NXP 製品

BUK9E4R4-80E,127

NXP

MOSFET N-CH 80V 120A I2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 80V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 123nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 17130pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 349W (Tc)
• Rds On (Max) @ Id, Vgs: 4.2 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: I2PAK
• Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

パッケージ: TO-262-3 Long Leads, I2Pak, TO-262AA

AFT05MP075GNR1

NXP

FET RF 2CH 40V 520MHZ TO270-4

• Transistor Type: LDMOS (Dual)
• Frequency: 520MHz
• Gain: 18.5dB
• Voltage - Test: 12.5V
• Current Rating: -
• Noise Figure: -
• Current - Test: 400mA
• Power - Output: 70W
• Voltage - Rated: 40V
• Package / Case: TO-270BB
• Supplier Device Package: TO-270 WB-4 Gull

パッケージ: TO-270BB

SSL5001T/1J

NXP

IC LED DRIVER OFFL SWITCHER 8SO

• Type: AC DC Offline Switcher
• Topology: Flyback, Step-Down (Buck), Step-Up (Boost)
• Internal Switch(s): No
• Number of Outputs: 1
• Voltage - Supply (Min): 14V
• Voltage - Supply (Max): 25V
• Voltage - Output: 9 V ~ 12 V
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: Lighting
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

MCZ34653EFR2

NXP

IC HOTSWAP CTRLR 1A NEG 8-SOIC

• Type: Hot Swap Controller
• Number of Channels: 1
• Internal Switch(s): Yes
• Applications: -48V
• Features: Auto Retry, OVP, Thermal Limit, UVLO
• Programmable Features: Current Limit, Fault Timeout
• Voltage - Supply: -74 V ~ -39 V
• Current - Output (Max): 1A
• Operating Temperature: -40°C ~ 85°C
• Current - Supply: 900µA
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

パッケージ: 8-SOIC (0.154", 3.90mm Width)

TEA1738FT/N1,118

NXP

IC CTRLR SMPS GREEN OVP 8SO

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 13.2V
• Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
• Duty Cycle: 80%
• Frequency - Switching: 26.5kHz ~ 78kHz
• Power (Watts): 75W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

パッケージ: 8-SOIC (0.154", 3.90mm Width)

TEA1721AT/N1,118

NXP

IC SMPS CTLR W/PWR SWITCH 7-SOIC

• Output Isolation: -
• Internal Switch(s): Yes
• Voltage - Breakdown: 700V
• Topology: Flyback
• Voltage - Start Up: 17V
• Voltage - Supply (Vcc/Vdd): 8.5 V ~ 35 V
• Duty Cycle: 75%
• Frequency - Switching: 22.5kHz ~ 50.5kHz
• Power (Watts): 5W
• Fault Protection: Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
• Supplier Device Package: 7-SO
• Mounting Type: Surface Mount

パッケージ: 8-SOIC (0.154", 3.90mm Width) 7 leads

GTL2002DP/S440,118

NXP

IC XLATR 2BIT BI-DIREC 8-TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1V ~ 5.5V
• Voltage - VCCB: 1V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

パッケージ: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

74HC259N,652

NXP

IC ADDRESSABLE LATCH 8BIT 16DIP

• Logic Type: D-Type, Addressable
• Circuit: 1:8
• Output Type: Standard
• Voltage - Supply: 2 V ~ 6 V
• Independent Circuits: 1
• Delay Time - Propagation: 17ns
• Current - Output High, Low: 5.2mA, 5.2mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

パッケージ: 16-DIP (0.300", 7.62mm)

N74F757D,602

NXP

IC BUFF/DVR DUAL NON-INV 20SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Open Collector
• Current - Output High, Low: -, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

パッケージ: 20-SOIC (0.295", 7.50mm Width)

MCZ33904A5EK

NXP

IC SYSTEM BASIS CHIP 32-SOIC

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

パッケージ: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

TDA8025HN/C1,551

NXP

IC SMART CARD INTERFACE 32-HVQFN

• Applications: -
• Interface: Analog
• Voltage - Supply: 1.2V, 1.8V, 3V
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)
• Mounting Type: Surface Mount

パッケージ: 32-VFQFN Exposed Pad

PCA9701HF,118

NXP

IC SPI GPI 16BIT 24HWQFN

• Number of I/O: 16 (Input Only)
• Interface: SPI Serial
• Interrupt Output: Yes
• Features: -
• Output Type: Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 5MHz
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-WFQFN Exposed Pad
• Supplier Device Package: 24-HWQFN (4x4)

パッケージ: 24-WFQFN Exposed Pad

TJA1021T/20/CM,118

NXP

IC TRANSCEIVER LIN 8SOIC

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

MPC8245ARVV400D

NXP

IC MPU MPC82XX 400MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

パッケージ: 352-LBGA

MPC8306CVMADDCA

NXP

IC MPU MPC83XX 266MHZ 369BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 369-LFBGA
• Supplier Device Package: 369-PBGA (19x19)

パッケージ: 369-LFBGA

MPXS2010VMM120

NXP

IC MCU 32BIT 1MB FLASH 257MAPBGA

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

パッケージ: 257-LFBGA

P80C562EBA/02,512

NXP

IC MCU 8BIT ROMLESS 68PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (24.23x24.23)

パッケージ: 68-LCC (J-Lead)

SPC5566MVR144

NXP

IC MCU 32BIT 3MB FLASH 416BGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 144MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

パッケージ: 416-BBGA

LPC4325JET100E

NXP

IC MCU 32BIT 768KB FLASH 100BGA

• Core Processor: ARM? Cortex?-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 204MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
• Number of I/O: 49
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 4x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

パッケージ: 100-TFBGA

LPC11U14FBD48/201,

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

MSC7116VM1000

NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, I2C, UART
• Clock Rate: 266MHz
• Non-Volatile Memory: ROM (8 kB)
• On-Chip RAM: 400kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

パッケージ: 400-LFBGA

MD7IC2251GNR1

NXP

IC AMP PWR RF 2100MHZ TO270-WB14

• Frequency: 2.11GHz ~ 2.17GHz
• P1dB: 46dBm (40W)
• Gain: 29dB
• Noise Figure: -
• RF Type: W-CDMA
• Voltage - Supply: 26 V ~ 32 V
• Current - Supply: -
• Test Frequency: 2.14GHz
• Package / Case: TO-270-14 Variant, Gull Wing
• Supplier Device Package: TO-270 WB-14 GULL

パッケージ: TO-270-14 Variant, Gull Wing

MW7IC2240GNR1

NXP

IC PWR AMP RF 4W TO-270-16

• Frequency: 2.11GHz ~ 2.17GHz
• P1dB: 46dBm (40W)
• Gain: 30dB
• Noise Figure: -
• RF Type: W-CDMA
• Voltage - Supply: 32V
• Current - Supply: 420mA
• Test Frequency: 2.14GHz
• Package / Case: TO-270-16 Variant, Gull Wing
• Supplier Device Package: TO-270 WBL-16 GULL

パッケージ: TO-270-16 Variant, Gull Wing

S912XEQ384BCAAR

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

MCIMX280DVM4C

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 454MHz
• Co-Processors/DSP: Data; DCP
• RAM Controllers: LVDDR, LVDDR2, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad
• Ethernet: 10/100Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -20°C ~ 70°C (TA)
• Security Features: Boot Security, Cryptography, Hardware ID
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

パッケージ: 289-LFBGA

MC33FS8510A0ES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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LPC1114FBD48-303EL

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 42
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

パッケージ: -

MIMXRT1175DVMAA

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

• Core Processor: ARM® Cortex®-M4, Cortex®-M7
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz, 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

パッケージ: -

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