ページ 8 - Intel 製品 | Heisener Electronics

部品番号	メーカ	説明	パッケージ	在庫
GCIXP1250BB	Intel	IC MPU STRONGARM 200MHZ 520BGA Core Processor: StrongARM Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Data; Microengine RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 520-LFBGA Supplier Device Package: 520-HL-PBGA (40x40)	パッケージ: 520-LFBGA	在庫4,512
10AS032H3F34E2LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,544
5SGTMC7K3F40C2	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	在庫2,944
EP20K160EFC144-3	Intel	IC FPGA Number of LABs/CLBs: 640 Number of Logic Elements/Cells: 6400 Total RAM Bits: 81920 Number of I/O: 88 Number of Gates: 404000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: 144-LQFP	在庫4,160
EPF6016ATI100-2N	Intel	IC FPGA 81 I/O 100TQFP Number of LABs/CLBs: 132 Number of Logic Elements/Cells: 1320 Total RAM Bits: - Number of I/O: 81 Number of Gates: 16000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	パッケージ: 100-TQFP	在庫5,216
EP20K400BC652-2	Intel	IC FPGA 502 I/O 652BGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 212992 Number of I/O: 502 Number of Gates: 1052000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 652-BGA Supplier Device Package: 652-BGA (45x45)	パッケージ: 652-BGA	在庫2,240
EP20K160ETC144-1	Intel	IC FPGA 88 I/O 144TQFP Number of LABs/CLBs: 640 Number of Logic Elements/Cells: 6400 Total RAM Bits: 81920 Number of I/O: 88 Number of Gates: 404000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	パッケージ: 144-LQFP	在庫4,960
EP3SE260F1152C3N	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫7,536
5SGXEA7N1F45C2LN	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	パッケージ: 1932-BBGA, FCBGA	在庫3,328
10AX115N2F40I2SG	Intel	IC FPGA 600 I/O 1517FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫3,264
EP2SGX90EF1152I4	Intel	IC FPGA 558 I/O 1152FBGA Number of LABs/CLBs: 4548 Number of Logic Elements/Cells: 90960 Total RAM Bits: 4520448 Number of I/O: 558 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	パッケージ: 1152-BBGA, FCBGA	在庫4,512
5SGXMA3E3H29I3L	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	パッケージ: 780-BBGA, FCBGA	在庫5,552
5SGXEB6R2F40I3LN	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	パッケージ: 1517-BBGA, FCBGA	在庫3,552
10AX048E2F29I1HG	Intel	IC FPGA 360 I/O 780FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫5,952
10AX048E2F29E2LG	Intel	780-PIN FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	パッケージ: 780-BBGA, FCBGA	在庫5,248
10AX032E3F27E2LG	Intel	672-PIN FBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	パッケージ: 672-BBGA, FCBGA	在庫4,688
EP3CLS100F484C8N	Intel	IC FPGA 278 I/O 484FBGA Number of LABs/CLBs: 6278 Number of Logic Elements/Cells: 100448 Total RAM Bits: 4451328 Number of I/O: 278 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BGA	在庫3,904
EP2AGX45CU17C5N	Intel	IC FPGA 156 I/O 358UBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 156 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FC (17x17)	パッケージ: 358-LFBGA, FCBGA	在庫5,232
EP4CE115F23C8	Intel	IC FPGA 280 I/O 484FBGA Number of LABs/CLBs: 7155 Number of Logic Elements/Cells: 114480 Total RAM Bits: 3981312 Number of I/O: 280 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BGA	在庫4,448
5CEFA5F23C6N	Intel	IC FPGA 240 I/O 484FBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BGA	在庫9,444
10M16DAF256C8G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 16000 Total RAM Bits: 562176 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	パッケージ: 256-LBGA	在庫10,044
EP3SE50F484I3G	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 5760000 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86V ~ 1.15V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	パッケージ: 484-BBGA, FCBGA	在庫6,400
1SX280HH3F55E2VGS3	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	パッケージ: -	Request a Quote
EP3SE260H780I4LG	Intel	IC FPGA 488 I/O 780HBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
AGFB022R24C3E3E	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
N87C541	Intel	8-BIT, OTPROM, 8051 CPU Core Processor: 87C54 Core Size: 8-Bit Speed: 16MHz Connectivity: - Peripherals: - Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: EPROM EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4V ~ 6V Data Converters: - Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC	パッケージ: -	Request a Quote
AGFB008R16A3E3E	Intel	IC FPGA AGILEX-F 1546FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	パッケージ: -	Request a Quote
1SX280HN2F43I2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	パッケージ: -	Request a Quote

GCIXP1250BB

Intel

IC MPU STRONGARM 200MHZ 520BGA

Core Processor: StrongARM
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: Data; Microengine
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 520-LFBGA
Supplier Device Package: 520-HL-PBGA (40x40)

パッケージ: 520-LFBGA

在庫4,512

10AS032H3F34E2LG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,544

5SGTMC7K3F40C2

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

パッケージ: -

在庫2,944

EP20K160EFC144-3

Intel

IC FPGA

Number of LABs/CLBs: 640
Number of Logic Elements/Cells: 6400
Total RAM Bits: 81920
Number of I/O: 88
Number of Gates: 404000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

在庫4,160

EPF6016ATI100-2N

Intel

IC FPGA 81 I/O 100TQFP

Number of LABs/CLBs: 132
Number of Logic Elements/Cells: 1320
Total RAM Bits: -
Number of I/O: 81
Number of Gates: 16000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

パッケージ: 100-TQFP

在庫5,216

EP20K400BC652-2

Intel

IC FPGA 502 I/O 652BGA

Number of LABs/CLBs: 1664
Number of Logic Elements/Cells: 16640
Total RAM Bits: 212992
Number of I/O: 502
Number of Gates: 1052000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 652-BGA
Supplier Device Package: 652-BGA (45x45)

パッケージ: 652-BGA

在庫2,240

EP20K160ETC144-1

Intel

IC FPGA 88 I/O 144TQFP

Number of LABs/CLBs: 640
Number of Logic Elements/Cells: 6400
Total RAM Bits: 81920
Number of I/O: 88
Number of Gates: 404000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

パッケージ: 144-LQFP

在庫4,960

EP3SE260F1152C3N

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: 10200
Number of Logic Elements/Cells: 255000
Total RAM Bits: 16672768
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫7,536

5SGXEA7N1F45C2LN

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

パッケージ: 1932-BBGA, FCBGA

在庫3,328

10AX115N2F40I2SG

Intel

IC FPGA 600 I/O 1517FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫3,264

EP2SGX90EF1152I4

Intel

IC FPGA 558 I/O 1152FBGA

Number of LABs/CLBs: 4548
Number of Logic Elements/Cells: 90960
Total RAM Bits: 4520448
Number of I/O: 558
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

パッケージ: 1152-BBGA, FCBGA

在庫4,512

5SGXMA3E3H29I3L

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 23704576
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

パッケージ: 780-BBGA, FCBGA

在庫5,552

5SGXEB6R2F40I3LN

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

パッケージ: 1517-BBGA, FCBGA

在庫3,552

10AX048E2F29I1HG

Intel

IC FPGA 360 I/O 780FBGA

Number of LABs/CLBs: 183590
Number of Logic Elements/Cells: 480000
Total RAM Bits: 5664768
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫5,952

10AX048E2F29E2LG

Intel

780-PIN FBGA

Number of LABs/CLBs: 183590
Number of Logic Elements/Cells: 480000
Total RAM Bits: 5664768
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

パッケージ: 780-BBGA, FCBGA

在庫5,248

10AX032E3F27E2LG

Intel

672-PIN FBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

パッケージ: 672-BBGA, FCBGA

在庫4,688

EP3CLS100F484C8N

Intel

IC FPGA 278 I/O 484FBGA

Number of LABs/CLBs: 6278
Number of Logic Elements/Cells: 100448
Total RAM Bits: 4451328
Number of I/O: 278
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BGA

在庫3,904

EP2AGX45CU17C5N

Intel

IC FPGA 156 I/O 358UBGA

Number of LABs/CLBs: 1805
Number of Logic Elements/Cells: 42959
Total RAM Bits: 3517440
Number of I/O: 156
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 358-LFBGA, FCBGA
Supplier Device Package: 358-UBGA, FC (17x17)

パッケージ: 358-LFBGA, FCBGA

在庫5,232

EP4CE115F23C8

Intel

IC FPGA 280 I/O 484FBGA

Number of LABs/CLBs: 7155
Number of Logic Elements/Cells: 114480
Total RAM Bits: 3981312
Number of I/O: 280
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BGA

在庫4,448

5CEFA5F23C6N

Intel

IC FPGA 240 I/O 484FBGA

Number of LABs/CLBs: 29080
Number of Logic Elements/Cells: 77000
Total RAM Bits: 5001216
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BGA

在庫9,444

10M16DAF256C8G

Intel

IC FPGA 178 I/O 256FBGA

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 16000
Total RAM Bits: 562176
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

パッケージ: 256-LBGA

在庫10,044

EP3SE50F484I3G

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 5760000
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

パッケージ: 484-BBGA, FCBGA

在庫6,400

1SX280HH3F55E2VGS3

Intel

IC FPGA STRATIX 10 2912FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

パッケージ: -

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EP3SE260H780I4LG

Intel

IC FPGA 488 I/O 780HBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

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AGFB022R24C3E3E

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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N87C541

Intel

8-BIT, OTPROM, 8051 CPU

Core Processor: 87C54
Core Size: 8-Bit
Speed: 16MHz
Connectivity: -
Peripherals: -
Number of I/O: 32
Program Memory Size: 16KB (16K x 8)
Program Memory Type: EPROM
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4V ~ 6V
Data Converters: -
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC

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AGFB008R16A3E3E

Intel

IC FPGA AGILEX-F 1546FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 764K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

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1SX280HN2F43I2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

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