ページ 4 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MRF21010LSR1	NXP	FET RF 65V 2.17GHZ NI-360S Transistor Type: LDMOS Frequency: 2.17GHz Gain: 13.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 10W Voltage - Rated: 65V Package / Case: NI-360S Supplier Device Package: NI-360 Short Lead	パッケージ: NI-360S	在庫27,324
MMRF1004NR1	NXP	FET RF 68V 2.17GHZ TO270-2 Transistor Type: LDMOS Frequency: 2.17GHz Gain: 15.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 130mA Power - Output: 10W Voltage - Rated: 68V Package / Case: TO-270AA Supplier Device Package: TO-270-2	パッケージ: TO-270AA	在庫5,136
BC557B,112	NXP	TRANS PNP 45V 0.1A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Power - Max: 500mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA)	在庫5,792
BZX84-B33/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 33V Tolerance: ±2% Power - Max: 250mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 50nA @ 23.1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫4,528
MMPF0100NPEPR2	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 12 Voltage - Output: Multiple Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	パッケージ: 56-VFQFN Exposed Pad	在庫6,112
PCF8578H/1,157	NXP	IC LCD DRVR ROW/CLMN 64-LQFP Display Type: LCD Configuration: Dot Matrix Interface: I2C Digits or Characters: - Current - Supply: - Voltage - Supply: 2.5 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫2,912
MHW9188N	NXP	IC CATV AMP MOD 870MHZ 7-CATV Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 425mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: Surface Mount Package / Case: Module Supplier Device Package: 7-CATV Module	パッケージ: Module	在庫3,248
SE5234N/01,112	NXP	IC OPAMP GP 2.5MHZ RRO 14DIP Amplifier Type: General Purpose Number of Circuits: 4 Output Type: Rail-to-Rail Slew Rate: 0.8 V/µs Gain Bandwidth Product: - -3db Bandwidth: 2.5MHz Current - Input Bias: 90nA Voltage - Input Offset: 200µV Current - Supply: 2.8mA Current - Output / Channel: 12mA Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	パッケージ: 14-DIP (0.300", 7.62mm)	在庫3,360
TDA8954TH/N1,112	NXP	IC AMP AUDIO CLASS D 24HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 420W x 1 @ 8 Ohm; 210W x 2 @ 4 Ohm Voltage - Supply: ±12.5 V ~ 42.5 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-HSOP Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	パッケージ: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	在庫5,280
SC26C92A1N,112	NXP	IC UART 40-DIP Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: 8 Byte Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Through Hole Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-DIP	パッケージ: 40-DIP (0.600", 15.24mm)	在庫5,808
PCAL9539AHF,128	NXP	IC I/O EXPANDER 16BIT 24HWQFN Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4)	パッケージ: 24-WFQFN Exposed Pad	在庫4,304
KMPC8349VVAGDB	NXP	IC MPU MPC83XX 400MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	パッケージ: 672-LBGA	在庫2,848
MPC8569EVJANKGB	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR2, DDR3, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (8), 1 Gbps (4) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫8,592
MCF54450VM240J	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 240MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	パッケージ: 256-LBGA	在庫5,120
SVF532R3K1CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	パッケージ: 364-LFBGA	在庫2,000
MC68HC908JB8JP	NXP	IC MCU 8BIT 8KB FLASH 20DIP Core Processor: HC08 Core Size: 8-Bit Speed: 3MHz Connectivity: USB Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	パッケージ: 20-DIP (0.300", 7.62mm)	在庫108,336
MC9S08AW16MFUE	NXP	IC MCU 8BIT 16KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	パッケージ: 64-QFP	在庫3,792
MC908QT4ACDWE	NXP	IC MCU 8BIT 4KB FLASH 8SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	パッケージ: 8-SOIC (0.209", 5.30mm Width)	在庫134,508
MPVZ5010GW6U	NXP	PRESSURE SENSOR VERT 8-SOP Pressure Type: Vented Gauge Operating Pressure: 1.45 PSI (10 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: - Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.22" (5.59mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 5.8 PSI (40 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	パッケージ: 8-SMD Module	在庫4,338
MPXHZ6400AC6T1	NXP	SENSOR PRESSURE ABS AXIAL 8-SSOP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.8 V Accuracy: ±1.5% Voltage - Supply: 4.64 V ~ 5.36 V Port Size: Male - 0.13" (3.3mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 232.06 PSI (1600 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Top Port Supplier Device Package: 8-SSOP	パッケージ: 8-SMD, Gull Wing, Top Port	在庫28,800
OM7610/BGA2771	NXP	EVAL BOARD FOR BGA2771 Type: Amplifier Frequency: 20MHz ~ 2.5GHz For Use With/Related Products: BGA2771 Supplied Contents: Board	パッケージ: -	在庫4,860
MC50XS4200CEKR2	NXP	IC SWITCH HISD 24V DUAL 32SOIC Switch Type: - Number of Outputs: - Ratio - Input:Output: - Output Configuration: - Output Type: - Interface: - Voltage - Load: - Voltage - Supply (Vcc/Vdd): - Current - Output (Max): - Rds On (Typ): - Input Type: - Features: - Fault Protection: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,824
MCIMX6D4AVT08AE	NXP	IC MPU I.MX6D ENHANCED 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: 624-FBGA, FCBGA	在庫5,680
SPC5646CCAMLT1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-TQFP (28x28)	パッケージ: 208-LQFP	在庫5,264
SPC5604BF2MLH4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫4,224
MIMX8UD5CVP08SB	NXP	8ULP DUAL CORTEX A35 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MCIMX535DVP2C2	NXP	IC MPU I.MX53 1.2GHZ 529FBGA Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19x19)	パッケージ: -	Request a Quote
BUK964R2-55B-C	NXP	N-CHANNEL TRENCHMOS LOGIC LEVEL FET Type: - Technology: - Drain to Source Voltage (Vdss): - Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: - Supplier Device Package: - Package / Case: -	パッケージ: -	Request a Quote

MRF21010LSR1

NXP

FET RF 65V 2.17GHZ NI-360S

Transistor Type: LDMOS
Frequency: 2.17GHz
Gain: 13.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 10W
Voltage - Rated: 65V
Package / Case: NI-360S
Supplier Device Package: NI-360 Short Lead

パッケージ: NI-360S

在庫27,324

MMRF1004NR1

NXP

FET RF 68V 2.17GHZ TO270-2

Transistor Type: LDMOS
Frequency: 2.17GHz
Gain: 15.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 130mA
Power - Output: 10W
Voltage - Rated: 68V
Package / Case: TO-270AA
Supplier Device Package: TO-270-2

パッケージ: TO-270AA

在庫5,136

BC557B,112

NXP

TRANS PNP 45V 0.1A TO-92

Transistor Type: PNP
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Power - Max: 500mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA)

在庫5,792

BZX84-B33/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 33V
Tolerance: ±2%
Power - Max: 250mW
Impedance (Max) (Zzt): 80 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 23.1V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫4,528

MMPF0100NPEPR2

NXP

IC PWR MGMT I.MX6 56QFN

Applications: Converter, i.MX6
Voltage - Input: 2.8 V ~ 4.5 V
Number of Outputs: 12
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

パッケージ: 56-VFQFN Exposed Pad

在庫6,112

PCF8578H/1,157

NXP

IC LCD DRVR ROW/CLMN 64-LQFP

Display Type: LCD
Configuration: Dot Matrix
Interface: I2C
Digits or Characters: -
Current - Supply: -
Voltage - Supply: 2.5 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫2,912

MHW9188N

NXP

IC CATV AMP MOD 870MHZ 7-CATV

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 425mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: Surface Mount
Package / Case: Module
Supplier Device Package: 7-CATV Module

パッケージ: Module

在庫3,248

SE5234N/01,112

NXP

IC OPAMP GP 2.5MHZ RRO 14DIP

Amplifier Type: General Purpose
Number of Circuits: 4
Output Type: Rail-to-Rail
Slew Rate: 0.8 V/µs
Gain Bandwidth Product: -
-3db Bandwidth: 2.5MHz
Current - Input Bias: 90nA
Voltage - Input Offset: 200µV
Current - Supply: 2.8mA
Current - Output / Channel: 12mA
Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

パッケージ: 14-DIP (0.300", 7.62mm)

在庫3,360

TDA8954TH/N1,112

NXP

IC AMP AUDIO CLASS D 24HSOP

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 420W x 1 @ 8 Ohm; 210W x 2 @ 4 Ohm
Voltage - Supply: ±12.5 V ~ 42.5 V
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-HSOP
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

パッケージ: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

在庫5,280

SC26C92A1N,112

NXP

IC UART 40-DIP

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 2, DUART
FIFO's: 8 Byte
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Supplier Device Package: 40-DIP

パッケージ: 40-DIP (0.600", 15.24mm)

在庫5,808

PCAL9539AHF,128

NXP

IC I/O EXPANDER 16BIT 24HWQFN

Number of I/O: 16
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-WFQFN Exposed Pad
Supplier Device Package: 24-HWQFN (4x4)

パッケージ: 24-WFQFN Exposed Pad

在庫4,304

KMPC8349VVAGDB

NXP

IC MPU MPC83XX 400MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

パッケージ: 672-LBGA

在庫2,848

MPC8569EVJANKGB

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (8), 1 Gbps (4)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫8,592

MCF54450VM240J

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V4
Core Size: 32-Bit
Speed: 240MHz
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 132
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

パッケージ: 256-LBGA

在庫5,120

SVF532R3K1CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 136
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 364-LFBGA
Supplier Device Package: 364-MAPBGA (17x17)

パッケージ: 364-LFBGA

在庫2,000

MC68HC908JB8JP

NXP

IC MCU 8BIT 8KB FLASH 20DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 3MHz
Connectivity: USB
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

パッケージ: 20-DIP (0.300", 7.62mm)

在庫108,336

MC9S08AW16MFUE

NXP

IC MCU 8BIT 16KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

パッケージ: 64-QFP

在庫3,792

MC908QT4ACDWE

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.209", 5.30mm Width)

在庫134,508

MPVZ5010GW6U

NXP

PRESSURE SENSOR VERT 8-SOP

Pressure Type: Vented Gauge
Operating Pressure: 1.45 PSI (10 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: -
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.22" (5.59mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 5.8 PSI (40 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

パッケージ: 8-SMD Module

在庫4,338

MPXHZ6400AC6T1

NXP

SENSOR PRESSURE ABS AXIAL 8-SSOP

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.8 V
Accuracy: ±1.5%
Voltage - Supply: 4.64 V ~ 5.36 V
Port Size: Male - 0.13" (3.3mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 232.06 PSI (1600 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Top Port
Supplier Device Package: 8-SSOP

パッケージ: 8-SMD, Gull Wing, Top Port

在庫28,800

OM7610/BGA2771

NXP

EVAL BOARD FOR BGA2771

Type: Amplifier
Frequency: 20MHz ~ 2.5GHz
For Use With/Related Products: BGA2771
Supplied Contents: Board

パッケージ: -

在庫4,860

MC50XS4200CEKR2

NXP

IC SWITCH HISD 24V DUAL 32SOIC

Switch Type: -
Number of Outputs: -
Ratio - Input:Output: -
Output Configuration: -
Output Type: -
Interface: -
Voltage - Load: -
Voltage - Supply (Vcc/Vdd): -
Current - Output (Max): -
Rds On (Typ): -
Input Type: -
Features: -
Fault Protection: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,824

MCIMX6D4AVT08AE

NXP

IC MPU I.MX6D ENHANCED 624FCBGA

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 852MHZ
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: 624-FBGA, FCBGA

在庫5,680

SPC5646CCAMLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

パッケージ: 208-LQFP

在庫5,264

SPC5604BF2MLH4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫4,224

MIMX8UD5CVP08SB

NXP

8ULP DUAL CORTEX A35

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

MCIMX535DVP2C2

NXP

IC MPU I.MX53 1.2GHZ 529FBGA

Core Processor: ARM® Cortex®-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100Mbps (1)
SATA: SATA 1.5Gbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature: -20°C ~ 85°C (TC)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 529-FBGA
Supplier Device Package: 529-FBGA (19x19)

パッケージ: -

Request a Quote

BUK964R2-55B-C

NXP

N-CHANNEL TRENCHMOS LOGIC LEVEL

FET Type: -
Technology: -
Drain to Source Voltage (Vdss): -
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: -
Supplier Device Package: -
Package / Case: -

パッケージ: -

Request a Quote