ページ 304 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
5ASXBB3D4F40C6N	Intel	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫3,776
1SX280LN2F43E2VGS1	Intel	1760-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	在庫7,872
10AS057K1F40E1HG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫6,944
10AS032H1F35E1HG	Intel	IC SOC FPGA 384 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫2,048
EP20K200CF672C7ES	Intel	IC FPGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: - Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA, FCBGA	在庫5,776
EP20K400FC672-3	Intel	IC FPGA 502 I/O 672FBGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 212992 Number of I/O: 502 Number of Gates: 1052000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA, FCBGA	在庫4,848
EP3SL110F780C3	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 4300 Number of Logic Elements/Cells: 107500 Total RAM Bits: 4992000 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫7,248
5AGXMA5G4F31I3N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.12 V ~ 1.18 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	パッケージ: 896-BBGA, FCBGA	在庫6,928
EP3SL50F484C4	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA, FCBGA	在庫4,304
EP1AGX35DF780C6N	Intel	IC FPGA 341 I/O 780FBGA Number of LABs/CLBs: 1676 Number of Logic Elements/Cells: 33520 Total RAM Bits: 1348416 Number of I/O: 341 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA	在庫6,720
5CEBA4F17C8N	Intel	IC FPGA 128 I/O 256FBGA Number of LABs/CLBs: 18480 Number of Logic Elements/Cells: 49000 Total RAM Bits: 3464192 Number of I/O: 128 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-LBGA	在庫8,232
EPM9320ARI208-10	Intel	IC CPLD 320MC 10NS 208RQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 20 Number of Macrocells: 320 Number of Gates: 6000 Number of I/O: 132 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	パッケージ: 208-BFQFP Exposed Pad	在庫5,712
5M160ZE64I5N	Intel	IC CPLD 128MC 7.5NS 64EQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 160 Number of Macrocells: 128 Number of Gates: - Number of I/O: 54 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-EQFP (7x7)	パッケージ: 64-TQFP Exposed Pad	在庫2,448
EP2AGX260FF35I3G	Intel	IC FPGA 612 I/O 1152FBGA Number of LABs/CLBs: 10260 Number of Logic Elements/Cells: 244188 Total RAM Bits: 12038144 Number of I/O: 612 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫2,224
5AGXMB1G4F31C4G	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	パッケージ: 896-BBGA, FCBGA	在庫6,608
AGFA008R24C2E1V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
EP4SGX180DF29C4G	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGSED8K2F40I3LNCV	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
P82C08-10	Intel	DRAM CONTROLLER, 1M X 8 PDIP48 Controller Type: Dynamic RAM (DRAM) Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 48-DIP Supplier Device Package: 48-DIP	パッケージ: -	Request a Quote
EPM1270T144C3RR	Intel	IC CPLD 980MC 6.2NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.2 ns Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 1270 Number of Macrocells: 980 Number of Gates: - Number of I/O: 116 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: -	Request a Quote
1SX085HN2F43I2LGAS	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 850K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	パッケージ: -	Request a Quote
1SG280HU1F50I2VGAS	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	パッケージ: -	Request a Quote
1SX280LU2F50I2VGAS	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	パッケージ: -	Request a Quote
5SGSMD3E2H29I2G	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: -	Request a Quote
AGIB023R18A2I1VB	Intel	IC FPGA AGILEX-I 1805BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1805-BBGA Exposed Pad Supplier Device Package: 1805-BGA (42.5x42.5)	パッケージ: -	Request a Quote
5SGSMD3E3H29I4G	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: -	Request a Quote
5962-9056401UA	Intel	8-BIT MCU, OTPROM, 8051 CPU Core Processor: 80C51 Core Size: 8-Bit Speed: 12MHz Connectivity: Serial Port Peripherals: POR, WDT Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: EPROM EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4V ~ 6V Data Converters: - Oscillator Type: External, Internal Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Surface Mount Package / Case: 44-CLCC Supplier Device Package: 44-CLCC	パッケージ: -	Request a Quote
5SGXEA7K3F40I3LG	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote

5ASXBB3D4F40C6N

Intel

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫3,776

1SX280LN2F43E2VGS1

Intel

1760-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫7,872

10AS057K1F40E1HG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫6,944

10AS032H1F35E1HG

Intel

IC SOC FPGA 384 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫2,048

EP20K200CF672C7ES

Intel

IC FPGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: -
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA, FCBGA

在庫5,776

EP20K400FC672-3

Intel

IC FPGA 502 I/O 672FBGA

Number of LABs/CLBs: 1664
Number of Logic Elements/Cells: 16640
Total RAM Bits: 212992
Number of I/O: 502
Number of Gates: 1052000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA, FCBGA

在庫4,848

EP3SL110F780C3

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 4992000
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫7,248

5AGXMA5G4F31I3N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 8962
Number of Logic Elements/Cells: 190000
Total RAM Bits: 13284352
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.12 V ~ 1.18 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

パッケージ: 896-BBGA, FCBGA

在庫6,928

EP3SL50F484C4

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA, FCBGA

在庫4,304

EP1AGX35DF780C6N

Intel

IC FPGA 341 I/O 780FBGA

Number of LABs/CLBs: 1676
Number of Logic Elements/Cells: 33520
Total RAM Bits: 1348416
Number of I/O: 341
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA

在庫6,720

5CEBA4F17C8N

Intel

IC FPGA 128 I/O 256FBGA

Number of LABs/CLBs: 18480
Number of Logic Elements/Cells: 49000
Total RAM Bits: 3464192
Number of I/O: 128
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-LBGA

在庫8,232

EPM9320ARI208-10

Intel

IC CPLD 320MC 10NS 208RQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 20
Number of Macrocells: 320
Number of Gates: 6000
Number of I/O: 132
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

パッケージ: 208-BFQFP Exposed Pad

在庫5,712

5M160ZE64I5N

Intel

IC CPLD 128MC 7.5NS 64EQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 160
Number of Macrocells: 128
Number of Gates: -
Number of I/O: 54
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-EQFP (7x7)

パッケージ: 64-TQFP Exposed Pad

在庫2,448

EP2AGX260FF35I3G

Intel

IC FPGA 612 I/O 1152FBGA

Number of LABs/CLBs: 10260
Number of Logic Elements/Cells: 244188
Total RAM Bits: 12038144
Number of I/O: 612
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫2,224

5AGXMB1G4F31C4G

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

パッケージ: 896-BBGA, FCBGA

在庫6,608

AGFA008R24C2E1V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 764K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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EP4SGX180DF29C4G

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

Request a Quote

5SGSED8K2F40I3LNCV

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: -

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P82C08-10

Intel

DRAM CONTROLLER, 1M X 8 PDIP48

Controller Type: Dynamic RAM (DRAM)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 48-DIP
Supplier Device Package: 48-DIP

パッケージ: -

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EPM1270T144C3RR

Intel

IC CPLD 980MC 6.2NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.2 ns
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Number of Macrocells: 980
Number of Gates: -
Number of I/O: 116
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: -

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1SX085HN2F43I2LGAS

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 850K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

パッケージ: -

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1SG280HU1F50I2VGAS

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

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1SX280LU2F50I2VGAS

Intel

IC FPGA STRATIX 10 2397FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

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5SGSMD3E2H29I2G

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

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AGIB023R18A2I1VB

Intel

IC FPGA AGILEX-I 1805BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1805-BBGA Exposed Pad
Supplier Device Package: 1805-BGA (42.5x42.5)

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5SGSMD3E3H29I4G

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

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5962-9056401UA

Intel

8-BIT MCU, OTPROM, 8051 CPU

Core Processor: 80C51
Core Size: 8-Bit
Speed: 12MHz
Connectivity: Serial Port
Peripherals: POR, WDT
Number of I/O: 32
Program Memory Size: 16KB (16K x 8)
Program Memory Type: EPROM
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4V ~ 6V
Data Converters: -
Oscillator Type: External, Internal
Operating Temperature: -55°C ~ 125°C (TC)
Mounting Type: Surface Mount
Package / Case: 44-CLCC
Supplier Device Package: 44-CLCC

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5SGXEA7K3F40I3LG

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

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