ページ 47 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
AFT21S230SR3	NXP	FET RF 65V 2.11GHZ NI780S-6 Transistor Type: LDMOS Frequency: 2.11GHz Gain: 16.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.5A Power - Output: 50W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S-6	パッケージ: NI-780S	在庫3,568
PDTA143TK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 4.7k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫5,360
PCA8533U/2DD/2,026	NXP	IC LCD DRIVER UNIV UNCASED Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C Digits or Characters: 20 Characters, 35 Characters, 320 Elements Current - Supply: 3µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	パッケージ: Die	在庫3,984
PTN3311D,112	NXP	IC XLATR PECL-LVDS LOGIC 8-SOIC Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: - Voltage - VCCB: - Input Signal: PECL Output Signal: LVDS Output Type: Differential Data Rate: 800Mbps Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫4,224
74LVC38APW,112	NXP	IC GATE NAND 4CH 2-INP 14-TSSOP Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: Open Drain Voltage - Supply: 1.2 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: -, 32mA Logic Level - Low: 0.7 V ~ 0.8 V Logic Level - High: 1.7 V ~ 2 V Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	パッケージ: 14-TSSOP (0.173", 4.40mm Width)	在庫6,640
NCX2200GF3,132	NXP	IC COMPARATOR LOW VOLTAGE 6XSON Type: General Purpose Number of Elements: 1 Output Type: Rail-to-Rail Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V Current - Output (Typ): - Current - Quiescent (Max): 6µA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Propagation Delay (Max): 800ns Hysteresis: 20mV Operating Temperature: -40°C ~ 85°C Package / Case: 6-XFDFN Mounting Type: Surface Mount Supplier Device Package: 6-XSON, SOT891 (1x1)	パッケージ: 6-XFDFN	在庫2,464
NX3L2G384GD,125	NXP	IC ANALOG SWITCH SPST XSON8U Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 20 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 24ns, 7ns -3db Bandwidth: 60MHz Charge Injection: 6pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 8-XFDFN Supplier Device Package: 8-XSON, SOT996-2 (2x3)	パッケージ: 8-XFDFN	在庫3,680
MK11DX128VMC5	NXP	IC MCU 32BIT 128KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 24x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	パッケージ: 121-LFBGA	在庫5,280
S9S12P128J0VFTR	NXP	IC MCU 16BIT 128KB FLASH 48QFN Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫4,608
LPC54101J256BD64QL	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 104K x 8 Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫9,660
BZA856AL,115	NXP	TVS DIODE 5.6VWM SOT353 Type: Zener Unidirectional Channels: 4 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 5.6V Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: 24W Power Line Protection: No Applications: General Purpose Capacitance @ Frequency: 240pF @ 1MHz Operating Temperature: - Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: SOT-353	パッケージ: 5-TSSOP, SC-70-5, SOT-353	在庫5,562
MMA6827BKCWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±120g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-QFN Exposed Pad	在庫8,946
SL2S1602FUD,003	NXP	IC I-CODE ILT UNCASED WAFER Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 15693, ISO 18000-3 Interface: - Voltage - Supply: 1.5 V ~ 1.7 V Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Wafer	パッケージ: Die	在庫2,376
OM7619/BGA2003	NXP	EVAL BOARD FOR BGA2003 Type: Amplifier Frequency: 1.8GHz For Use With/Related Products: BGA2003 Supplied Contents: Board	パッケージ: -	在庫8,208
MC35FS4502CAER2	NXP	FS4500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫4,128
MC32PF3000A2EP	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: i.MX Processors Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫6,108
FS32K144HAT0MLLT	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫7,608
MK27FN2M0AVMI15	NXP	150MHZ ARM CORTEX 1.3 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Number of I/O: 120 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b Oscillator Type: Internal/External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (9x9)	パッケージ: 169-LFBGA	在庫5,456
SPC5601DF1VLL4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫4,880
MKL16Z256VMP4R	NXP	KINETIS KL16: 48MHZ CORTEX-M0+ U Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, LINbus, SPI, TSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	パッケージ: 64-LFBGA	在庫2,800
S9S12GN48BVLCR	NXP	S12 CORE64K FLASHAU Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫2,512
LS2084ASE711B	NXP	IC MPU QORIQ 2.1GHZ 1292FCPBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 2.1GHz Co-Processors/DSP: - RAM Controllers: DDR4 Graphics Acceleration: - Display & Interface Controllers: - Ethernet: 10GbE (8), 2.5GbE (16) SATA: SATA (2) USB: USB 3.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 1292-BBGA, FCBGA Supplier Device Package: 1292-FCPBGA (37.5x37.5)	パッケージ: -	Request a Quote
T4161NSN7NQB	NXP	IC MPU QORIQ T4 1.3GHZ 1932BGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 16 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1Gbps (13), 10Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FCPBGA (45x45)	パッケージ: -	Request a Quote
SP5746BHK1AMMH6R	NXP	IC MCU 32BIT 3MB FLASH 100MAPBGA Core Processor: e200z4 Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 65 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: -	Request a Quote
SAF7755EL-N207ZK	NXP	CAR DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
TDF8534BHH-N3Y	NXP	IC OP AMP CLASS D 100LQFP Type: - Output Type: - Max Output Power x Channels @ Load: - Voltage - Supply: - Features: - Mounting Type: - Operating Temperature: - Supplier Device Package: - Package / Case: -	パッケージ: -	Request a Quote
FX32K142HAT0MLLT	NXP	S32K142 ARM CORTEX-M4F, 80 MHZ, Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MFS8632BMBA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	パッケージ: -	Request a Quote

AFT21S230SR3

NXP

FET RF 65V 2.11GHZ NI780S-6

Transistor Type: LDMOS
Frequency: 2.11GHz
Gain: 16.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.5A
Power - Output: 50W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S-6

パッケージ: NI-780S

在庫3,568

PDTA143TK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 4.7k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫5,360

PCA8533U/2DD/2,026

NXP

IC LCD DRIVER UNIV UNCASED

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Digits or Characters: 20 Characters, 35 Characters, 320 Elements
Current - Supply: 3µA
Voltage - Supply: 1.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: Die
Supplier Device Package: Die

パッケージ: Die

在庫3,984

PTN3311D,112

NXP

IC XLATR PECL-LVDS LOGIC 8-SOIC

Translator Type: Mixed Signal
Channel Type: Unidirectional
Number of Circuits: 1
Channels per Circuit: 1
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: PECL
Output Signal: LVDS
Output Type: Differential
Data Rate: 800Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫4,224

74LVC38APW,112

NXP

IC GATE NAND 4CH 2-INP 14-TSSOP

Logic Type: NAND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: Open Drain
Voltage - Supply: 1.2 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: -, 32mA
Logic Level - Low: 0.7 V ~ 0.8 V
Logic Level - High: 1.7 V ~ 2 V
Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

パッケージ: 14-TSSOP (0.173", 4.40mm Width)

在庫6,640

NCX2200GF3,132

NXP

IC COMPARATOR LOW VOLTAGE 6XSON

Type: General Purpose
Number of Elements: 1
Output Type: Rail-to-Rail
Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): -
Current - Quiescent (Max): 6µA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Propagation Delay (Max): 800ns
Hysteresis: 20mV
Operating Temperature: -40°C ~ 85°C
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Supplier Device Package: 6-XSON, SOT891 (1x1)

パッケージ: 6-XFDFN

在庫2,464

NX3L2G384GD,125

NXP

IC ANALOG SWITCH SPST XSON8U

Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Number of Circuits: 2
On-State Resistance (Max): 750 mOhm
Channel-to-Channel Matching (ΔRon): 20 mOhm
Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
Voltage - Supply, Dual (V±): -
Switch Time (Ton, Toff) (Max): 24ns, 7ns
-3db Bandwidth: 60MHz
Charge Injection: 6pC
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Crosstalk: -90dB @ 100kHz
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 8-XFDFN
Supplier Device Package: 8-XSON, SOT996-2 (2x3)

パッケージ: 8-XFDFN

在庫3,680

MK11DX128VMC5

NXP

IC MCU 32BIT 128KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 24x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

パッケージ: 121-LFBGA

在庫5,280

S9S12P128J0VFTR

NXP

IC MCU 16BIT 128KB FLASH 48QFN

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 6K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫4,608

LPC54101J256BD64QL

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 50
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 104K x 8
Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫9,660

BZA856AL,115

NXP

TVS DIODE 5.6VWM SOT353

Type: Zener
Unidirectional Channels: 4
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): 5.6V
Voltage - Breakdown (Min): -
Voltage - Clamping (Max) @ Ipp: -
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: 24W
Power Line Protection: No
Applications: General Purpose
Capacitance @ Frequency: 240pF @ 1MHz
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Supplier Device Package: SOT-353

パッケージ: 5-TSSOP, SC-70-5, SOT-353

在庫5,562

MMA6827BKCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±120g
Sensitivity (LSB/g): 4.096
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-QFN Exposed Pad

在庫8,946

SL2S1602FUD,003

NXP

IC I-CODE ILT UNCASED WAFER

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 15693, ISO 18000-3
Interface: -
Voltage - Supply: 1.5 V ~ 1.7 V
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Wafer

パッケージ: Die

在庫2,376

OM7619/BGA2003

NXP

EVAL BOARD FOR BGA2003

Type: Amplifier
Frequency: 1.8GHz
For Use With/Related Products: BGA2003
Supplied Contents: Board

パッケージ: -

在庫8,208

MC35FS4502CAER2

NXP

FS4500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫4,128

MC32PF3000A2EP

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: i.MX Processors
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫6,108

FS32K144HAT0MLLT

NXP

S32K144 32-BIT MCU, ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫7,608

MK27FN2M0AVMI15

NXP

150MHZ ARM CORTEX 1.3

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 150MHz
Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Number of I/O: 120
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b
Oscillator Type: Internal/External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 169-LFBGA
Supplier Device Package: 169-MAPBGA (9x9)

パッケージ: 169-LFBGA

在庫5,456

SPC5601DF1VLL4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫4,880

MKL16Z256VMP4R

NXP

KINETIS KL16: 48MHZ CORTEX-M0+ U

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LFBGA
Supplier Device Package: 64-MAPBGA (5x5)

パッケージ: 64-LFBGA

在庫2,800

S9S12GN48BVLCR

NXP

S12 CORE64K FLASHAU

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫2,512

LS2084ASE711B

NXP

IC MPU QORIQ 2.1GHZ 1292FCPBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 8 Core, 64-Bit
Speed: 2.1GHz
Co-Processors/DSP: -
RAM Controllers: DDR4
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: 10GbE (8), 2.5GbE (16)
SATA: SATA (2)
USB: USB 3.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 1292-BBGA, FCBGA
Supplier Device Package: 1292-FCPBGA (37.5x37.5)

パッケージ: -

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T4161NSN7NQB

NXP

IC MPU QORIQ T4 1.3GHZ 1932BGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 16 Core, 64-Bit
Speed: 1.3GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1Gbps (13), 10Gbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FCPBGA (45x45)

パッケージ: -

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SP5746BHK1AMMH6R

NXP

IC MCU 32BIT 3MB FLASH 100MAPBGA

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 65
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: -

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SAF7755EL-N207ZK

NXP

CAR DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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TDF8534BHH-N3Y

NXP

IC OP AMP CLASS D 100LQFP

Type: -
Output Type: -
Max Output Power x Channels @ Load: -
Voltage - Supply: -
Features: -
Mounting Type: -
Operating Temperature: -
Supplier Device Package: -
Package / Case: -

パッケージ: -

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FX32K142HAT0MLLT

NXP

S32K142 ARM CORTEX-M4F, 80 MHZ,

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MFS8632BMBA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

パッケージ: -

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