ページ 193 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
EP1S25F672C8NGA	Intel	IC FPGA STRATIX 672FBGA Number of LABs/CLBs: 2566 Number of Logic Elements/Cells: 25660 Total RAM Bits: 1944576 Number of I/O: 473 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA	在庫2,592
EP20K200FC484-2N	Intel	IC FPGA 382 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 382 Number of Gates: 526000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA	在庫3,904
10M04DAF256A7G	Intel	256-PIN FBGA Number of LABs/CLBs: 250 Number of Logic Elements/Cells: 4000 Total RAM Bits: 193536 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-LBGA	在庫6,640
EP4SGX360NF45I4	Intel	IC FPGA 920 I/O 1932FBGA Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 Total RAM Bits: 23105536 Number of I/O: 920 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: 1932-BBGA, FCBGA	在庫3,856
EP3SL200F1152C4LN	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 200000 Total RAM Bits: 10901504 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫7,792
5SGXMA4K2F35C2N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫5,408
10AX066K3F35E2SG	Intel	IC FPGA 396 I/O 1152FCBGA Number of LABs/CLBs: 250540 Number of Logic Elements/Cells: 660000 Total RAM Bits: 49610752 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,464
EP3SE110F1152C4	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 4300 Number of Logic Elements/Cells: 107500 Total RAM Bits: 8936448 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫5,040
10AX048H2F34I2SG	Intel	1152-PIN FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 492 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,816
5AGXMA1D4F27C4N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 3537 Number of Logic Elements/Cells: 75000 Total RAM Bits: 8666112 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA, FCBGA	在庫4,464
EP4CE55F23I8L	Intel	IC FPGA 324 I/O 484FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 324 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BGA	在庫2,000
EP1C4F400I7N	Intel	IC FPGA 301 I/O 400FBGA Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 4000 Total RAM Bits: 78336 Number of I/O: 301 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	パッケージ: 400-BGA	在庫3,744
EPM7160SQC100-15	Intel	IC CPLD 160MC 15NS 100QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 10 Number of Macrocells: 160 Number of Gates: 3200 Number of I/O: 104 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	パッケージ: 100-BQFP	在庫4,000
EPM9480RC208-20	Intel	IC CPLD 480MC 20NS 208RQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 30 Number of Macrocells: 480 Number of Gates: 10000 Number of I/O: 146 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	パッケージ: 208-BFQFP Exposed Pad	在庫4,208
EPM7256EGI192-20	Intel	IC CPLD 256MC 20NS 192PGA Programmable Type: EE PLD Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 192-BPGA Supplier Device Package: 192-PGA (44.7x44.7)	パッケージ: 192-BPGA	在庫6,112
EPM7512BBC256-10	Intel	IC CPLD 512MC 10NS 256BGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 10000 Number of I/O: 212 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-BGA (27x27)	パッケージ: 256-LBGA	在庫4,176
EPM7128SQC100-6	Intel	IC CPLD 128MC 6NS 100QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	パッケージ: 100-BQFP	在庫6,896
EPM7128STC100-15	Intel	IC CPLD 128MC 15NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	パッケージ: 100-TQFP	在庫6,504
EPM3512AQC208-10	Intel	IC CPLD 512MC 10NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 10000 Number of I/O: 172 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	パッケージ: 208-BFQFP	在庫10,008
DCF0672WB4	Intel	IC DAISY CHAIN SAMPLE Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,560
EP3SL50F484C4LG	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA, FCBGA	在庫7,264
1SG040HH3F35E2LG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 378000 Total RAM Bits: 31457280 Number of I/O: 374 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
EP3SE260F1517I4LG	Intel	IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
AGFD019R24C3E3E	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	パッケージ: -	Request a Quote
1SG280LN3F43I1VP	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	パッケージ: -	Request a Quote
AGFA014R24C2E1VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	パッケージ: -	Request a Quote
AGIB022R31B2E2V	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXEA4K2F35I3LG	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote

EP1S25F672C8NGA

Intel

IC FPGA STRATIX 672FBGA

Number of LABs/CLBs: 2566
Number of Logic Elements/Cells: 25660
Total RAM Bits: 1944576
Number of I/O: 473
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA

在庫2,592

EP20K200FC484-2N

Intel

IC FPGA 382 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 382
Number of Gates: 526000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA

在庫3,904

10M04DAF256A7G

Intel

256-PIN FBGA

Number of LABs/CLBs: 250
Number of Logic Elements/Cells: 4000
Total RAM Bits: 193536
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-LBGA

在庫6,640

EP4SGX360NF45I4

Intel

IC FPGA 920 I/O 1932FBGA

Number of LABs/CLBs: 14144
Number of Logic Elements/Cells: 353600
Total RAM Bits: 23105536
Number of I/O: 920
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: 1932-BBGA, FCBGA

在庫3,856

EP3SL200F1152C4LN

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 200000
Total RAM Bits: 10901504
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫7,792

5SGXMA4K2F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫5,408

10AX066K3F35E2SG

Intel

IC FPGA 396 I/O 1152FCBGA

Number of LABs/CLBs: 250540
Number of Logic Elements/Cells: 660000
Total RAM Bits: 49610752
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,464

EP3SE110F1152C4

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 8936448
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫5,040

10AX048H2F34I2SG

Intel

1152-PIN FBGA

Number of LABs/CLBs: 183590
Number of Logic Elements/Cells: 480000
Total RAM Bits: 5664768
Number of I/O: 492
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,816

5AGXMA1D4F27C4N

Intel

IC FPGA 336 I/O 672FBGA

Number of LABs/CLBs: 3537
Number of Logic Elements/Cells: 75000
Total RAM Bits: 8666112
Number of I/O: 336
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA, FCBGA

在庫4,464

EP4CE55F23I8L

Intel

IC FPGA 324 I/O 484FBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 324
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BGA

在庫2,000

EP1C4F400I7N

Intel

IC FPGA 301 I/O 400FBGA

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 4000
Total RAM Bits: 78336
Number of I/O: 301
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

パッケージ: 400-BGA

在庫3,744

EPM7160SQC100-15

Intel

IC CPLD 160MC 15NS 100QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 10
Number of Macrocells: 160
Number of Gates: 3200
Number of I/O: 104
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

パッケージ: 100-BQFP

在庫4,000

EPM9480RC208-20

Intel

IC CPLD 480MC 20NS 208RQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 30
Number of Macrocells: 480
Number of Gates: 10000
Number of I/O: 146
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

パッケージ: 208-BFQFP Exposed Pad

在庫4,208

EPM7256EGI192-20

Intel

IC CPLD 256MC 20NS 192PGA

Programmable Type: EE PLD
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 192-BPGA
Supplier Device Package: 192-PGA (44.7x44.7)

パッケージ: 192-BPGA

在庫6,112

EPM7512BBC256-10

Intel

IC CPLD 512MC 10NS 256BGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 2.375 V ~ 2.625 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 10000
Number of I/O: 212
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-BGA (27x27)

パッケージ: 256-LBGA

在庫4,176

EPM7128SQC100-6

Intel

IC CPLD 128MC 6NS 100QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

パッケージ: 100-BQFP

在庫6,896

EPM7128STC100-15

Intel

IC CPLD 128MC 15NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

パッケージ: 100-TQFP

在庫6,504

EPM3512AQC208-10

Intel

IC CPLD 512MC 10NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 10000
Number of I/O: 172
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

パッケージ: 208-BFQFP

在庫10,008

DCF0672WB4

Intel

IC DAISY CHAIN SAMPLE

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,560

EP3SL50F484C4LG

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA, FCBGA

在庫7,264

1SG040HH3F35E2LG

Intel

IC FPGA STRATIX10GX 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 378000
Total RAM Bits: 31457280
Number of I/O: 374
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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EP3SE260F1517I4LG

Intel

IC FPGA 976 I/O 1517FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

AGFD019R24C3E3E

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

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1SG280LN3F43I1VP

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

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AGFA014R24C2E1VB

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

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AGIB022R31B2E2V

Intel

IC FPGA AGILEX-I 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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5SGXEA4K2F35I3LG

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

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