ページ 543 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BC369,112	NXP	TRANS PNP 20V 1A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 20V Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V Power - Max: 830mW Frequency - Transition: 140MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	パッケージ: TO-226-3, TO-92-3 (TO-226AA)	在庫5,088
BAP51-04W,115	NXP	DIODE PIN GP 50V 50MA SOT323 Diode Type: PIN - 1 Pair Series Connection Voltage - Peak Reverse (Max): 50V Current - Max: 50mA Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz Power Dissipation (Max): 240mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	パッケージ: SC-70, SOT-323	在庫4,240
N74F153D,623	NXP	IC MULTIPLEXER DUAL 4IN 16SOIC Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫3,648
MC33978AEK	NXP	IC INTERFACE SW DETECT 32-SOIC Applications: Multiple Switch Detection Interface: SPI Voltage - Supply: 3 V ~ 5.25 V Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	在庫15,096
PCA9516AD,112	NXP	IC REDRIVER I2C 5CH 400KHZ 16SO Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 5 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 5mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	パッケージ: 16-SOIC (0.154", 3.90mm Width)	在庫18,504
SC18IS600IBS,151	NXP	IC SPI TO I2C BUS 24-HVQFN Protocol: I2C Function: Controller Interface: SPI Standards: - Voltage - Supply: 2.4 V ~ 3.6 V Current - Supply: 11mA Operating Temperature: -40°C ~ 85°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	パッケージ: 24-VFQFN Exposed Pad	在庫18,102
MPC8547EVTAUJD	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,504
MCC5E0RX266WB0B	NXP	IC MPU 266MHZ 840FCCBGA Core Processor: - Number of Cores/Bus Width: - Speed: 266MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TJ) Security Features: - Package / Case: 840-BCBGA Exposed Pad, FCCBGA Supplier Device Package: 840-FCCBGA (31x31)	パッケージ: 840-BCBGA Exposed Pad, FCCBGA	在庫7,440
MC68EN360VR33L	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫8,712
MPC563CVR40	NXP	IC MCU 32BIT 512KB FLASH 388BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 40MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	パッケージ: 388-BBGA	在庫2,672
MCHC912B32VFUE8	NXP	IC MCU 16BIT 32KB FLASH 80QFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 63 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 768 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫3,984
MK21DX128VLK5	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 60 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	パッケージ: 80-LQFP	在庫5,920
MC9S08AW32CFGER	NXP	IC MCU 8BIT 32KB FLASH 44LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	パッケージ: 44-LQFP	在庫4,736
LPC1102UK,118	NXP	IC MCU 32BIT 32KB FLASH 16WLCSP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 11 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 5x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-UFBGA, WLCSP Supplier Device Package: -	パッケージ: 16-UFBGA, WLCSP	在庫6,912
ADC1004S040TS/C1:1	NXP	IC ADC 10BIT PAR 40MHZ 28-SSOP Number of Bits: 10 Sampling Rate (Per Second): 40M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: - Reference Type: External Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	パッケージ: 28-SSOP (0.209", 5.30mm Width)	在庫5,520
MPXHZ6116A6T1	NXP	IC SENSOR IPS ABSOLUTE 8SSOP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa) Output Type: Analog Voltage Output: 0.399 V ~ 4.645 V Accuracy: ±1.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SSOP	パッケージ: 8-SOIC (0.295", 7.50mm Width)	在庫8,874
MMA6826AKGCWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±60g Sensitivity (LSB/g): 8.192 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	パッケージ: 16-QFN Exposed Pad	在庫6,354
MMA1211EG	NXP	ACCELEROMETER 169G ANALOG 16SOIC Type: Analog Axis: Z Acceleration Range: ±169g Sensitivity (LSB/g): - Sensitivity (mV/g): 13.33 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	パッケージ: 16-SOIC (0.295", 7.50mm Width)	在庫3,456
MPXV8500DK016T1	NXP	IC PRESSURE SENSOR Frequency: 315MHz, 434MHz Applications: TPM (Tire Pressure Monitor) Modulation or Protocol: FSK, OOK Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: 8kB Flash, 512B SRAM Features: - Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 32-QFN Exposed Pad	パッケージ: 32-QFN Exposed Pad	在庫6,354
MCIMX6U1AVM08AD	NXP	I.MX6 DL ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	パッケージ: 624-LFBGA	在庫6,384
SPC5673FK0MVY2R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	パッケージ: 516-BBGA	在庫4,560
MC56F8023VLCR	NXP	16-BIT DSC 56800E CORE 32KB FL Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (16K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫6,944
S9S08DV96F2CLFR	NXP	8-BIT MCU S08 CORE 96KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫2,928
K32L3A60VPJ1AT	NXP	IC MCU 32B 1.25MB FLASH 176VFBGA Core Processor: ARM® Cortex®-M4/M0+ Core Size: 32-Bit Dual-Core Speed: 72MHz Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH EEPROM Size: 48K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-VFBGA Supplier Device Package: 176-VFBGA (9x9)	パッケージ: -	Request a Quote
MC33FS8510A3ESR2	NXP	SYSTEM BASIS CHIP FS8510 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
NXH2180UK-518	NXP	MI-RADIO TRANSCEIVER WITH FLASH Logic Type: - Number of Elements: - Number of Bits per Element: - Input Type: - Output Type: - Current - Output High, Low: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
MC33771CTP2AE	NXP	BATTERY CELL CONTROLLER, PREMIUM Function: Battery Cell Controller Battery Chemistry: Lithium Ion Number of Cells: 7 ~ 14 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote
SPC5746BSK1AVKU2	NXP	IC MCU 32BIT 3MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Single-Core Speed: 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	パッケージ: -	Request a Quote
SAF7770EL-101Z120Y	NXP	SAF7770EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	パッケージ: -	Request a Quote
MIMX8ML8DVNLZCB	NXP	IC Architecture: DSP, MCU, MPU Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP Flash Size: - RAM Size: 868KB Peripherals: DMA, PWM, WDT Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART Speed: 1.8GHz, 800MHz Primary Attributes: - Operating Temperature: 0°C ~ 95°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote

BC369,112

NXP

TRANS PNP 20V 1A TO-92

Transistor Type: PNP
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
Power - Max: 830mW
Frequency - Transition: 140MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

パッケージ: TO-226-3, TO-92-3 (TO-226AA)

在庫5,088

BAP51-04W,115

NXP

DIODE PIN GP 50V 50MA SOT323

Diode Type: PIN - 1 Pair Series Connection
Voltage - Peak Reverse (Max): 50V
Current - Max: 50mA
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
Power Dissipation (Max): 240mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

パッケージ: SC-70, SOT-323

在庫4,240

N74F153D,623

NXP

IC MULTIPLEXER DUAL 4IN 16SOIC

Type: Multiplexer
Circuit: 2 x 4:1
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫3,648

MC33978AEK

NXP

IC INTERFACE SW DETECT 32-SOIC

Applications: Multiple Switch Detection
Interface: SPI
Voltage - Supply: 3 V ~ 5.25 V
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

パッケージ: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

在庫15,096

PCA9516AD,112

NXP

IC REDRIVER I2C 5CH 400KHZ 16SO

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 5
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 6pF
Voltage - Supply: 3 V ~ 3.6 V
Current - Supply: 5mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

パッケージ: 16-SOIC (0.154", 3.90mm Width)

在庫18,504

SC18IS600IBS,151

NXP

IC SPI TO I2C BUS 24-HVQFN

Protocol: I2C
Function: Controller
Interface: SPI
Standards: -
Voltage - Supply: 2.4 V ~ 3.6 V
Current - Supply: 11mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

パッケージ: 24-VFQFN Exposed Pad

在庫18,102

MPC8547EVTAUJD

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,504

MCC5E0RX266WB0B

NXP

IC MPU 266MHZ 840FCCBGA

Core Processor: -
Number of Cores/Bus Width: -
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: -
Package / Case: 840-BCBGA Exposed Pad, FCCBGA
Supplier Device Package: 840-FCCBGA (31x31)

パッケージ: 840-BCBGA Exposed Pad, FCCBGA

在庫7,440

MC68EN360VR33L

NXP

IC MPU M683XX 33MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫8,712

MPC563CVR40

NXP

IC MCU 32BIT 512KB FLASH 388BGA

Core Processor: PowerPC
Core Size: 32-Bit
Speed: 40MHz
Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
Data Converters: A/D 32x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

パッケージ: 388-BBGA

在庫2,672

MCHC912B32VFUE8

NXP

IC MCU 16BIT 32KB FLASH 80QFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 63
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 768 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫3,984

MK21DX128VLK5

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

パッケージ: 80-LQFP

在庫5,920

MC9S08AW32CFGER

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

パッケージ: 44-LQFP

在庫4,736

LPC1102UK,118

NXP

IC MCU 32BIT 32KB FLASH 16WLCSP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 11
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 5x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-UFBGA, WLCSP
Supplier Device Package: -

パッケージ: 16-UFBGA, WLCSP

在庫6,912

ADC1004S040TS/C1:1

NXP

IC ADC 10BIT PAR 40MHZ 28-SSOP

Number of Bits: 10
Sampling Rate (Per Second): 40M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: -
Reference Type: External
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

パッケージ: 28-SSOP (0.209", 5.30mm Width)

在庫5,520

MPXHZ6116A6T1

NXP

IC SENSOR IPS ABSOLUTE 8SSOP

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa)
Output Type: Analog Voltage
Output: 0.399 V ~ 4.645 V
Accuracy: ±1.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 8-SSOP

パッケージ: 8-SOIC (0.295", 7.50mm Width)

在庫8,874

MMA6826AKGCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±60g
Sensitivity (LSB/g): 8.192
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

パッケージ: 16-QFN Exposed Pad

在庫6,354

MMA1211EG

NXP

ACCELEROMETER 169G ANALOG 16SOIC

Type: Analog
Axis: Z
Acceleration Range: ±169g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 13.33
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

パッケージ: 16-SOIC (0.295", 7.50mm Width)

在庫3,456

MPXV8500DK016T1

NXP

IC PRESSURE SENSOR

Frequency: 315MHz, 434MHz
Applications: TPM (Tire Pressure Monitor)
Modulation or Protocol: FSK, OOK
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: 8kB Flash, 512B SRAM
Features: -
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Package / Case: 32-QFN Exposed Pad

パッケージ: 32-QFN Exposed Pad

在庫6,354

MCIMX6U1AVM08AD

NXP

I.MX6 DL ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

パッケージ: 624-LFBGA

在庫6,384

SPC5673FK0MVY2R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

パッケージ: 516-BBGA

在庫4,560

MC56F8023VLCR

NXP

16-BIT DSC 56800E CORE 32KB FL

Core Processor: 56800E
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 32KB (16K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 6x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫6,944

S9S08DV96F2CLFR

NXP

8-BIT MCU S08 CORE 96KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫2,928

K32L3A60VPJ1AT

NXP

IC MCU 32B 1.25MB FLASH 176VFBGA

Core Processor: ARM® Cortex®-M4/M0+
Core Size: 32-Bit Dual-Core
Speed: 72MHz
Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 1.25MB (1.25M x 8)
Program Memory Type: FLASH
EEPROM Size: 48K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-VFBGA
Supplier Device Package: 176-VFBGA (9x9)

パッケージ: -

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MC33FS8510A3ESR2

NXP

SYSTEM BASIS CHIP FS8510

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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NXH2180UK-518

NXP

MI-RADIO TRANSCEIVER WITH FLASH

Logic Type: -
Number of Elements: -
Number of Bits per Element: -
Input Type: -
Output Type: -
Current - Output High, Low: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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MC33771CTP2AE

NXP

BATTERY CELL CONTROLLER, PREMIUM

Function: Battery Cell Controller
Battery Chemistry: Lithium Ion
Number of Cells: 7 ~ 14
Fault Protection: Over/Under Voltage
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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SPC5746BSK1AVKU2

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

Core Processor: e200z4
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

パッケージ: -

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SAF7770EL-101Z120Y

NXP

SAF7770EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

パッケージ: -

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MIMX8ML8DVNLZCB

NXP

IC

Architecture: DSP, MCU, MPU
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Flash Size: -
RAM Size: 868KB
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Speed: 1.8GHz, 800MHz
Primary Attributes: -
Operating Temperature: 0°C ~ 95°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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