0 (1) Voltage - I/O: - Operating Temperature: 5°C ~ 105°C (TA) Security Features: - Package / Case: 1150-FBGA Supplier Device Package: 1150-FBGA (23x23)	パッケージ: -	Request a Quote
MVR5510AMBA6ES	NXP	IC PMIC VR5510 ASIL-B Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
MWCT2016SHVPAR	NXP	MWCT2016S,MAXQFP100 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

BFT46,215

NXP

JFET N-CH 10MA 250MW SOT23

FET Type: N-Channel
Voltage - Breakdown (V(BR)GSS): -
Drain to Source Voltage (Vdss): 25V
Current - Drain (Idss) @ Vds (Vgs=0): 200µA @ 10V
Current Drain (Id) - Max: 10mA
Voltage - Cutoff (VGS off) @ Id: 1.2V @ 0.5nA
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Resistance - RDS(On): -
Power - Max: 250mW
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SOT-23 (TO-236AB)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫25,548

PHU11NQ10T,127

NXP

MOSFET N-CH 100V 10.9A SOT533

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 10.9A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 14.7nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 360pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 57.7W (Tc)
Rds On (Max) @ Id, Vgs: 180 mOhm @ 9A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: I-Pak
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA

パッケージ: TO-251-3 Short Leads, IPak, TO-251AA

在庫4,448

MRF6S9130HSR3

NXP

FET RF 68V 880MHZ NI-780S

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 19.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 950mA
Power - Output: 27W
Voltage - Rated: 68V
Package / Case: NI-780S
Supplier Device Package: NI-780S

パッケージ: NI-780S

在庫6,496

2N3904,116

NXP

TRANS NPN 40V 0.2A TO92

Transistor Type: NPN
Current - Collector (Ic) (Max): 200mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Power - Max: 500mW
Frequency - Transition: 300MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫4,304

BB208-03,115

NXP

DIODE VAR CAP 10V SOD-323

Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio: 5.2
Capacitance Ratio Condition: C1/C7.5
Voltage - Peak Reverse (Max): 10V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Supplier Device Package: SOD-323

パッケージ: SC-76, SOD-323

在庫84,036

MC34VR500V3ES

NXP

IC REG 9OUT BUCK/LDO 56QFN

Topology: Step-Down (Buck) (4), Linear (LDO) (5)
Function: Communications Processors
Number of Outputs: 9
Frequency - Switching: 2MHz
Voltage/Current - Output 1: 0.625 V ~ 1.875 V, 4.5A
Voltage/Current - Output 2: 0.625 V ~ 1.975 V, 2A
Voltage/Current - Output 3: 0.625 V ~ 1.975 V, 2.5A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Voltage - Supply: 2.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

パッケージ: 56-VFQFN Exposed Pad

在庫7,692

74HC258DB,118

NXP

IC QUAD 2-IN MUX 3-ST INV 16SSOP

Type: Multiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 16-SSOP

パッケージ: 16-SSOP (0.209", 5.30mm Width)

在庫2,416

HEF4071BP,652

NXP

IC GATE OR 4CH 2-INP 14-DIP

Logic Type: OR Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): 4µA
Current - Output High, Low: 3.4mA, 3.4mA
Logic Level - Low: 1.5 V ~ 4 V
Logic Level - High: 3.5 V ~ 11 V
Max Propagation Delay @ V, Max CL: 35ns @ 15V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

パッケージ: 14-DIP (0.300", 7.62mm)

在庫6,112

74HC85N,652

NXP

IC COMPARATOR MAGNITUDE 4B 16DIP

Type: Magnitude Comparator
Number of Bits: 4
Output: Active High
Output Function: A<B, A=B, A>B
Voltage - Supply: 2 V ~ 6 V
Current - Output High, Low: 5.2mA, 5.2mA
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Current - Quiescent (Iq): 8µA
Operating Temperature: -40°C ~ 125°C
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole

パッケージ: 16-DIP (0.300", 7.62mm)

在庫4,576

UJA1069TW24/3V0:51

NXP

IC LIN FAIL-SAFE 24-HTSSOP

Applications: Automotive
Interface: LIN (Local Interconnect Network)
Voltage - Supply: 3V
Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Supplier Device Package: 24-HTSSOP
Mounting Type: Surface Mount

パッケージ: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad

在庫4,144

PCA9548AD,112

NXP

IC I2C SWITCH 8CH 24-SOIC

Applications: Translating Switch
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO
Mounting Type: Surface Mount

パッケージ: 24-SOIC (0.295", 7.50mm Width)

在庫13,350

PCA9539PW/Q900,118

NXP

IC I2C BUS/SMBUS 16BIT 24TSSOP

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

パッケージ: 24-TSSOP (0.173", 4.40mm Width)

在庫5,008

MPC8377VRAGD

NXP

IC MPU MPC83XX 400MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫6,064

KMPC8349VVAJFB

NXP

IC MPU MPC83XX 533MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

パッケージ: 672-LBGA

在庫7,472

KMC9328MX1CVM15

NXP

IC MPU I.MX1 150MHZ 256MAPBGA

Core Processor: ARM920T
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 150MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Ethernet: -
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫7,424

MPC8548VJAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,568

MPC8270CZUUPEA

NXP

IC MPU MPC82XX 450MHZ 408TBGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 450MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

パッケージ: 480-LBGA

在庫11,004

MK20DX64VMB7

NXP

IC MCU 32BIT 64KB FLASH 81MAPBGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

パッケージ: 81-LBGA

在庫3,424

MCF5272VF66R2

NXP

IC MCU 32BIT 16KB ROM 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Number of I/O: 32
Program Memory Size: 16KB (4K x 32)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 1K x 32
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

パッケージ: 196-LBGA

在庫6,256

MC908GZ32MFJE

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 21
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫5,824

MC9S08AC128MFUE

NXP

IC MCU 8BIT 128KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫4,992

SPC5748GSK0AMMJ6

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: 256-LBGA

在庫3,200

SPC5517EBMLQ66R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫6,976

LS1018ASN7PQA

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

パッケージ: -

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SPC5748CSK0AMKU6

NXP

IC MCU 32BIT 6MB FLASH 176LQFP

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 48x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: -

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LX2082RE82029B

NXP

IC MPU QORIQ LX 2GHZ 1150FBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 8 Core, 64-Bit
Speed: 2GHz
Co-Processors/DSP: -
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: SATA 6Gbps (4)
USB: USB 3.0 (1)
Voltage - I/O: -
Operating Temperature: 5°C ~ 105°C (TA)
Security Features: -
Package / Case: 1150-FBGA
Supplier Device Package: 1150-FBGA (23x23)

パッケージ: -

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MVR5510AMBA6ES

NXP

IC PMIC VR5510 ASIL-B

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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MWCT2016SHVPAR

NXP

MWCT2016S,MAXQFP100

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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