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CY9AFB41LAPMC1-G-JNE2

Infineon Technologies

MULTI-MARKET MCUS

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 40MHz
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Number of I/O: 51
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Data Converters: A/D 12x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

パッケージ: -

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32-Bit

40MHz

CSIO, EBI/EMI, FIFO, I2C, UART/USART

DMA, LCD, LVD, POR, PWM, WDT

51

96KB (96K x 8)

FLASH

-

16K x 8

1.65V ~ 3.6V

A/D 12x12b

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

CY8C6244LQQ-S4D92

Infineon Technologies

IC MCU 32BIT 256KB FLASH 68QFN

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size: 32-Bit Dual-Core
Speed: 100MHz, 150MHz
Connectivity: CANbus, FIFO, I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Data Converters: A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Supplier Device Package: 68-QFN (8x8)

パッケージ: -

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32-Bit Dual-Core

100MHz, 150MHz

CANbus, FIFO, I2C, LINbus, QSPI, SPI, UART/USART, USB

Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT

52

256KB (256K x 8)

FLASH

-

128K x 8

1.7V ~ 3.6V

A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

68-VFQFN Exposed Pad

68-QFN (8x8)

TC3E7QX192F300SAAKXUMA1

Infineon Technologies

IC MCU 32BIT 12MB FLASH 292LFBGA

Core Processor: TriCore™
Core Size: 32-Bit Quad-Core
Speed: 300MHz
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, LVDS, PWM, WDT
Number of I/O: -
Program Memory Size: 12MB (12M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5M x 8
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Data Converters: A/D 100 SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Supplier Device Package: PG-LFBGA-292-11

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32-Bit Quad-Core

300MHz

ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT

DMA, I2S, LVDS, PWM, WDT

-

12MB (12M x 8)

FLASH

-

1.5M x 8

3.3V, 5V

A/D 100 SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

292-LFBGA

PG-LFBGA-292-11

CY9AF112NAPMC-G-MNE2

Infineon Technologies

IC MM MCU 100LQFP

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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-

XDPS2211XUMA1

Infineon Technologies

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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-

CYT2BL4CAAQ0AZEGST

Infineon Technologies

IC MCU 32BIT 4.063MB FLSH 80LQFP

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size: 32-Bit Dual-Core
Speed: 100MHz, 160MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O: 63
Program Memory Size: 4.063MB (4.063M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 52x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

パッケージ: -

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32-Bit Dual-Core

100MHz, 160MHz

CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART

Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

63

4.063MB (4.063M x 8)

FLASH

128K x 8

512K x 8

2.7V ~ 5.5V

A/D 52x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

80-LQFP

80-LQFP (12x12)

CY8C4147LQA-S243T

Infineon Technologies

IC MCU 32BIT 128KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

パッケージ: -

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32-Bit

24MHz

FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, WDT

34

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

CY95F636KNWQN-G-108-UNE1

Infineon Technologies

IC MCU 8BIT 36KB FLASH 32QFN

Core Processor: F²MC-8FX
Core Size: 8-Bit
Speed: 16.25MHz
Connectivity: I2C, LINbus, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 36KB (36K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Data Converters: A/D 8x8/10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-WFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

パッケージ: -

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8-Bit

16.25MHz

I2C, LINbus, SIO, UART/USART

LVD, POR, PWM, WDT

25

36KB (36K x 8)

FLASH

-

1K x 8

2.4V ~ 5.5V

A/D 8x8/10b

External

-40°C ~ 85°C (TA)

Surface Mount

32-WFQFN Exposed Pad

32-QFN (5x5)

TC399XX256F300SBDLXUMA2

Infineon Technologies

IC MCU 32BIT 16MB FLASH 516LFBGA

Core Processor: TriCore™
Core Size: 32-Bit 10-Core
Speed: 300MHz
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, LVDS, PWM, WDT
Number of I/O: -
Program Memory Size: 16MB (16M x 8)
Program Memory Type: FLASH
EEPROM Size: 1M x 8
RAM Size: 2.47M x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 516-LFBGA
Supplier Device Package: PG-LFBGA-516-10

パッケージ: -

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32-Bit 10-Core

300MHz

ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT

DMA, LVDS, PWM, WDT

-

16MB (16M x 8)

FLASH

1M x 8

2.47M x 8

2.97V ~ 5.5V

-

Internal

-40°C ~ 150°C (TA)

Surface Mount

516-LFBGA

PG-LFBGA-516-10

CY8C4127AZS-M485

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit
Speed: 24MHz
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Number of I/O: 51
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16, 20x10/12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-TQFP (10x10)

パッケージ: -

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32-Bit

24MHz

FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT

51

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16, 20x10/12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-TQFP (10x10)

S6J336CHABSC20000

Infineon Technologies

TRAVEO-40NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 94
Program Memory Size: 112KB (112K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-TEQFP (16x16)

パッケージ: -

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32-Bit

132MHz

CANbus, CSIO, I2C, LINbus, UART/USART

DMA, I2S, LVD, POR, PWM, WDT

94

112KB (112K x 8)

FLASH

-

128K x 8

2.7V ~ 5.5V

A/D 40x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

144-LQFP Exposed Pad

144-TEQFP (16x16)

S6J324CKSPSE20000

Infineon Technologies

TRAVEO-55NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 120
Program Memory Size: 2.0625MB (2.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2.25K x 8
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Data Converters: A/D 50x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Supplier Device Package: 208-TEQFP (28x28)

パッケージ: -

在庫1,080

32-Bit

240MHz

CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART

DMA, I2S, LCD, LVD, POR, PWM, WDT

120

2.0625MB (2.0625M x 8)

FLASH

-

2.25K x 8

1.15V ~ 5.5V

A/D 50x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

208-LQFP Exposed Pad

208-TEQFP (28x28)

CY8C4149LDAS593XQLA1

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O: 40
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: -

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32-Bit

48MHz

CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT

40

384KB (384K x 8)

FLASH

-

32K x 8

1.71V ~ 5.5V

A/D 16x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-QFN (7x7)

CY8C4147LQA-S293T

Infineon Technologies

IC MCU 32BIT 128KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

パッケージ: -

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32-Bit

24MHz

CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT

34

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

S6E2HG6E0AGV2000M

Infineon Technologies

MULTI-MARKET MCUS

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 63
Program Memory Size: 544KB (544K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A 2x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

パッケージ: -

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32-Bit

160MHz

CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART

DMA, LVD, POR, PWM, WDT

63

544KB (544K x 8)

FLASH

-

64K x 8

2.7V ~ 5.5V

A/D 16x12b SAR; D/A 2x12b

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

80-LQFP

80-LQFP (12x12)

S6J334CHFESE20000

Infineon Technologies

TRAVEO-40NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 116
Program Memory Size: 2.0625MB (2.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: 112K x 8
RAM Size: 544K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 35x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-TEQFP (20x20)

パッケージ: -

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32-Bit

240MHz

CANbus, CSIO, I2C, LINbus, UART/USART

DMA, I2S, LVD, POR, PWM, WDT

116

2.0625MB (2.0625M x 8)

FLASH

112K x 8

544K x 8

3V ~ 3.6V

A/D 35x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

144-LQFP Exposed Pad

144-TEQFP (20x20)

CY9AF314NBGL-GK9E1

Infineon Technologies

IC MCU 32BIT 256KB FLASH 112FBGA

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 40MHz
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 112-LFBGA
Supplier Device Package: 112-PFBGA (10x10)

パッケージ: -

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32-Bit

40MHz

CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB

DMA, LVD, POR, PWM, WDT

83

256KB (256K x 8)

FLASH

-

32K x 8

2.7V ~ 5.5V

A/D 16x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

112-LFBGA

112-PFBGA (10x10)

CY8C4149AZSS555XQLA1

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-TQFP (10x10)

パッケージ: -

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32-Bit

48MHz

I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT

54

384KB (384K x 8)

FLASH

-

32K x 8

1.71V ~ 5.5V

A/D 16x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-TQFP (10x10)

CY8C4147LQA-S263T

Infineon Technologies

IC MCU 32BIT 128KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

パッケージ: -

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32-Bit

24MHz

FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT

34

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

CYT3DLABABQ1AESGST

Infineon Technologies

IC MCU 32BT 4.063MB FLSH 216TQFP

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size: 32-Bit Dual-Core
Speed: 240MHz
Connectivity: DMA, I2S, LVD, Temp Sensor, WDT
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O: 108
Program Memory Size: 4.063MB (4.063M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: -
Oscillator Type: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 216-QFP
Supplier Device Package: 216-TQFP

パッケージ: -

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32-Bit Dual-Core

240MHz

DMA, I2S, LVD, Temp Sensor, WDT

108

4.063MB (4.063M x 8)

FLASH

128K x 8

384K x 8

2.7V ~ 5.5V

-

-40°C ~ 105°C (TA)

Surface Mount

216-QFP

216-TQFP

CY8C4147LQA-S253T

Infineon Technologies

IC MCU 32BIT 128KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

パッケージ: -

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32-Bit

24MHz

FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT

34

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

S6J342AFTBSV20000

Infineon Technologies

TRAVEO-40NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 116
Program Memory Size: 1.0625MB (1.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: 112K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.2V
Data Converters: A/D 35x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

パッケージ: -

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32-Bit

240MHz

CANbus, CSIO, I2C, LINbus, UART/USART

DMA, I2S, LVD, POR, PWM, WDT

116

1.0625MB (1.0625M x 8)

FLASH

112K x 8

128K x 8

3.5V ~ 5.2V

A/D 35x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP

100-LQFP (14x14)

CY8C4147LQA-S283T

Infineon Technologies

IC MCU 32BIT 128KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

パッケージ: -

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32-Bit

24MHz

CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT

34

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

CY8C4147LQA-S273T

Infineon Technologies

IC MCU 32BIT 128KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

パッケージ: -

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32-Bit

24MHz

FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT

34

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

C509LMDBFXUMA1

Infineon Technologies

C509 - LEGACY 8-BIT MICROCONTROL

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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-

S6J336AHABSE20000

Infineon Technologies

TRAVEO-40NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 94
Program Memory Size: 112KB (112K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 144-TEQFP (20x20)

パッケージ: -

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32-Bit

132MHz

CANbus, CSIO, I2C, LINbus, UART/USART

DMA, I2S, LVD, POR, PWM, WDT

94

112KB (112K x 8)

FLASH

-

128K x 8

2.7V ~ 5.5V

A/D 40x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

176-LQFP Exposed Pad

144-TEQFP (20x20)

CY9BF116TBGL-G-K5E1

Infineon Technologies

MULTI-MARKET MCUS

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 144MHz
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 154
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 192-LFBGA
Supplier Device Package: 192-FBGA (12x12)

パッケージ: -

在庫4,560

32-Bit

144MHz

CSIO, EBI/EMI, I2C, LINbus, UART/USART

DMA, LVD, POR, PWM, WDT

154

512KB (512K x 8)

FLASH

-

64K x 8

2.7V ~ 5.5V

A/D 24x12b SAR

Internal

-40°C ~ 85°C (TA)

Surface Mount

192-LFBGA

192-FBGA (12x12)

CY8C4147LDES593XQLA1

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O: 40
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

パッケージ: -

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32-Bit

48MHz

CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT

40

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-QFN (7x7)