NXP 製品

BZX84-C39/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 39V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 27.3V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

MPC184VFB

NXP

IC SECURITY PROCESSOR 252BGA

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

LD6835K/31HX

NXP

IC REG LINEAR 3.1V 300MA 4HXSON

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.1V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.24V @ 300mA (Typ)
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 75µA
• PSRR: 75dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Soft Start
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XDFN Exposed Pad
• Supplier Device Package: 4-HXSON (1x1)

パッケージ: 4-XDFN Exposed Pad

CBTD16213DGG,118

NXP

IC FET BUS EXCH SWCH 56-TSSOP

• Type: Bus FET Exchange Switch
• Circuit: 12 x 2:2
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

パッケージ: 56-TFSOP (0.240", 6.10mm Width)

N74F579D,623

NXP

IC COUNTER 8BIT BINARY 20SOIC

• Logic Type: Binary Counter
• Direction: Up, Down
• Number of Elements: 1
• Number of Bits per Element: 8
• Reset: Asynchronous
• Timing: Synchronous
• Count Rate: 115MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

74LVC2952ADB,112

NXP

IC REGISTERED TXRX 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

パッケージ: 24-SSOP (0.209", 5.30mm Width)

HEF4050BP,652

NXP

IC BUFFER HEX NON-INV 16DIP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 6
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 20mA
• Voltage - Supply: 3 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

BGO387,112

NXP

IC AMP OPT RCVR SFO8

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 190mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115U
• Supplier Device Package: SOT115U

パッケージ: SOT-115U

TDF8546J/N1,112

NXP

IC AUDIO AMP I2C BUS CTRL DBS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Through Hole
• Operating Temperature: -
• Supplier Device Package: DBS27P
• Package / Case: 27-SIP, Formed Leads

パッケージ: 27-SIP, Formed Leads

PCA9544APW,112

NXP

IC I2C MUX 4CH BI-DIR 20-TSSOP

• Applications: Translating Switch
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP
• Mounting Type: Surface Mount

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

PCAL9538APWJ

NXP

IC GPIO EXPANDER 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

KMC7448VU1400ND

NXP

IC MPU MPC74XX 1.4GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

パッケージ: 360-CBGA, FCCBGA

KMPC8245LZU266D

NXP

IC MPU MPC82XX 266MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

パッケージ: 352-LBGA

MPC859DSLCZP50A

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

SPC5747CK1CMJ6

NXP

IC MCU 32BIT 4MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

パッケージ: 256-LBGA

MCHC908QT2CDWER

NXP

IC MCU 8BIT 1.5KB FLASH 8SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.209", 5.30mm Width)

MKL24Z64VLK4

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 14x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

MKL15Z64VLH4

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

MC68HC908QY1CDTE

NXP

IC MCU 8BIT 1.5KB FLASH 16TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

MK60FN1M0VMD12

NXP

IC MCU 32BIT 1MB FLASH 144MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 58x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

パッケージ: 144-LBGA

MMA7261Q

NXP

ACCELEROMETER 2.5-10G ANAL 16QFN

• Type: Analog
• Axis: X, Y, Z
• Acceleration Range: ±2.5g, 3.3g, 6.7g, 10g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 480 (±2.5g) ~ 120 (±10g)
• Bandwidth: 350Hz (X,Y), 150Hz (Z)
• Output Type: Analog Voltage
• Voltage - Supply: 2.2 V ~ 3.6 V
• Features: Selectable Scale, Sleep Mode
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-LQFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-LQFN Exposed Pad

MMT20303HT1

NXP

DIGITAL ATTENUATOR 50-4000MHZ

• Attenuation Value: 7dB
• Tolerance: ±0.1dB
• Frequency Range: 50MHz ~ 4GHz
• Power (Watts): -
• Impedance: 50 Ohm
• Package / Case: 16-VFQFN Exposed Pad

パッケージ: 16-VFQFN Exposed Pad

MC34VR500V6ES

NXP

REGULATOR BUCK QUAD WITH UP TO

• Applications: QorlQ LS1/T1 Communications Processors
• Current - Supply: 250µA
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (8x8)

パッケージ: 56-VFQFN Exposed Pad

TDA18267HB/C1Y

NXP

CABLE FULL SPECTRUM TRANSCEIVER

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

LS1084ASN7PTA

NXP

LS1084A 1400/1800 REV A

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

T1023NSN7PQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

MC35FS6505NAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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MC33FS8510A2ESR2

NXP

SYSTEM BASIS CHIP FS8500

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

パッケージ: -

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