ページ 30 - TE Connectivity AMP Connectors 製品 - IC用ソケット、トランジスタ

2-382189-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫4,356

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Beryllium Copper

Thermoplastic

-

2069189-1

TE Connectivity AMP Connectors

CONN SOCKET LGA 1944POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1944 (G34)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫5,472

1944 (G34)

0.039" (1.00mm)

Gold

30µin (0.76µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Liquid Crystal Polymer (LCP)

-

516-AG7D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,798

16 (2 x 8)

0.100" (2.54mm)

Gold

-

Copper Alloy

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Copper Alloy

Polyester

-55°C ~ 125°C

5-1437530-2

TE Connectivity AMP Connectors

CONN IC SIP SOCKET 8POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫4,554

8 (1 x 8)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin-Lead

-

Brass

Polyester

-55°C ~ 125°C

1-390262-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: -
Operating Temperature: -40°C ~ 105°C

パッケージ: -

在庫3,598

32 (2 x 16)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

-

-40°C ~ 105°C

1-2013620-3

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 988POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 988 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫2,100

988 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Copper Alloy

Thermoplastic

-

6-6437504-2

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS SILVER

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Silver
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Silver
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Diallyl Phthalate (DAP)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,606

3 (Oval)

-

Silver

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Silver

-

Beryllium Copper

Diallyl Phthalate (DAP)

-55°C ~ 125°C

9-1437508-4

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 4 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,822

4 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8058-1G45

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 8 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,118

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8-1437504-1

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫2,178

3 (Oval)

-

Tin

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8-1437504-0

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS GOLD

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,012

3 (Oval)

-

Gold

30µin (0.76µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8-1437504-2

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫7,596

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8-1437504-3

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,406

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8-1437504-5

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫3,978

3 (Oval)

-

Tin

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

9-1437504-0

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,156

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

9-1437504-3

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫7,506

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8080-1G3-LF

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫2,520

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8080-1G2-LF

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS SILVER

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Silver
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Silver
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫2,502

3 (Oval)

-

Silver

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Silver

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8060-1G9

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Panel Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫5,022

3 (Round)

-

Gold

-

Beryllium Copper

Panel Mount

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

5-5916783-5

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 370 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫4,392

370 (19 x 19)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Copper Alloy

Liquid Crystal Polymer (LCP)

-

1-5916783-5

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 370 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫7,200

370 (19 x 19)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Copper Alloy

Liquid Crystal Polymer (LCP)

-

2-5916783-0

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 370POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 370 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

パッケージ: -

在庫8,604

370 (19 x 19)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Copper Alloy

Liquid Crystal Polymer (LCP)

-

5916657-2

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 321 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫6,840

321 (19 x 19)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Copper Alloy

Thermoplastic

-

5916657-1

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 321 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫7,164

321 (19 x 19)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Copper Alloy

Thermoplastic

-

1-2013620-2

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 988POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 988 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

パッケージ: -

在庫6,714

988 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Copper Alloy

Thermoplastic

-

1825532-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 16POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 180µin (4.57µm)
Contact Material - Post: Copper
Housing Material: Thermoplastic, Polyester
Operating Temperature: -

パッケージ: -

在庫4,122

16 (1 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

180µin (4.57µm)

Copper

Thermoplastic, Polyester

-

1-1825410-3

TE Connectivity AMP Connectors

CONN SOCKET SIP 13POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫6,966

13 (1 x 13)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 125°C

1-1825410-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 11POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,172

11 (1 x 11)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 125°C

1825410-8

TE Connectivity AMP Connectors

CONN SOCKET SIP 8POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫5,454

8 (1 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 125°C

4-1814655-6

TE Connectivity AMP Connectors

CONN SOCKET SIP 5POS TIN

Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 196.8µin (5.00µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.8µin (5.00µm)
Contact Material - Post: Brass
Housing Material: Thermoplastic, Polyester
Operating Temperature: -55°C ~ 125°C

パッケージ: -

在庫8,208

5 (1 x 5)

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

196.8µin (5.00µm)

Brass

Thermoplastic, Polyester

-55°C ~ 125°C