ページ 338 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
10AS066H2F34I2LG	Intel	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫5,504
EP20K160EQC240-2X	Intel	IC FPGA 175 I/O 240QFP Number of LABs/CLBs: 640 Number of Logic Elements/Cells: 6400 Total RAM Bits: 81920 Number of I/O: 175 Number of Gates: 404000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	パッケージ: 240-BQFP	在庫2,448
EP4SGX360KF43I3	Intel	IC FPGA 880 I/O 1760FBGA Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 Total RAM Bits: 23105536 Number of I/O: 880 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	パッケージ: 1760-BBGA, FCBGA	在庫4,880
EP4SGX110DF29C4	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫6,608
5AGXFB3H4F40C5G	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 17110 Number of Logic Elements/Cells: 362000 Total RAM Bits: 19822592 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA	在庫3,264
EPM7160EQC100-12YY	Intel	IC CPLD 160MC 12NS 100QFP Programmable Type: EE PLD Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 10 Number of Macrocells: 160 Number of Gates: 3200 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	パッケージ: 100-BQFP	在庫3,216
AGFC023R24C2I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	パッケージ: -	Request a Quote
5SGSMD6N3F45C3G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: -	Request a Quote
5SGXMA5K1F35C2LG	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
1SX210HN3F43I2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2100K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	パッケージ: -	Request a Quote
5SGSMD8K3F40C3NCV	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
MR8751H8	Intel	8-BIT, UVPROM, 8051 CPU, 8MHZ Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
AGFC019R25A2I3E	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXEABN3F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: -	Request a Quote
GT28F008B3T120	Intel	IC FLASH 8MBIT PARALLEL 48UBGA Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - Boot Block Memory Size: 8Mbit Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: 165ns Access Time: 120 ns Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFBGA Supplier Device Package: 48-uBGA (7.7x9)	パッケージ: -	Request a Quote
5SGXMA9K3H40C2G	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	パッケージ: -	Request a Quote
5SGXMA3K1F35C1WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
5SGXMA4H2F35I3WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
1SX085HN3F43I1VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 850K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	パッケージ: -	Request a Quote
1SG210HU2F50I2VG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 262500 Number of Logic Elements/Cells: 2100000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	パッケージ: -	Request a Quote
5SGSED8K1F40I2G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote
5ASXFB3G4F35I3G	Intel	IC SOC CORTEX-A9 1.05GHZ 1152BGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.05GHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35x35)	パッケージ: -	Request a Quote
5SGXMB9R1H43C2G	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	パッケージ: -	Request a Quote
RH80554RC021512	Intel	INTEL CELERON MOBILE PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
5SGXMA4K1F35C2WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
1SG280HH3F55I1VG	Intel	IC FPGA 1160 I/O 2912BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 1160 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	パッケージ: -	Request a Quote
1SG065HH3F35E1VG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 612000 Total RAM Bits: 51380224 Number of I/O: 392 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: -	Request a Quote
5SGXMA3K1F40C2G	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: -	Request a Quote

10AS066H2F34I2LG

Intel

IC SOC FPGA 492 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫5,504

EP20K160EQC240-2X

Intel

IC FPGA 175 I/O 240QFP

Number of LABs/CLBs: 640
Number of Logic Elements/Cells: 6400
Total RAM Bits: 81920
Number of I/O: 175
Number of Gates: 404000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

パッケージ: 240-BQFP

在庫2,448

EP4SGX360KF43I3

Intel

IC FPGA 880 I/O 1760FBGA

Number of LABs/CLBs: 14144
Number of Logic Elements/Cells: 353600
Total RAM Bits: 23105536
Number of I/O: 880
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

パッケージ: 1760-BBGA, FCBGA

在庫4,880

EP4SGX110DF29C4

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 4224
Number of Logic Elements/Cells: 105600
Total RAM Bits: 9793536
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫6,608

5AGXFB3H4F40C5G

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 17110
Number of Logic Elements/Cells: 362000
Total RAM Bits: 19822592
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA

在庫3,264

EPM7160EQC100-12YY

Intel

IC CPLD 160MC 12NS 100QFP

Programmable Type: EE PLD
Delay Time tpd(1) Max: 12.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 10
Number of Macrocells: 160
Number of Gates: 3200
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

パッケージ: 100-BQFP

在庫3,216

AGFC023R24C2I2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

パッケージ: -

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5SGSMD6N3F45C3G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: -

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5SGXMA5K1F35C2LG

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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1SX210HN3F43I2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2100K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

パッケージ: -

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5SGSMD8K3F40C3NCV

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: -

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MR8751H8

Intel

8-BIT, UVPROM, 8051 CPU, 8MHZ

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

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AGFC019R25A2I3E

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

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5SGXEABN3F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: -

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GT28F008B3T120

Intel

IC FLASH 8MBIT PARALLEL 48UBGA

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - Boot Block
Memory Size: 8Mbit
Memory Interface: Parallel
Clock Frequency: -
Write Cycle Time - Word, Page: 165ns
Access Time: 120 ns
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFBGA
Supplier Device Package: 48-uBGA (7.7x9)

パッケージ: -

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5SGXMA9K3H40C2G

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

パッケージ: -

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5SGXMA3K1F35C1WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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5SGXMA4H2F35I3WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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1SX085HN3F43I1VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 850K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

パッケージ: -

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1SG210HU2F50I2VG

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 262500
Number of Logic Elements/Cells: 2100000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

パッケージ: -

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5SGSED8K1F40I2G

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: -

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5ASXFB3G4F35I3G

Intel

IC SOC CORTEX-A9 1.05GHZ 1152BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.05GHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA, FC (35x35)

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5SGXMB9R1H43C2G

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

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RH80554RC021512

Intel

INTEL CELERON MOBILE PROCESSOR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

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5SGXMA4K1F35C2WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

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1SG280HH3F55I1VG

Intel

IC FPGA 1160 I/O 2912BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 1160
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

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1SG065HH3F35E1VG

Intel

IC FPGA STRATIX10GX 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 612000
Total RAM Bits: 51380224
Number of I/O: 392
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: -

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5SGXMA3K1F40C2G

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: -

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