ページ 594 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
BUK7C4R5-100EJ	NXP	MOSFET N-CH 100V 169A D2PAK-7 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Surface Mount Supplier Device Package: D2PAK (7-Lead) Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	パッケージ: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	在庫5,264
MRF6S19140HR3	NXP	FET RF 68V 1.99GHZ NI-880 Transistor Type: LDMOS Frequency: 1.93GHz ~ 1.99GHz Gain: 16dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.15A Power - Output: 29W Voltage - Rated: 68V Package / Case: NI-880 Supplier Device Package: NI-880	パッケージ: NI-880	在庫2,544
MRFE6S9046GNR1	NXP	FET RF 66V 960MHZ TO-270-4 Transistor Type: LDMOS Frequency: 960MHz Gain: 19dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 35.5W Voltage - Rated: 66V Package / Case: TO-270BB Supplier Device Package: TO-270 WB-4 Gull	パッケージ: TO-270BB	在庫9,516
PVR100AZ-B12V,115	NXP	TRANS NPN 45V 0.1A SOT223 Transistor Type: NPN + Zener Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Power - Max: 550mW Frequency - Transition: - Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	パッケージ: TO-261-4, TO-261AA	在庫2,000
BB208-02,115	NXP	DIODE VAR CAP 10V 20MA SOD523 Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio: 5.2 Capacitance Ratio Condition: C1/C7.5 Voltage - Peak Reverse (Max): 10V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	パッケージ: SC-79, SOD-523	在庫24,000
MC68882CEI20A	NXP	IC FLOAT-PT COPROC 20MHZ 68PLCC Type: Floating-Point Co-Processor Applications: - Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	パッケージ: 68-LCC (J-Lead)	在庫3,360
MC33910BACR2	NXP	IC SYSTEM BASIS CHIP 32LQFP Applications: System Basis Chip Current - Supply: 4.5mA Voltage - Supply: 5.5 V ~ 27 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	パッケージ: 32-LQFP	在庫6,656
74LV139DB,112	NXP	IC DUAL 2-4 DECOD/DEMUX 16SSOP Type: Decoder/Demultiplexer Circuit: 1 x 2:4 Independent Circuits: 2 Current - Output High, Low: 12mA, 12mA Voltage Supply Source: Single Supply Voltage - Supply: 1 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	パッケージ: 16-SSOP (0.209", 5.30mm Width)	在庫2,416
MPC8308CZQAGD	NXP	IC MPU MPC83XX 400MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	パッケージ: 473-LFBGA	在庫6,512
MPC8572ELVTARLD	NXP	IC MPU MPC85XX 1.067GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	パッケージ: 1023-BFBGA, FCBGA	在庫3,808
MPC8544CVTAQG	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫6,400
MPC862TZQ80B	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫4,000
MC68030FE20C	NXP	IC MPU M680X0 20MHZ 132CQFP Core Processor: 68030 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 132-BCQFP Supplier Device Package: 132-CQFP (24x24)	パッケージ: 132-BCQFP	在庫8,928
KMPC860DTCVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	パッケージ: 357-BBGA	在庫7,264
P1013NXE2HFB	NXP	IC MPU Q OR IQ 1.055GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.055GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	パッケージ: 689-BBGA Exposed Pad	在庫5,760
PXAH30KFBE,557	NXP	IC MCU 16BIT ROMLESS 100LQFP Core Processor: XA Core Size: 16-Bit Speed: 30MHz Connectivity: EBI/EMI, UART/USART Peripherals: DMA, WDT Number of I/O: 33 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫3,872
P87C51X2BN,112	NXP	IC MCU 8BIT 4KB OTP 40DIP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-DIP	パッケージ: 40-DIP (0.600", 15.24mm)	在庫6,080
S9S08SL16F1CTJ	NXP	IC MCU 8BIT 16KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫4,976
MC9S08PA16AVWJ	NXP	IC MCU 8BIT 16KB FLASH 20SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫5,904
MC9S12XEQ512CAA	NXP	IC MCU 16BIT 512KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	パッケージ: 80-QFP	在庫17,412
MK10DN512VMD10	NXP	IC MCU 32BIT 512KB FLASH 144BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 46x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	パッケージ: 144-LBGA	在庫7,616
MPX2202A	NXP	IC PRESSURE SENSOR 4-PIN Pressure Type: Absolute Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: - Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: Through Hole Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	パッケージ: 4-SIP Module	在庫6,444
MC33772BTC0AER2	NXP	BCC6 Function: Battery Cell Controller Battery Chemistry: Lithium-Ion Number of Cells: 3 ~ 6 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP Exposed Pad	在庫3,344
FS32K144HAT0VLHT	NXP	S32K144 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫6,752
MC33PF8200DNESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
S9S12G128J0MLHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: -	Request a Quote
TEA2095T-1J	NXP	DUAL SYNCHRONOUS RECTIFICATION C Applications: Secondary-Side Controller, Synchronous Rectifier Voltage - Input: - Voltage - Supply: 4.75V ~ 38V Current - Supply: 90 µA Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: -	在庫7,440
TEF3100HN-V205K	NXP	IC 64HVQFN Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-HVQFN (9x9)	パッケージ: -	Request a Quote

BUK7C4R5-100EJ

NXP

MOSFET N-CH 100V 169A D2PAK-7

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: Surface Mount
Supplier Device Package: D2PAK (7-Lead)
Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

パッケージ: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

在庫5,264

MRF6S19140HR3

NXP

FET RF 68V 1.99GHZ NI-880

Transistor Type: LDMOS
Frequency: 1.93GHz ~ 1.99GHz
Gain: 16dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.15A
Power - Output: 29W
Voltage - Rated: 68V
Package / Case: NI-880
Supplier Device Package: NI-880

パッケージ: NI-880

在庫2,544

MRFE6S9046GNR1

NXP

FET RF 66V 960MHZ TO-270-4

Transistor Type: LDMOS
Frequency: 960MHz
Gain: 19dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 300mA
Power - Output: 35.5W
Voltage - Rated: 66V
Package / Case: TO-270BB
Supplier Device Package: TO-270 WB-4 Gull

パッケージ: TO-270BB

在庫9,516

PVR100AZ-B12V,115

NXP

TRANS NPN 45V 0.1A SOT223

Transistor Type: NPN + Zener
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Power - Max: 550mW
Frequency - Transition: -
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Supplier Device Package: SOT-223

パッケージ: TO-261-4, TO-261AA

在庫2,000

BB208-02,115

NXP

DIODE VAR CAP 10V 20MA SOD523

Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio: 5.2
Capacitance Ratio Condition: C1/C7.5
Voltage - Peak Reverse (Max): 10V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

パッケージ: SC-79, SOD-523

在庫24,000

MC68882CEI20A

NXP

IC FLOAT-PT COPROC 20MHZ 68PLCC

Type: Floating-Point Co-Processor
Applications: -
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

パッケージ: 68-LCC (J-Lead)

在庫3,360

MC33910BACR2

NXP

IC SYSTEM BASIS CHIP 32LQFP

Applications: System Basis Chip
Current - Supply: 4.5mA
Voltage - Supply: 5.5 V ~ 27 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

パッケージ: 32-LQFP

在庫6,656

74LV139DB,112

NXP

IC DUAL 2-4 DECOD/DEMUX 16SSOP

Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Independent Circuits: 2
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Voltage - Supply: 1 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 16-SSOP

パッケージ: 16-SSOP (0.209", 5.30mm Width)

在庫2,416

MPC8308CZQAGD

NXP

IC MPU MPC83XX 400MHZ 473MAPBGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

パッケージ: 473-LFBGA

在庫6,512

MPC8572ELVTARLD

NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

パッケージ: 1023-BFBGA, FCBGA

在庫3,808

MPC8544CVTAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫6,400

MPC862TZQ80B

NXP

IC MPU MPC8XX 80MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫4,000

MC68030FE20C

NXP

IC MPU M680X0 20MHZ 132CQFP

Core Processor: 68030
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 20MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 132-BCQFP
Supplier Device Package: 132-CQFP (24x24)

パッケージ: 132-BCQFP

在庫8,928

KMPC860DTCVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

パッケージ: 357-BBGA

在庫7,264

P1013NXE2HFB

NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.055GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

パッケージ: 689-BBGA Exposed Pad

在庫5,760

PXAH30KFBE,557

NXP

IC MCU 16BIT ROMLESS 100LQFP

Core Processor: XA
Core Size: 16-Bit
Speed: 30MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 33
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫3,872

P87C51X2BN,112

NXP

IC MCU 8BIT 4KB OTP 40DIP

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: 4KB (4K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 40-DIP (0.600", 15.24mm)
Supplier Device Package: 40-DIP

パッケージ: 40-DIP (0.600", 15.24mm)

在庫6,080

S9S08SL16F1CTJ

NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫4,976

MC9S08PA16AVWJ

NXP

IC MCU 8BIT 16KB FLASH 20SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫5,904

MC9S12XEQ512CAA

NXP

IC MCU 16BIT 512KB FLASH 80QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

パッケージ: 80-QFP

在庫17,412

MK10DN512VMD10

NXP

IC MCU 32BIT 512KB FLASH 144BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 46x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LBGA
Supplier Device Package: 144-MAPBGA (13x13)

パッケージ: 144-LBGA

在庫7,616

MPX2202A

NXP

IC PRESSURE SENSOR 4-PIN

Pressure Type: Absolute
Operating Pressure: 29.01 PSI (200 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -
Voltage - Supply: 10 V ~ 16 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: Through Hole
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 4-SIP Module
Supplier Device Package: -

パッケージ: 4-SIP Module

在庫6,444

MC33772BTC0AER2

NXP

BCC6

Function: Battery Cell Controller
Battery Chemistry: Lithium-Ion
Number of Cells: 3 ~ 6
Fault Protection: Over/Under Voltage
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP Exposed Pad

在庫3,344

FS32K144HAT0VLHT

NXP

S32K144 32-BIT MCU ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫6,752

MC33PF8200DNESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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S9S12G128J0MLHR

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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TEA2095T-1J

NXP

DUAL SYNCHRONOUS RECTIFICATION C

Applications: Secondary-Side Controller, Synchronous Rectifier
Voltage - Input: -
Voltage - Supply: 4.75V ~ 38V
Current - Supply: 90 µA
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: -

在庫7,440

TEF3100HN-V205K

NXP

IC 64HVQFN

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-HVQFN (9x9)

パッケージ: -

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