ページ 515 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
ON5213,118	NXP	MOSFET RF SOT426 D2PAK Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB Supplier Device Package: SOT-426	パッケージ: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB	在庫7,552
BC847BT,115	NXP	TRANS NPN 45V 0.1A SOT416 Transistor Type: NPN Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Power - Max: 150mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	パッケージ: SC-75, SOT-416	在庫3,856
PBSS8110S,126	NXP	TRANS NPN 100V 1A TO92 Transistor Type: NPN Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 100V Vce Saturation (Max) @ Ib, Ic: 200mV @ 100mA, 1A Current - Collector Cutoff (Max): 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 250mA, 10V Power - Max: 830mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	在庫5,904
PZM3.9NB,115	NXP	DIODE ZENER 3.9V 300MW SMT3 Voltage - Zener (Nom) (Vz): 3.9V Tolerance: ±5% Power - Max: 300mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 3µA @ 1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫4,544
BB181LX,315	NXP	DIODE VHF VAR CAP 32V SOD882 Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz Capacitance Ratio: 16 Capacitance Ratio Condition: C0.5/C28 Voltage - Peak Reverse (Max): 32V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SOD-882 Supplier Device Package: SOD-882T	パッケージ: SOD-882	在庫3,360
SSTUH32864EC,518	NXP	IC BUFFER 1.8V 1/14BIT SOT536-1 Logic Type: 1:2 Configurable Registered Buffer Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	パッケージ: 96-LFBGA	在庫2,992
74HC4094N,652	NXP	IC REGISTER BUS 8STAGE 16DIP Logic Type: Shift Register Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 8 Function: Serial to Parallel, Serial Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	パッケージ: 16-DIP (0.300", 7.62mm)	在庫7,792
74HC9114N,112	NXP	IC NINE-WIDE SCHMITT TRIG 20-DIP Logic Type: Inverter Number of Circuits: 9 Number of Inputs: 9 Features: Schmitt Trigger, Open Drain Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Max): 8µA Current - Output High, Low: -, 5.2mA Logic Level - Low: - Logic Level - High: 1.5 V ~ 4.2 V Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 20-DIP Package / Case: 20-DIP (0.300", 7.62mm)	パッケージ: 20-DIP (0.300", 7.62mm)	在庫5,088
I74F657N,112	NXP	IC TRANSCVR 8BIT N-INV 24DIP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 3mA, 24mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 24-DIP (0.300", 7.62mm) Supplier Device Package: 24-DIP	パッケージ: 24-DIP (0.300", 7.62mm)	在庫2,784
NVT4556AUKZ	NXP	IC LEVEL TRANSLATOR SIM 12WLCSP Applications: SIM Card Interface: I2C Voltage - Supply: 1.55 V ~ 3.6 V Package / Case: 12-XFBGA Supplier Device Package: 12-WLCSP (1.20x1.60) Mounting Type: Surface Mount	パッケージ: 12-XFBGA	在庫6,736
PCA9674AD,518	NXP	IC I/O EXPANDER I2C 8B 16SOIC Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫7,360
MC145484ENR2	NXP	IC CODEC-FILTER PCM 5V 20-SSOP Type: PCM, Filter Data Interface: PCM Audio Interface Resolution (Bits): 13 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: - Dynamic Range, ADCs / DACs (db) Typ: - Voltage - Supply, Analog: - Voltage - Supply, Digital: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	パッケージ: 20-SSOP (0.209", 5.30mm Width)	在庫5,680
MPC8377CVRANGA	NXP	IC MPU MPC83XX 800MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫5,888
MPC8313ECZQAGDC	NXP	IC MPU MPC83XX 400MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	パッケージ: 516-BBGA Exposed Pad	在庫7,104
MKL36Z256VLL4	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 84 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫20,244
MCF51JM32VLH	NXP	IC MCU 32BIT 32KB FLASH 64LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,816
MPXV2202GC6U	NXP	PRESSURE SENSOR AXIAL 8-SOP Pressure Type: Vented Gauge Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Top Port Supplier Device Package: -	パッケージ: 8-SMD, Gull Wing, Top Port	在庫2,700
MC33596FJER2	NXP	IC RX UHF PLL TUNED 32-LQFP Frequency: 304, 315, 426, 434, 868, 915MHz Sensitivity: -104dBm Data Rate (Max): 22.4 kBaud Modulation or Protocol: FSK, OOK Applications: General Data Transfer Current - Receiving: 10.3mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (5x5)	パッケージ: 32-LQFP	在庫2,178
ON5089,115	NXP	RF IC TRANSPONDER Function: - Frequency: - RF Type: - Secondary Attributes: - Package / Case: SOT-343F Supplier Device Package: SOT-343F	パッケージ: SOT-343F	在庫23,010
MC32PF1550A0EPR2	NXP	POWER MANAGEMENT IC: 3 BUCK REGS Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	パッケージ: 40-VFQFN Exposed Pad	在庫5,168
LS1020ASE7HNB	NXP	LS1 32BIT ARM SOC 800MHZ DDR3/ Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (3) SATA: SATA 3Gbps (1) USB: USB 2.0 (1), USB 3.0 + PHY Voltage - I/O: - Operating Temperature: 0°C ~ 105°C Security Features: - Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	パッケージ: 525-FBGA, FCBGA	在庫6,780
MKL36Z256VMP4	NXP	KINETIS KL36: 48MHZ CORTEX-M0+ U Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	パッケージ: 121-LFBGA	在庫15,132
FS32K148UAT0VMHT	NXP	S32K148 100 MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: I²S, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 32x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	パッケージ: 100-LBGA	在庫7,792
FX32K144HAT0MLLT	NXP	S32K144 ARM CORTEX-M4F, 80 MHZ, Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
SAF4000EL-101S235Y	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MIMX8QM6AVUFFAB	NXP	IC MPU 266MHZ/1.2/1.6GHZ 1313BGA Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 2, 2, 4 Speed: 266MHz, 1.2GHz, 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: LPDDR4, DRAM Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: - SATA: - USB: USB (3) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TJ) Security Features: - Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29x29)	パッケージ: -	在庫273
MC33FS8420G0ES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
SAF7751HV-N205WY	NXP	DSP AUDIO MULTI-TUNER Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

ON5213,118

NXP

MOSFET RF SOT426 D2PAK

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
Supplier Device Package: SOT-426

パッケージ: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

在庫7,552

BC847BT,115

NXP

TRANS NPN 45V 0.1A SOT416

Transistor Type: NPN
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Power - Max: 150mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

パッケージ: SC-75, SOT-416

在庫3,856

PBSS8110S,126

NXP

TRANS NPN 100V 1A TO92

Transistor Type: NPN
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 100V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 250mA, 10V
Power - Max: 830mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

在庫5,904

PZM3.9NB,115

NXP

DIODE ZENER 3.9V 300MW SMT3

Voltage - Zener (Nom) (Vz): 3.9V
Tolerance: ±5%
Power - Max: 300mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 3µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫4,544

BB181LX,315

NXP

DIODE VHF VAR CAP 32V SOD882

Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio: 16
Capacitance Ratio Condition: C0.5/C28
Voltage - Peak Reverse (Max): 32V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SOD-882
Supplier Device Package: SOD-882T

パッケージ: SOD-882

在庫3,360

SSTUH32864EC,518

NXP

IC BUFFER 1.8V 1/14BIT SOT536-1

Logic Type: 1:2 Configurable Registered Buffer
Supply Voltage: 1.7 V ~ 1.9 V
Number of Bits: 25, 14
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

パッケージ: 96-LFBGA

在庫2,992

74HC4094N,652

NXP

IC REGISTER BUS 8STAGE 16DIP

Logic Type: Shift Register
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 8
Function: Serial to Parallel, Serial
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

在庫7,792

74HC9114N,112

NXP

IC NINE-WIDE SCHMITT TRIG 20-DIP

Logic Type: Inverter
Number of Circuits: 9
Number of Inputs: 9
Features: Schmitt Trigger, Open Drain
Voltage - Supply: 2 V ~ 6 V
Current - Quiescent (Max): 8µA
Current - Output High, Low: -, 5.2mA
Logic Level - Low: -
Logic Level - High: 1.5 V ~ 4.2 V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Supplier Device Package: 20-DIP
Package / Case: 20-DIP (0.300", 7.62mm)

パッケージ: 20-DIP (0.300", 7.62mm)

在庫5,088

I74F657N,112

NXP

IC TRANSCVR 8BIT N-INV 24DIP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 3mA, 24mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 24-DIP (0.300", 7.62mm)
Supplier Device Package: 24-DIP

パッケージ: 24-DIP (0.300", 7.62mm)

在庫2,784

NVT4556AUKZ

NXP

IC LEVEL TRANSLATOR SIM 12WLCSP

Applications: SIM Card
Interface: I2C
Voltage - Supply: 1.55 V ~ 3.6 V
Package / Case: 12-XFBGA
Supplier Device Package: 12-WLCSP (1.20x1.60)
Mounting Type: Surface Mount

パッケージ: 12-XFBGA

在庫6,736

PCA9674AD,518

NXP

IC I/O EXPANDER I2C 8B 16SOIC

Number of I/O: 8
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫7,360

MC145484ENR2

NXP

IC CODEC-FILTER PCM 5V 20-SSOP

Type: PCM, Filter
Data Interface: PCM Audio Interface
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
S/N Ratio, ADCs / DACs (db) Typ: -
Dynamic Range, ADCs / DACs (db) Typ: -
Voltage - Supply, Analog: -
Voltage - Supply, Digital: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 20-SSOP

パッケージ: 20-SSOP (0.209", 5.30mm Width)

在庫5,680

MPC8377CVRANGA

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫5,888

MPC8313ECZQAGDC

NXP

IC MPU MPC83XX 400MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

パッケージ: 516-BBGA Exposed Pad

在庫7,104

MKL36Z256VLL4

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 84
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫20,244

MCF51JM32VLH

NXP

IC MCU 32BIT 32KB FLASH 64LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 51
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,816

MPXV2202GC6U

NXP

PRESSURE SENSOR AXIAL 8-SOP

Pressure Type: Vented Gauge
Operating Pressure: 29.01 PSI (200 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Top Port
Supplier Device Package: -

パッケージ: 8-SMD, Gull Wing, Top Port

在庫2,700

MC33596FJER2

NXP

IC RX UHF PLL TUNED 32-LQFP

Frequency: 304, 315, 426, 434, 868, 915MHz
Sensitivity: -104dBm
Data Rate (Max): 22.4 kBaud
Modulation or Protocol: FSK, OOK
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (5x5)

パッケージ: 32-LQFP

在庫2,178

ON5089,115

NXP

RF IC TRANSPONDER

Function: -
Frequency: -
RF Type: -
Secondary Attributes: -
Package / Case: SOT-343F
Supplier Device Package: SOT-343F

パッケージ: SOT-343F

在庫23,010

MC32PF1550A0EPR2

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

パッケージ: 40-VFQFN Exposed Pad

在庫5,168

LS1020ASE7HNB

NXP

LS1 32BIT ARM SOC 800MHZ DDR3/

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (3)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (1), USB 3.0 + PHY
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C
Security Features: -
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

パッケージ: 525-FBGA, FCBGA

在庫6,780

MKL36Z256VMP4

NXP

KINETIS KL36: 48MHZ CORTEX-M0+ U

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O: 50
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

パッケージ: 121-LFBGA

在庫15,132

FS32K148UAT0VMHT

NXP

S32K148 100 MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 32x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

パッケージ: 100-LBGA

在庫7,792

FX32K144HAT0MLLT

NXP

S32K144 ARM CORTEX-M4F, 80 MHZ,

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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SAF4000EL-101S235Y

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MIMX8QM6AVUFFAB

NXP

IC MPU 266MHZ/1.2/1.6GHZ 1313BGA

Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width: 2, 2, 4
Speed: 266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: LPDDR4, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: USB (3)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: -
Package / Case: 1313-BFBGA
Supplier Device Package: 1313-BGA (29x29)

パッケージ: -

在庫273

MC33FS8420G0ES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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SAF7751HV-N205WY

NXP

DSP AUDIO MULTI-TUNER

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote