ページ 642 - NXP 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
PZM16NB1,115	NXP	DIODE ZENER 16V 300MW SMT3 Voltage - Zener (Nom) (Vz): 16V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 70nA @ 12V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	パッケージ: TO-236-3, SC-59, SOT-23-3	在庫7,744
NVT2001GM,115	NXP	IC TRANSLATOR DUAL 6XSON Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Push-Pull Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	パッケージ: 6-XFDFN	在庫3,040
74LV573PW,112	NXP	IC OCTAL D TRANSP LATCH 20TSSOP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 1 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 24ns Current - Output High, Low: 16mA, 16mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	パッケージ: 20-TSSOP (0.173", 4.40mm Width)	在庫2,080
74HCT688D,653	NXP	IC COMPARATOR MAGNITUDE 20SOIC Type: Identity Comparator Number of Bits: 8 Output: Active Low Output Function: A=B Voltage - Supply: 4.5 V ~ 5.5 V Current - Output High, Low: 4mA, 4mA Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF Current - Quiescent (Iq): 8µA Operating Temperature: -40°C ~ 125°C Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount	パッケージ: 20-SOIC (0.295", 7.50mm Width)	在庫2,960
BGD702N,112	NXP	IC AMPLIFIER POWER SOT-115J Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 435mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115J Supplier Device Package: SOT115J	パッケージ: SOT-115J	在庫6,128
TDA1554Q/N2,112	NXP	IC AMP AUDIO PWR 22W STER 17SIL Type: Class B Output Type: 2-Channel (Stereo) or 4-Channel (Quad) Max Output Power x Channels @ Load: 22W x 2 @ 4 Ohm; 11W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: - Supplier Device Package: DBS17P Package / Case: 17-SIP Formed Leads	パッケージ: 17-SIP Formed Leads	在庫3,264
TJA1040T/N1,112	NXP	IC CAN TRANSCEIVER HS 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	パッケージ: 8-SOIC (0.154", 3.90mm Width)	在庫4,784
MC8641VU1000NC	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	パッケージ: 994-BCBGA, FCCBGA	在庫4,608
KMPC8358VVAGDGA	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	パッケージ: 740-LBGA	在庫6,608
KMPC8545HXATG	NXP	IC MPU MPC85XX 1.2MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	パッケージ: 783-BBGA, FCBGA	在庫7,632
MC9328MXLDVP20R2	NXP	IC MPU I.MXL 200MHZ 225MAPBGA Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: - SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: -30°C ~ 70°C (TA) Security Features: - Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13)	パッケージ: 225-LFBGA	在庫2,416
PK40N512VLL100	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: 100-LQFP	在庫6,016
MC705P6ECPE	NXP	IC MCU 8BIT 4.5KB OTP 28DIP Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 176 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-PDIP	パッケージ: 28-DIP (0.600", 15.24mm)	在庫19,500
KMSC8122TMP6400V	NXP	DSP 16BIT QUAD CORE 431FCBGA Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 400MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	パッケージ: 431-BFBGA, FCBGA	在庫5,136
DSP56311VL150B1	NXP	IC DSP 24BIT 150MHZ 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 150MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 384kB Voltage - I/O: 3.30V Voltage - Core: 1.80V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	パッケージ: 196-LBGA	在庫4,896
PC270123VM	NXP	IC RF TXRX - 144-LFBGA Type: TxRx Only RF Family/Standard: - Protocol: - Modulation: - Frequency: - Data Rate (Max): - Power - Output: - Sensitivity: - Memory Size: - Serial Interfaces: - GPIO: - Voltage - Supply: 3.3V Current - Receiving: - Current - Transmitting: - Operating Temperature: - Package / Case: 144-LFBGA	パッケージ: 144-LFBGA	在庫5,418
OM7807/BGU7003W/FM50,598	NXP	RF EVAL FOR BGU7003W Type: Amplifier Frequency: 76MHz ~ 108MHz For Use With/Related Products: BGU7003W Supplied Contents: Board	パッケージ: -	在庫7,452
MCIMX6D4AVT10AER	NXP	I.MX6D ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	パッケージ: 624-FBGA, FCBGA	在庫6,544
SPC5744PK1MLQ9	NXP	IC MCU 32BIT 2.5MB FLASH 144LQFP Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 79 Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	パッケージ: 144-LQFP	在庫7,632
S912ZVML32F3WKH	NXP	MAGNIV 16-BIT MCU S12Z CORE 32 Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10x10)	パッケージ: 64-LQFP Exposed Pad	在庫4,704
S9S08RNA32W1MLH	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 55 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	パッケージ: 64-LQFP	在庫5,472
S9S08RN32W1VLF	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	パッケージ: 48-LQFP	在庫4,224
S32K322NHT0MPBST	NXP	IC MCU 32BIT 2MB FLASH 172QFP Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 160MHz Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 143 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 172-QFP Supplier Device Package: 172-QFP (16x16)	パッケージ: -	Request a Quote
PCA9601DPZ	NXP	IC REDRIVER I2C 1CH 8TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 1MHz Number of Channels: 2 Delay Time: 100ns Signal Conditioning: - Capacitance - Input: 10 pF Voltage - Supply: 2.5V ~ 15V Current - Supply: 5.5mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	パッケージ: -	在庫4,656
MC33HB2002ESR2	NXP	H-BRIDGE, SPI, BRUSHED DC MOTOR Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: SPI Technology: CMOS Step Resolution: - Applications: DC Motors Current - Output: 10A Voltage - Supply: 5V ~ 28V Voltage - Load: 5V ~ 28V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 28-VQFN Exposed Pad Supplier Device Package: 28-HVQFN (6x6)	パッケージ: -	Request a Quote
MVR5510AVMA6EP	NXP	IC PMIC VR5510 QM Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	パッケージ: -	Request a Quote
MIMXRT1015CAF4B	NXP	IC MCU 32BIT EXT MEM 100LQFP Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 57 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 9x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	パッケージ: -	Request a Quote
LS2084ASN7V17B	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 2GHz Co-Processors/DSP: - RAM Controllers: DDR4, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16) SATA: SATA 6Gbps (2) USB: USB 3.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 1292-BBGA, FCBGA Supplier Device Package: 1292-FCPBGA (37.5x37.5)	パッケージ: -	Request a Quote

PZM16NB1,115

NXP

DIODE ZENER 16V 300MW SMT3

Voltage - Zener (Nom) (Vz): 16V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 20 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 12V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

パッケージ: TO-236-3, SC-59, SOT-23-3

在庫7,744

NVT2001GM,115

NXP

IC TRANSLATOR DUAL 6XSON

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 1
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Push-Pull
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

パッケージ: 6-XFDFN

在庫3,040

74LV573PW,112

NXP

IC OCTAL D TRANSP LATCH 20TSSOP

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 1 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 24ns
Current - Output High, Low: 16mA, 16mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

パッケージ: 20-TSSOP (0.173", 4.40mm Width)

在庫2,080

74HCT688D,653

NXP

IC COMPARATOR MAGNITUDE 20SOIC

Type: Identity Comparator
Number of Bits: 8
Output: Active Low
Output Function: A=B
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Output High, Low: 4mA, 4mA
Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
Current - Quiescent (Iq): 8µA
Operating Temperature: -40°C ~ 125°C
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount

パッケージ: 20-SOIC (0.295", 7.50mm Width)

在庫2,960

BGD702N,112

NXP

IC AMPLIFIER POWER SOT-115J

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 435mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115J
Supplier Device Package: SOT115J

パッケージ: SOT-115J

在庫6,128

TDA1554Q/N2,112

NXP

IC AMP AUDIO PWR 22W STER 17SIL

Type: Class B
Output Type: 2-Channel (Stereo) or 4-Channel (Quad)
Max Output Power x Channels @ Load: 22W x 2 @ 4 Ohm; 11W x 4 @ 2 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -
Supplier Device Package: DBS17P
Package / Case: 17-SIP Formed Leads

パッケージ: 17-SIP Formed Leads

在庫3,264

TJA1040T/N1,112

NXP

IC CAN TRANSCEIVER HS 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

パッケージ: 8-SOIC (0.154", 3.90mm Width)

在庫4,784

MC8641VU1000NC

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

パッケージ: 994-BCBGA, FCCBGA

在庫4,608

KMPC8358VVAGDGA

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

パッケージ: 740-LBGA

在庫6,608

KMPC8545HXATG

NXP

IC MPU MPC85XX 1.2MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

パッケージ: 783-BBGA, FCBGA

在庫7,632

MC9328MXLDVP20R2

NXP

IC MPU I.MXL 200MHZ 225MAPBGA

Core Processor: ARM920T
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: -
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: -30°C ~ 70°C (TA)
Security Features: -
Package / Case: 225-LFBGA
Supplier Device Package: 225-MAPBGA (13x13)

パッケージ: 225-LFBGA

在庫2,416

PK40N512VLL100

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: 100-LQFP

在庫6,016

MC705P6ECPE

NXP

IC MCU 8BIT 4.5KB OTP 28DIP

Core Processor: HC05
Core Size: 8-Bit
Speed: 2.1MHz
Connectivity: SIO
Peripherals: POR, WDT
Number of I/O: 21
Program Memory Size: 4.5KB (4.5K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 176 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-DIP (0.600", 15.24mm)
Supplier Device Package: 28-PDIP

パッケージ: 28-DIP (0.600", 15.24mm)

在庫19,500

KMSC8122TMP6400V

NXP

DSP 16BIT QUAD CORE 431FCBGA

Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Clock Rate: 400MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

パッケージ: 431-BFBGA, FCBGA

在庫5,136

DSP56311VL150B1

NXP

IC DSP 24BIT 150MHZ 196-MAPBGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 150MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 384kB
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

パッケージ: 196-LBGA

在庫4,896

PC270123VM

NXP

IC RF TXRX - 144-LFBGA

Type: TxRx Only
RF Family/Standard: -
Protocol: -
Modulation: -
Frequency: -
Data Rate (Max): -
Power - Output: -
Sensitivity: -
Memory Size: -
Serial Interfaces: -
GPIO: -
Voltage - Supply: 3.3V
Current - Receiving: -
Current - Transmitting: -
Operating Temperature: -
Package / Case: 144-LFBGA

パッケージ: 144-LFBGA

在庫5,418

OM7807/BGU7003W/FM50,598

NXP

RF EVAL FOR BGU7003W

Type: Amplifier
Frequency: 76MHz ~ 108MHz
For Use With/Related Products: BGU7003W
Supplied Contents: Board

パッケージ: -

在庫7,452

MCIMX6D4AVT10AER

NXP

I.MX6D ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

パッケージ: 624-FBGA, FCBGA

在庫6,544

SPC5744PK1MLQ9

NXP

IC MCU 32BIT 2.5MB FLASH 144LQFP

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 79
Program Memory Size: 2.5MB (2.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

パッケージ: 144-LQFP

在庫7,632

S912ZVML32F3WKH

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP-EP (10x10)

パッケージ: 64-LQFP Exposed Pad

在庫4,704

S9S08RNA32W1MLH

NXP

8-BIT MCU S08 CORE 32KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 55
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: 64-LQFP

在庫5,472

S9S08RN32W1VLF

NXP

8-BIT MCU S08 CORE 32KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

パッケージ: 48-LQFP

在庫4,224

S32K322NHT0MPBST

NXP

IC MCU 32BIT 2MB FLASH 172QFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 160MHz
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 143
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

パッケージ: -

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PCA9601DPZ

NXP

IC REDRIVER I2C 1CH 8TSSOP

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 1MHz
Number of Channels: 2
Delay Time: 100ns
Signal Conditioning: -
Capacitance - Input: 10 pF
Voltage - Supply: 2.5V ~ 15V
Current - Supply: 5.5mA
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

パッケージ: -

在庫4,656

MC33HB2002ESR2

NXP

H-BRIDGE, SPI, BRUSHED DC MOTOR

Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (2)
Interface: SPI
Technology: CMOS
Step Resolution: -
Applications: DC Motors
Current - Output: 10A
Voltage - Supply: 5V ~ 28V
Voltage - Load: 5V ~ 28V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 28-VQFN Exposed Pad
Supplier Device Package: 28-HVQFN (6x6)

パッケージ: -

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MVR5510AVMA6EP

NXP

IC PMIC VR5510 QM

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

パッケージ: -

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MIMXRT1015CAF4B

NXP

IC MCU 32BIT EXT MEM 100LQFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 400MHz
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 57
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 9x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: -

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LS2084ASN7V17B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 8 Core, 64-Bit
Speed: 2GHz
Co-Processors/DSP: -
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
SATA: SATA 6Gbps (2)
USB: USB 3.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 1292-BBGA, FCBGA
Supplier Device Package: 1292-FCPBGA (37.5x37.5)

パッケージ: -

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