ページ 428 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BF245C,112	NXP	JFET N-CH 30V 25MA TO92 Transistor Type: N-Channel JFET Frequency: 100MHz Gain: - Voltage - Test: 15V Current Rating: 25mA Noise Figure: 1.5dB Current - Test: - Power - Output: - Voltage - Rated: 30V Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA)	在庫3,584
PDTA143ZK,135	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 4.7k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫3,376
PDTC144WS,126	NXP	TRANS PREBIAS NPN 500MW TO92-3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): 22k DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫6,928
BFQ67W,135	NXP	TRANS NPN 10V 20MA 8GHZ SOT323 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 10V Frequency - Transition: 8GHz Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz Gain: - Power - Max: 300mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V Current - Collector (Ic) (Max): 50mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	パッケージ: SC-70, SOT-323	在庫3,728
1PS193,135	NXP	DIODE GEN PURP 80V 215MA SMT3 Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 80V Current - Average Rectified (Io): 215mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 500nA @ 80V Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Operating Temperature - Junction: 150°C (Max)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,296
DC6M601X6/285SF	NXP	IC REG BUCK 2.85V 0.65A 6WLCSP Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Fixed Number of Outputs: 1 Voltage - Input (Min): 2.3V Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.85V Voltage - Output (Max): - Current - Output: 650mA Frequency - Switching: 6MHz Synchronous Rectifier: Yes Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (1.36x0.96)	パッケージ: 6-XFBGA, WLCSP	在庫4,896
PCA9539AHF,128	NXP	IC I/O EXPANDER I2C 24HWQFN Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4)	パッケージ: 24-WFQFN Exposed Pad	在庫98,640
P1022PSE2LFA	NXP	IC MPU Q OR IQ 1.067GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫5,248
KMPC8547EVUAUJ	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,568
KMPC860TCZQ50D4	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫3,856
MCIMX353CVM5B	NXP	IC MPU I.MX35 532MHZ 400MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 532MHz Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	パッケージ: 400-LFBGA	在庫3,328
MCIMX6G1AVM05AB	NXP	IC MPU I.MX6UL 289BGA Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: - Supplier Device Package: -	パッケージ: -	在庫5,552
MCF52211CVM66J	NXP	IC MCU 32BIT 128KB FLASH 81BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 55 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	パッケージ: 81-LBGA	在庫3,088
MC68HC908JK8CDW	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LED, LVD, POR, PWM Number of I/O: 15 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫7,168
P89LPC9351FDH,518	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x8b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	パッケージ: 28-TSSOP (0.173", 4.40mm Width)	在庫7,024
MCF5251CVM140	NXP	IC MCU 32BIT ROMLESS 225MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 140MHz Connectivity: ATA, Audio, CAN, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13)	パッケージ: 225-LFBGA	在庫71,172
LPC18S10FET180E	NXP	IC MCU 32BIT ROMLESS 180TFBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Number of I/O: 49 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 4x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	パッケージ: 180-TFBGA	在庫5,568
LPC2387FBD100,551	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 72MHz Connectivity: CAN, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 98K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫35,130
MK60DN512VLQ10	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,184
PCF8564AU/5GC/1,01	NXP	IC RTC CLK/CALENDAR I2C DIE Type: Clock/Calendar Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Memory Size: - Time Format: HH:MM:SS (24 hr) Date Format: YY-MM-DD-dd Interface: I2C, 2-Wire Serial Voltage - Supply: 1 V ~ 5.5 V Voltage - Supply, Battery: - Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	パッケージ: Die	在庫5,264
ICM7555ID,602	NXP	IC OSC SGL TIMER 500KHZ 8-SOIC Type: 555 Type, Timer/Oscillator (Single) Count: - Frequency: 500kHz Voltage - Supply: 3 V ~ 16 V Current - Supply: 180µA Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Mounting Type: Surface Mount	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫7,728
T2080NXE8PTB	NXP	QORIQ 64B POWER ARCH 8X 1.5GHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,752
MKL33Z32VLH4	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Number of I/O: 54 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫7,728
SPC5607BF1VLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫7,072
S9S12G96ACLH	NXP	16BIT 96K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫7,296
S32G378AACK1VUCR	NXP	8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: -	Request a Quote
PTN3222DUKZ	NXP	IC Type: Buffer, ReDriver Applications: USB Input: Differential Output: Differential Data Rate (Max): 480Mbps Number of Channels: 1 Delay Time: 3.0ns (Max) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Current - Supply: 11mA (Max) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 12-XFBGA, WLCSP Supplier Device Package: 12-WLCSP (1.55x1.18)	パッケージ: -	Request a Quote
MIMXRT117FDVMAA	NXP	IC MCU 32BIT EXT MEM 289LFBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 800MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Number of I/O: 13 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 2M x 8 Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14x14)	パッケージ: -	在庫2,280

BF245C,112

NXP

JFET N-CH 30V 25MA TO92

Transistor Type: N-Channel JFET
Frequency: 100MHz
Gain: -
Voltage - Test: 15V
Current Rating: 25mA
Noise Figure: 1.5dB
Current - Test: -
Power - Output: -
Voltage - Rated: 30V
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA)

在庫3,584

PDTA143ZK,135

NXP

TRANS PREBIAS PNP 250MW SMT3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 4.7k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫3,376

PDTC144WS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 47k
Resistor - Emitter Base (R2) (Ohms): 22k
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫6,928

BFQ67W,135

NXP

TRANS NPN 10V 20MA 8GHZ SOT323

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 10V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
Gain: -
Power - Max: 300mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
Current - Collector (Ic) (Max): 50mA
Operating Temperature: 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

在庫3,728

1PS193,135

NXP

DIODE GEN PURP 80V 215MA SMT3

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 80V
Current - Average Rectified (Io): 215mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 500nA @ 80V
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK
Operating Temperature - Junction: 150°C (Max)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,296

DC6M601X6/285SF

NXP

IC REG BUCK 2.85V 0.65A 6WLCSP

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Fixed
Number of Outputs: 1
Voltage - Input (Min): 2.3V
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.85V
Voltage - Output (Max): -
Current - Output: 650mA
Frequency - Switching: 6MHz
Synchronous Rectifier: Yes
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)

パッケージ: 6-XFBGA, WLCSP

在庫4,896

PCA9539AHF,128

NXP

IC I/O EXPANDER I2C 24HWQFN

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-WFQFN Exposed Pad
Supplier Device Package: 24-HWQFN (4x4)

パッケージ: 24-WFQFN Exposed Pad

在庫98,640

P1022PSE2LFA

NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫5,248

KMPC8547EVUAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,568

KMPC860TCZQ50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫3,856

MCIMX353CVM5B

NXP

IC MPU I.MX35 532MHZ 400MAPBGA

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 532MHz
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

在庫3,328

MCIMX6G1AVM05AB

NXP

IC MPU I.MX6UL 289BGA

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 528MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫5,552

MCF52211CVM66J

NXP

IC MCU 32BIT 128KB FLASH 81BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 55
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

パッケージ: 81-LBGA

在庫3,088

MC68HC908JK8CDW

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 15
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫7,168

P89LPC9351FDH,518

NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number of I/O: 26
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x8b; D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

パッケージ: 28-TSSOP (0.173", 4.40mm Width)

在庫7,024

MCF5251CVM140

NXP

IC MCU 32BIT ROMLESS 225MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 140MHz
Connectivity: ATA, Audio, CAN, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
Data Converters: A/D 6x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 225-LFBGA
Supplier Device Package: 225-MAPBGA (13x13)

パッケージ: 225-LFBGA

在庫71,172

LPC18S10FET180E

NXP

IC MCU 32BIT ROMLESS 180TFBGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O: 49
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 4x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

パッケージ: 180-TFBGA

在庫5,568

LPC2387FBD100,551

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: CAN, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 98K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 6x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫35,130

MK60DN512VLQ10

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,184

PCF8564AU/5GC/1,01

NXP

IC RTC CLK/CALENDAR I2C DIE

Type: Clock/Calendar
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Memory Size: -
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1 V ~ 5.5 V
Voltage - Supply, Battery: -
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: Die
Supplier Device Package: Die

パッケージ: Die

在庫5,264

ICM7555ID,602

NXP

IC OSC SGL TIMER 500KHZ 8-SOIC

Type: 555 Type, Timer/Oscillator (Single)
Count: -
Frequency: 500kHz
Voltage - Supply: 3 V ~ 16 V
Current - Supply: 180µA
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO
Mounting Type: Surface Mount

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫7,728

T2080NXE8PTB

NXP

QORIQ 64B POWER ARCH 8X 1.5GHZ

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,752

MKL33Z32VLH4

NXP

KINETIS L 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 54
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫7,728

SPC5607BF1VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 77
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 7x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫7,072

S9S12G96ACLH

NXP

16BIT 96K FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫7,296

S32G378AACK1VUCR

NXP

8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Speed: 400MHz, 1.3GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: -

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PTN3222DUKZ

NXP

IC

Type: Buffer, ReDriver
Applications: USB
Input: Differential
Output: Differential
Data Rate (Max): 480Mbps
Number of Channels: 1
Delay Time: 3.0ns (Max)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Current - Supply: 11mA (Max)
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 12-XFBGA, WLCSP
Supplier Device Package: 12-WLCSP (1.55x1.18)

パッケージ: -

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MIMXRT117FDVMAA

NXP

IC MCU 32BIT EXT MEM 289LFBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 13
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 2M x 8
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Data Converters: A/D 20x12b SAR; D/A 1x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Supplier Device Package: 289-LFBGA (14x14)

パッケージ: -

在庫2,280