ページ 155 - Xilinx Inc. 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
XCMECH-FF1760	Xilinx Inc.	FF1760 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫6,608
XC17128EPC20C	Xilinx Inc.	IC SERIAL CFG PROM 128K 20-PLCC Programmable Type: OTP Memory Size: 128kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	パッケージ: 20-LCC (J-Lead)	在庫71,628
XCZU17EG-1FFVE1924I	Xilinx Inc.	IC FPGA 668 I/O 1924FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	パッケージ: 1924-BBGA, FCBGA	在庫2,464
XCZU5EV-2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	パッケージ: 784-BBGA, FCBGA	在庫4,576
XCZU2CG-1SBVA484I	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	パッケージ: 484-BBGA, FCBGA	在庫4,704
XC3S1000L-4FTG256C	Xilinx Inc.	IC FPGA 173 I/O 256FTBGA Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 173 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	パッケージ: 256-LBGA	在庫3,808
XCV50E-8FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 65536 Number of I/O: 176 Number of Gates: 71693 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-BGA	在庫7,104
XCV300-6BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 316 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	パッケージ: 432-LBGA, Metal	在庫4,224
XCV200E-7PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 158 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	パッケージ: 240-BFQFP	在庫3,200
XCV1000-4FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 131072 Number of I/O: 512 Number of Gates: 1124022 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	パッケージ: 680-LBGA Exposed Pad	在庫5,824
XC4062XL-2HQ304I	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 256 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	パッケージ: 304-BFQFP Exposed Pad	在庫2,100
XC4005E-1TQ144C	Xilinx Inc.	IC FPGA 112 I/O 144TQFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: 144-LQFP	在庫4,992
XCVU9P-2FLGA2104E	Xilinx Inc.	XCVU9P-2FLGA2104E Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Total RAM Bits: 354201600 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	在庫3,104
XC6VHX565T-2FFG1923C	Xilinx Inc.	IC FPGA 720 I/O 1923FCBGA Number of LABs/CLBs: 44280 Number of Logic Elements/Cells: 566784 Total RAM Bits: 33619968 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	パッケージ: 1924-BBGA, FCBGA	在庫6,336
XCKU095-1FFVB1760C	Xilinx Inc.	IC FPGA 702 I/O 1760FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 60518400 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	パッケージ: 1760-BBGA, FCBGA	在庫5,728
XC7VX485T-1FF1157I	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	パッケージ: 1156-BBGA, FCBGA	在庫6,992
XQ6VLX240T-1RF1156I	Xilinx Inc.	IC FPGA VIRTEX 6 241K 1156-BGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	パッケージ: 1156-BBGA, FCBGA	在庫3,360
XC5VLX110T-1FF1738I	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 5455872 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	パッケージ: 1738-BBGA, FCBGA	在庫7,312
XC5VFX70T-2FFG1136I	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	パッケージ: 1136-BBGA, FCBGA	在庫7,664
XC2VP30-5FF896C	Xilinx Inc.	IC FPGA 556 I/O 896FCBGA Number of LABs/CLBs: 3424 Number of Logic Elements/Cells: 30816 Total RAM Bits: 2506752 Number of I/O: 556 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	パッケージ: 896-BBGA, FCBGA	在庫8,280
XC6SLX100T-3FGG676I	Xilinx Inc.	IC FPGA 376 I/O 676FBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 376 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	パッケージ: 676-BGA	在庫7,296
XC7A100T-L1FGG676I	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	パッケージ: 676-BGA	在庫2,256
XC6SLX75T-2FG484I	Xilinx Inc.	IC FPGA 268 I/O 484FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 268 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA	在庫5,904
XC2VP2-6FGG256I	Xilinx Inc.	IC FPGA 140 I/O 256FGBGA Number of LABs/CLBs: 352 Number of Logic Elements/Cells: 3168 Total RAM Bits: 221184 Number of I/O: 140 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-BGA	在庫4,368
XC95288XL-10BG256I	Xilinx Inc.	IC CPLD 288MC 10NS 256BGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	パッケージ: 256-BBGA	在庫13,740
XC9536XL-10VQ44C	Xilinx Inc.	IC CPLD 36MC 10NS 44VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	パッケージ: 44-TQFP	在庫18,312
XC7A25T-L2CPG238E	Xilinx Inc.	XC7A25T-L2CPG238E Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 238-LFBGA, CSPBGA Supplier Device Package: 236-CSBGA (10x10)	パッケージ: 238-LFBGA, CSPBGA	在庫6,992
XCVU11P-2FLGA2577E	Xilinx Inc.	IC FPGA VIRTEX-UP 2577FCBGA Number of LABs/CLBs: 162000 Number of Logic Elements/Cells: 2835000 Total RAM Bits: 396150400 Number of I/O: 448 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2577-BBGA, FCBGA Supplier Device Package: 2577-FCBGA (52.5x52.5)	パッケージ: 2577-BBGA, FCBGA	在庫6,416

XCMECH-FF1760

Xilinx Inc.

FF1760 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫6,608

XC17128EPC20C

Xilinx Inc.

IC SERIAL CFG PROM 128K 20-PLCC

Programmable Type: OTP
Memory Size: 128kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

パッケージ: 20-LCC (J-Lead)

在庫71,628

XCZU17EG-1FFVE1924I

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

パッケージ: 1924-BBGA, FCBGA

在庫2,464

XCZU5EV-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

パッケージ: 784-BBGA, FCBGA

在庫4,576

XCZU2CG-1SBVA484I

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

パッケージ: 484-BBGA, FCBGA

在庫4,704

XC3S1000L-4FTG256C

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 173
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

パッケージ: 256-LBGA

在庫3,808

XCV50E-8FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 384
Number of Logic Elements/Cells: 1728
Total RAM Bits: 65536
Number of I/O: 176
Number of Gates: 71693
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-BGA

在庫7,104

XCV300-6BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 316
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

パッケージ: 432-LBGA, Metal

在庫4,224

XCV200E-7PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 158
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

パッケージ: 240-BFQFP

在庫3,200

XCV1000-4FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 6144
Number of Logic Elements/Cells: 27648
Total RAM Bits: 131072
Number of I/O: 512
Number of Gates: 1124022
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

パッケージ: 680-LBGA Exposed Pad

在庫5,824

XC4062XL-2HQ304I

Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Number of LABs/CLBs: 2304
Number of Logic Elements/Cells: 5472
Total RAM Bits: 73728
Number of I/O: 256
Number of Gates: 62000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 304-BFQFP Exposed Pad
Supplier Device Package: 304-PQFP (40x40)

パッケージ: 304-BFQFP Exposed Pad

在庫2,100

XC4005E-1TQ144C

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

在庫4,992

XCVU9P-2FLGA2104E

Xilinx Inc.

XCVU9P-2FLGA2104E

Number of LABs/CLBs: 147780
Number of Logic Elements/Cells: 2586150
Total RAM Bits: 354201600
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫3,104

XC6VHX565T-2FFG1923C

Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

Number of LABs/CLBs: 44280
Number of Logic Elements/Cells: 566784
Total RAM Bits: 33619968
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

パッケージ: 1924-BBGA, FCBGA

在庫6,336

XCKU095-1FFVB1760C

Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

Number of LABs/CLBs: 67200
Number of Logic Elements/Cells: 1176000
Total RAM Bits: 60518400
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

パッケージ: 1760-BBGA, FCBGA

在庫5,728

XC7VX485T-1FF1157I

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

パッケージ: 1156-BBGA, FCBGA

在庫6,992

XQ6VLX240T-1RF1156I

Xilinx Inc.

IC FPGA VIRTEX 6 241K 1156-BGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

パッケージ: 1156-BBGA, FCBGA

在庫3,360

XC5VLX110T-1FF1738I

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 5455872
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

パッケージ: 1738-BBGA, FCBGA

在庫7,312

XC5VFX70T-2FFG1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Number of LABs/CLBs: 5600
Number of Logic Elements/Cells: 71680
Total RAM Bits: 5455872
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

パッケージ: 1136-BBGA, FCBGA

在庫7,664

XC2VP30-5FF896C

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

Number of LABs/CLBs: 3424
Number of Logic Elements/Cells: 30816
Total RAM Bits: 2506752
Number of I/O: 556
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

パッケージ: 896-BBGA, FCBGA

在庫8,280

XC6SLX100T-3FGG676I

Xilinx Inc.

IC FPGA 376 I/O 676FBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 376
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

パッケージ: 676-BGA

在庫7,296

XC7A100T-L1FGG676I

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

パッケージ: 676-BGA

在庫2,256

XC6SLX75T-2FG484I

Xilinx Inc.

IC FPGA 268 I/O 484FBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 268
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA

在庫5,904

XC2VP2-6FGG256I

Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

Number of LABs/CLBs: 352
Number of Logic Elements/Cells: 3168
Total RAM Bits: 221184
Number of I/O: 140
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-BGA

在庫4,368

XC95288XL-10BG256I

Xilinx Inc.

IC CPLD 288MC 10NS 256BGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (27x27)

パッケージ: 256-BBGA

在庫13,740

XC9536XL-10VQ44C

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

パッケージ: 44-TQFP

在庫18,312

XC7A25T-L2CPG238E

Xilinx Inc.

XC7A25T-L2CPG238E

Number of LABs/CLBs: 1825
Number of Logic Elements/Cells: 23360
Total RAM Bits: 1658880
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 238-LFBGA, CSPBGA
Supplier Device Package: 236-CSBGA (10x10)

パッケージ: 238-LFBGA, CSPBGA

在庫6,992

XCVU11P-2FLGA2577E

Xilinx Inc.

IC FPGA VIRTEX-UP 2577FCBGA

Number of LABs/CLBs: 162000
Number of Logic Elements/Cells: 2835000
Total RAM Bits: 396150400
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2577-BBGA, FCBGA
Supplier Device Package: 2577-FCBGA (52.5x52.5)

パッケージ: 2577-BBGA, FCBGA

在庫6,416