ページ 527 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
MC34FS6408NAE	NXP	IC SYSTEM BASIS CHIP CAN 48LQFP Applications: System Basis Chip Current - Supply: 13mA Voltage - Supply: 2.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫7,176
MC16XSD200BFK	NXP	IC SWITCH HIGH SIDE 23PQFN Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: - Output Configuration: High Side Output Type: - Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 3A Rds On (Typ): 16 mOhm Input Type: - Features: - Fault Protection: Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	パッケージ: 23-PowerQFN	在庫4,656
PCA9532PW,118	NXP	IC LED DRIVER LIN 25MA 24TSSOP Type: Power Switch Topology: - Internal Switch(s): Yes Number of Outputs: 16 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: - Current - Output / Channel: 25mA Frequency: - Dimming: I2C Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	パッケージ: 24-TSSOP (0.173", 4.40mm Width)	在庫40,068
NVT2008PW,118	NXP	IC TRANSLATOR BIDIR VOLT 20TSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 8 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Push-Pull Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫44,412
74HCT4015D,118	NXP	IC SHIFT REG 4BIT SI-PO 16SOIC Logic Type: Shift Register Output Type: Push-Pull Number of Elements: 2 Number of Bits per Element: 4 Function: Serial to Parallel Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫3,888
N74F30D,623	NXP	IC GATE NAND 1CH 8-INP 14-SO Logic Type: NAND Gate Number of Circuits: 1 Number of Inputs: 8 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	パッケージ: 14-SOIC (0.154", 3.90mm Width)	在庫6,400
74LV377PW,118	NXP	IC D-TYPE POS TRG SNGL 20TSSOP Function: Standard Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 70MHz Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 6mA, 6mA Voltage - Supply: 1 V ~ 3.6 V Current - Quiescent (Iq): 160µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width)	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫6,048
74LVC1G125GW/DG,12	NXP	IC BUFF DVR TRI-ST N-INV 5TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 32mA Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: 5-TSSOP	パッケージ: 5-TSSOP, SC-70-5, SOT-353	在庫5,648
SC16C850SVIBS,151	NXP	IC UART SINGLE W/FIFO 32-HVQFN Features: - Number of Channels: 1, UART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 20Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫2,832
PX1011A-EL1:557	NXP	IC PCI-EXPRESS X1 PHY 81-LFBGA Applications: PCI Express MAX to PCI Express PHY Interface: IEEE 1149.1 Voltage - Supply: 1.2V Package / Case: 81-LFBGA Supplier Device Package: 81-LFBGA (9x9) Mounting Type: Surface Mount	パッケージ: 81-LFBGA	在庫7,616
KXPC823VR81B2T	NXP	IC MPU MPC8XX 81MHZ 256BGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 81MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	パッケージ: 256-BBGA	在庫6,336
P3041NXN7MMC	NXP	IC MPU Q OR IQ 1.2GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	パッケージ: 1295-BBGA, FCBGA	在庫6,464
MPC8536EAVJAKGA	NXP	IC MPU SOC 32BIT 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫4,208
MPC8245LVV266D	NXP	IC MPU MPC82XX 266MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	パッケージ: 352-LBGA	在庫6,640
MC9RS08KB8CTG	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫4,528
MKL14Z64VFM4	NXP	IC MCU 32BIT 64KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	パッケージ: 32-VFQFN Exposed Pad	在庫5,184
MCHC908QT4CDWE	NXP	IC MCU 8BIT 4KB FLASH 8SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	パッケージ: 8-SOIC (0.209", 5.30mm Width)	在庫131,928
KTY82/210,235	NXP	IC TEMP SENSOR SOT23 Resistance in Ohms @ 25°C: 2k Resistance Tolerance: - Operating Temperature: -55°C ~ 150°C Power - Max: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,326
TFF1018HN/N1,135	NXP	IC MIXER 10.7-12.75GHZ 16DHVQFN RF Type: Ku-Band Frequency: 10.7GHz ~ 12.75GHz Number of Mixers: 1 Gain: 45dB Noise Figure: 7dB Secondary Attributes: Down Converter Current - Supply: 52mA Voltage - Supply: 4.5 V ~ 5.5 V Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-DHVQFN (2.5x3.5)	パッケージ: 16-VFQFN Exposed Pad	在庫6,408
MC32PF3000A6EPR2	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: i.MX Processors Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	パッケージ: 48-VFQFN Exposed Pad	在庫6,080
S9S12GN16BVLC	NXP	16-BIT16K FLASH2K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫4,560
MC9S08PA4AVTGR	NXP	S08PA 8-BIT MCU S08 CORE 4KB F Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	パッケージ: 16-TSSOP (0.173", 4.40mm Width)	在庫6,336
KW45Z41052AFPBT	NXP	K4W1 40HVQFN Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Speed: 96MHz Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 22 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 14x16b SAR Oscillator Type: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	パッケージ: -	Request a Quote
LPC54605J512ET180K	NXP	IC MCU 32BIT 512KB FLSH 180TFBGA Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 145 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	パッケージ: -	Request a Quote
MC68340CAG16E-NXP	NXP	MICROPROCESSOR, 32 BIT, MC68000 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC33FS6508NAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	パッケージ: -	Request a Quote
TDF8532HH-N3Y	NXP	IC AMPLIFIER CLASS D 100HLQFP Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Voltage - Supply: 5.5V ~ 25V Features: - Mounting Type: Surface Mount Operating Temperature: - Supplier Device Package: 100-HLQFP (14x14) Package / Case: 100-FQFP Exposed Pad	パッケージ: -	Request a Quote
TJA1049T-3-1Z	NXP	IC TRANSCEIVER 1/1 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: 300 mV Data Rate: 5Mbps Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: -	Request a Quote

MC34FS6408NAE

NXP

IC SYSTEM BASIS CHIP CAN 48LQFP

Applications: System Basis Chip
Current - Supply: 13mA
Voltage - Supply: 2.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫7,176

MC16XSD200BFK

NXP

IC SWITCH HIGH SIDE 23PQFN

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: -
Output Configuration: High Side
Output Type: -
Interface: SPI
Voltage - Load: 8 V ~ 36 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 3A
Rds On (Typ): 16 mOhm
Input Type: -
Features: -
Fault Protection: Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 23-PowerQFN
Supplier Device Package: 23-PQFN (12x12)

パッケージ: 23-PowerQFN

在庫4,656

PCA9532PW,118

NXP

IC LED DRIVER LIN 25MA 24TSSOP

Type: Power Switch
Topology: -
Internal Switch(s): Yes
Number of Outputs: 16
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: -
Current - Output / Channel: 25mA
Frequency: -
Dimming: I2C
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

パッケージ: 24-TSSOP (0.173", 4.40mm Width)

在庫40,068

NVT2008PW,118

NXP

IC TRANSLATOR BIDIR VOLT 20TSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 8
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Push-Pull
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫44,412

74HCT4015D,118

NXP

IC SHIFT REG 4BIT SI-PO 16SOIC

Logic Type: Shift Register
Output Type: Push-Pull
Number of Elements: 2
Number of Bits per Element: 4
Function: Serial to Parallel
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫3,888

N74F30D,623

NXP

IC GATE NAND 1CH 8-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 1
Number of Inputs: 8
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

パッケージ: 14-SOIC (0.154", 3.90mm Width)

在庫6,400

74LV377PW,118

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

Function: Standard
Type: D-Type
Output Type: Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 70MHz
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Voltage - Supply: 1 V ~ 3.6 V
Current - Quiescent (Iq): 160µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫6,048

74LVC1G125GW/DG,12

NXP

IC BUFF DVR TRI-ST N-INV 5TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 1
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 32mA
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Supplier Device Package: 5-TSSOP

パッケージ: 5-TSSOP, SC-70-5, SOT-353

在庫5,648

SC16C850SVIBS,151

NXP

IC UART SINGLE W/FIFO 32-HVQFN

Features: -
Number of Channels: 1, UART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 20Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫2,832

PX1011A-EL1:557

NXP

IC PCI-EXPRESS X1 PHY 81-LFBGA

Applications: PCI Express MAX to PCI Express PHY
Interface: IEEE 1149.1
Voltage - Supply: 1.2V
Package / Case: 81-LFBGA
Supplier Device Package: 81-LFBGA (9x9)
Mounting Type: Surface Mount

パッケージ: 81-LFBGA

在庫7,616

KXPC823VR81B2T

NXP

IC MPU MPC8XX 81MHZ 256BGA

Core Processor: PowerPC
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 81MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Video
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

パッケージ: 256-BBGA

在庫6,336

P3041NXN7MMC

NXP

IC MPU Q OR IQ 1.2GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

パッケージ: 1295-BBGA, FCBGA

在庫6,464

MPC8536EAVJAKGA

NXP

IC MPU SOC 32BIT 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫4,208

MPC8245LVV266D

NXP

IC MPU MPC82XX 266MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

パッケージ: 352-LBGA

在庫6,640

MC9RS08KB8CTG

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 254 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫4,528

MKL14Z64VFM4

NXP

IC MCU 32BIT 64KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

パッケージ: 32-VFQFN Exposed Pad

在庫5,184

MCHC908QT4CDWE

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.209", 5.30mm Width)

在庫131,928

KTY82/210,235

NXP

IC TEMP SENSOR SOT23

Resistance in Ohms @ 25°C: 2k
Resistance Tolerance: -
Operating Temperature: -55°C ~ 150°C
Power - Max: -
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,326

TFF1018HN/N1,135

NXP

IC MIXER 10.7-12.75GHZ 16DHVQFN

RF Type: Ku-Band
Frequency: 10.7GHz ~ 12.75GHz
Number of Mixers: 1
Gain: 45dB
Noise Figure: 7dB
Secondary Attributes: Down Converter
Current - Supply: 52mA
Voltage - Supply: 4.5 V ~ 5.5 V
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-DHVQFN (2.5x3.5)

パッケージ: 16-VFQFN Exposed Pad

在庫6,408

MC32PF3000A6EPR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: i.MX Processors
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: 48-VFQFN Exposed Pad

在庫6,080

S9S12GN16BVLC

NXP

16-BIT16K FLASH2K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫4,560

MC9S08PA4AVTGR

NXP

S08PA 8-BIT MCU S08 CORE 4KB F

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

パッケージ: 16-TSSOP (0.173", 4.40mm Width)

在庫6,336

KW45Z41052AFPBT

NXP

K4W1 40HVQFN

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Speed: 96MHz
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 22
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 14x16b SAR
Oscillator Type: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

パッケージ: -

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LPC54605J512ET180K

NXP

IC MCU 32BIT 512KB FLSH 180TFBGA

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 145
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

パッケージ: -

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MC68340CAG16E-NXP

NXP

MICROPROCESSOR, 32 BIT, MC68000

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MC33FS6508NAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

パッケージ: -

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TDF8532HH-N3Y

NXP

IC AMPLIFIER CLASS D 100HLQFP

Type: Class D
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Voltage - Supply: 5.5V ~ 25V
Features: -
Mounting Type: Surface Mount
Operating Temperature: -
Supplier Device Package: 100-HLQFP (14x14)
Package / Case: 100-FQFP Exposed Pad

パッケージ: -

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TJA1049T-3-1Z

NXP

IC TRANSCEIVER 1/1 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: 300 mV
Data Rate: 5Mbps
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: -

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