ページ 456 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PMBFJ113,215	NXP	JFET N-CH 40V 0.3W SOT23 FET Type: N-Channel Voltage - Breakdown (V(BR)GSS): 40V Drain to Source Voltage (Vdss): 40V Current - Drain (Idss) @ Vds (Vgs=0): 2mA @ 15V Current Drain (Id) - Max: - Voltage - Cutoff (VGS off) @ Id: 3V @ 1µA Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS) Resistance - RDS(On): 100 Ohm Power - Max: 300mW Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT-23 (TO-236AB)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫3,680
MRF6S9045MR1	NXP	FET RF 68V 880MHZ TO-270-2 Transistor Type: LDMOS Frequency: 880MHz Gain: 22.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 350mA Power - Output: 10W Voltage - Rated: 68V Package / Case: TO-270-2 Supplier Device Package: TO-270-2	パッケージ: TO-270-2	在庫2,432
PZM18NB1,115	NXP	DIODE ZENER 18V 300MW SMT3 Voltage - Zener (Nom) (Vz): 18V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 70nA @ 13V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,712
N74F174D,623	NXP	IC D-TYPE POS TRG SNGL 16SOIC Function: Master Reset Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 6 Clock Frequency: 100MHz Max Propagation Delay @ V, Max CL: 10ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 45mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width)	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫2,736
74HC646N,652	NXP	IC TXRX NON-INV 3-ST 8BIT 24DIP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 24-DIP (0.600", 15.24mm) Supplier Device Package: 24-DIP	パッケージ: 24-DIP (0.600", 15.24mm)	在庫2,752
PCA9670BS,118	NXP	IC I/O EXPANDER I2C 8B 16HVQFN Number of I/O: 8 Interface: I2C Interrupt Output: No Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HVQFN (3x3)	パッケージ: 16-VFQFN Exposed Pad	在庫2,208
TJA1028TK/5V0/20,1	NXP	IC TXRX LIN SAE J2602 8HVSON Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	パッケージ: 8-VDFN Exposed Pad	在庫5,856
MPC8568ECVTAQGG	NXP	IC MPU MPC85XX 1.0GHZ 1023FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	パッケージ: 1023-BBGA, FCBGA	在庫4,000
KMPC8547HXATG	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫5,600
KMPC8245LVV300D	NXP	IC MPU MPC82XX 300MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	パッケージ: 352-LBGA	在庫2,096
T1020NSE7PQB	NXP	IC SOC 2CORE 1400MHZ SW 780FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: - RAM Controllers: DDR3L/4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (12) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	パッケージ: 780-FBGA, FCBGA	在庫6,896
SVF331R3K1CKU2	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 115 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: 176-LQFP Exposed Pad	在庫3,904
P89LPC9341FDH,512	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x8b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	パッケージ: 28-TSSOP (0.173", 4.40mm Width)	在庫4,832
MC908GR48AMFAE	NXP	IC MCU 8BIT 48KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫3,520
MC68331MEH16	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	パッケージ: 132-BQFP Bumpered	在庫4,560
MVF61NN152CMK50	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 500MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,264
LPC4078FBD80,551	NXP	IC MCU 32BIT 512KB FLASH 80LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4032 x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	パッケージ: 80-LQFP	在庫6,512
MKE04Z64VLK4	NXP	IC MCU 32BIT 64KB FLASH 80LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 71 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	パッケージ: 80-LQFP	在庫6,352
TDA8763AM/5/C4,118	NXP	IC ADC HIGH SPEED LOW PWR 28SSOP Number of Bits: 10 Sampling Rate (Per Second): 50M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: Sigma-Delta Reference Type: External Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	パッケージ: 28-SSOP (0.209", 5.30mm Width)	在庫7,360
SX5101P4T1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫4,140
SA630D/01,112	NXP	IC RF SWITCH SPDT 8-SOIC Frequency - Lower: DC Frequency - Upper: 1GHz Isolation @ Frequency: 30dB @ 900MHz (typ) Insertion Loss @ Frequency: 2dB @ 900Mhz IIP3: 33dBm (typ) Topology: Absorptive Circuit: SPDT P1dB: 18dBm (typ) P1dB Features: Single Line Control Impedance: 50 Ohm Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3 V ~ 5.5 V RF Type: General Purpose Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫12,630
TDA1593T/V3,112	NXP	IC IF AMP/DEMOD 20-SOIC Function: Demodulator, Amplifier LO Frequency: - RF Frequency: - P1dB: - Gain: - Noise Figure: - Current - Supply: 20mA Voltage - Supply: 7.5 V ~ 12 V Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫8,226
LS1048AXN7MQA	NXP	LS1048A 1200/1600 XT Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,736
LS1021ASE7MQB	NXP	LS1 32BIT ARM SOC 1.2GHZ DDR3/ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,112
S912XEQ512F1VALR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	パッケージ: 112-LQFP	在庫2,848
S912XEQ384F1VAGR	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,568
SAF4000EL-101Z53AY	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
SAF7751HV-N205W-BY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

PMBFJ113,215

NXP

JFET N-CH 40V 0.3W SOT23

FET Type: N-Channel
Voltage - Breakdown (V(BR)GSS): 40V
Drain to Source Voltage (Vdss): 40V
Current - Drain (Idss) @ Vds (Vgs=0): 2mA @ 15V
Current Drain (Id) - Max: -
Voltage - Cutoff (VGS off) @ Id: 3V @ 1µA
Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS)
Resistance - RDS(On): 100 Ohm
Power - Max: 300mW
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SOT-23 (TO-236AB)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫3,680

MRF6S9045MR1

NXP

FET RF 68V 880MHZ TO-270-2

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 22.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 350mA
Power - Output: 10W
Voltage - Rated: 68V
Package / Case: TO-270-2
Supplier Device Package: TO-270-2

パッケージ: TO-270-2

在庫2,432

PZM18NB1,115

NXP

DIODE ZENER 18V 300MW SMT3

Voltage - Zener (Nom) (Vz): 18V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 20 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 13V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,712

N74F174D,623

NXP

IC D-TYPE POS TRG SNGL 16SOIC

Function: Master Reset
Type: D-Type
Output Type: Non-Inverted
Number of Elements: 1
Number of Bits per Element: 6
Clock Frequency: 100MHz
Max Propagation Delay @ V, Max CL: 10ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 45mA
Input Capacitance: -
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫2,736

74HC646N,652

NXP

IC TXRX NON-INV 3-ST 8BIT 24DIP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 7.8mA, 7.8mA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 24-DIP (0.600", 15.24mm)
Supplier Device Package: 24-DIP

パッケージ: 24-DIP (0.600", 15.24mm)

在庫2,752

PCA9670BS,118

NXP

IC I/O EXPANDER I2C 8B 16HVQFN

Number of I/O: 8
Interface: I2C
Interrupt Output: No
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-HVQFN (3x3)

パッケージ: 16-VFQFN Exposed Pad

在庫2,208

TJA1028TK/5V0/20,1

NXP

IC TXRX LIN SAE J2602 8HVSON

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

パッケージ: 8-VDFN Exposed Pad

在庫5,856

MPC8568ECVTAQGG

NXP

IC MPU MPC85XX 1.0GHZ 1023FCBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

パッケージ: 1023-BBGA, FCBGA

在庫4,000

KMPC8547HXATG

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫5,600

KMPC8245LVV300D

NXP

IC MPU MPC82XX 300MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

パッケージ: 352-LBGA

在庫2,096

T1020NSE7PQB

NXP

IC SOC 2CORE 1400MHZ SW 780FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.4GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (12)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 780-FBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

パッケージ: 780-FBGA, FCBGA

在庫6,896

SVF331R3K1CKU2

NXP

IC MCU 32BIT ROMLESS 176LQFP

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 266MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 115
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: 176-LQFP Exposed Pad

在庫3,904

P89LPC9341FDH,512

NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x8b; D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

パッケージ: 28-TSSOP (0.173", 4.40mm Width)

在庫4,832

MC908GR48AMFAE

NXP

IC MCU 8BIT 48KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 37
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫3,520

MC68331MEH16

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

パッケージ: 132-BQFP Bumpered

在庫4,560

MVF61NN152CMK50

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 500MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,264

LPC4078FBD80,551

NXP

IC MCU 32BIT 512KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

在庫6,512

MKE04Z64VLK4

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 71
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

パッケージ: 80-LQFP

在庫6,352

TDA8763AM/5/C4,118

NXP

IC ADC HIGH SPEED LOW PWR 28SSOP

Number of Bits: 10
Sampling Rate (Per Second): 50M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: Sigma-Delta
Reference Type: External
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

パッケージ: 28-SSOP (0.209", 5.30mm Width)

在庫7,360

SX5101P4T1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫4,140

SA630D/01,112

NXP

IC RF SWITCH SPDT 8-SOIC

Frequency - Lower: DC
Frequency - Upper: 1GHz
Isolation @ Frequency: 30dB @ 900MHz (typ)
Insertion Loss @ Frequency: 2dB @ 900Mhz
IIP3: 33dBm (typ)
Topology: Absorptive
Circuit: SPDT
P1dB: 18dBm (typ) P1dB
Features: Single Line Control
Impedance: 50 Ohm
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3 V ~ 5.5 V
RF Type: General Purpose
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫12,630

TDA1593T/V3,112

NXP

IC IF AMP/DEMOD 20-SOIC

Function: Demodulator, Amplifier
LO Frequency: -
RF Frequency: -
P1dB: -
Gain: -
Noise Figure: -
Current - Supply: 20mA
Voltage - Supply: 7.5 V ~ 12 V
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫8,226

LS1048AXN7MQA

NXP

LS1048A 1200/1600 XT

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,736

LS1021ASE7MQB

NXP

LS1 32BIT ARM SOC 1.2GHZ DDR3/

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,112

S912XEQ512F1VALR

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

パッケージ: 112-LQFP

在庫2,848

S912XEQ384F1VAGR

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,568

SAF4000EL-101Z53AY

NXP

SAF4000EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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SAF7751HV-N205W-BY

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote