NXP 製品 - PMIC -電源管理 - 特殊 | Heisener Electronics
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NXP 製品 - PMIC -電源管理 - 特殊

レコード 1,370
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説明
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在庫
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Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC33FS6517NAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
パッケージ: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC34VR500VBES
NXP

REGULATOR, BUCK, QUAD WITH UP TO

  • Applications: Processor
  • Current - Supply: 297µA
  • Voltage - Supply: 2.8V ~ 4.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
パッケージ: -
Request a Quote
297µA
2.8V ~ 4.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500VAES
NXP

REGULATOR BUCK QUAD WITH UP TO 4

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 15mA
  • Voltage - Supply: 2.8V ~ 4.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
パッケージ: -
Request a Quote
15mA
2.8V ~ 4.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC33FS6518CAER2
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
パッケージ: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC34VR500V9ES
NXP

REGULATOR BUCK QUAD WITH UP TO 4

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 15mA
  • Voltage - Supply: 2.8V ~ 4.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
パッケージ: -
Request a Quote
15mA
2.8V ~ 4.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MFS2622AMBA0ADR2
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
パッケージ: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MFS2621AMDABADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
パッケージ: -
Request a Quote
-
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33FS6517CAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
パッケージ: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33PF8100F3ES
NXP

POWER MANAGEMENT IC, I.MX8, PRE-

  • Applications: Processor
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
パッケージ: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8510A0ESR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
パッケージ: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS8610BMBA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
パッケージ: -
Request a Quote
-
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MC33PF8200D2ESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
パッケージ: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MPF5024CVNA0ES
NXP

POWER MANAGEMENT IC, PRE-PROG, 4

  • Applications: High Performance i.MX 8 Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
パッケージ: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MWCT1012VLFR
NXP

32BIT 64K FLASH 2KB FLEX

  • Applications: Wireless Power Transmitter
  • Current - Supply: 1.7mA
  • Voltage - Supply: 3V ~ 3.6V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
パッケージ: -
Request a Quote
1.7mA
3V ~ 3.6V
-40°C ~ 105°C (TA)
Surface Mount
48-LQFP
48-LQFP (7x7)
MFS5600AMEA0ESR2
NXP

DUAL 36V AUTOMOTIVE DC-DC CONTRO

  • Applications: -
  • Current - Supply: 140µA
  • Voltage - Supply: 2.7V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
パッケージ: -
Request a Quote
140µA
2.7V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
32-VFQFN Exposed Pad
32-HVQFN (5x5)
MVR5510AMBANESR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
パッケージ: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6528NAER2
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
パッケージ: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33PF8100CFESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
パッケージ: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
PCA9421BSZ
NXP

IC PMIC HVQFN24

  • Applications: Microcontroller, MCU
  • Current - Supply: 5.5µA
  • Voltage - Supply: 3.3V ~ 5.5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (3x3)
パッケージ: -
在庫4,200
5.5µA
3.3V ~ 5.5V
-40°C ~ 85°C (TA)
Surface Mount
24-VFQFN Exposed Pad
24-HVQFN (3x3)
MFS2323BMBA5EPR2
NXP

IC

  • Applications: System Basis Chip
  • Current - Supply: 30µA
  • Voltage - Supply: 5.5V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
パッケージ: -
Request a Quote
30µA
5.5V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MFS8621BMBA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
パッケージ: -
Request a Quote
-
4.5V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MFS2630AMBA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
パッケージ: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MFS2633AMDA0AD
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: System Basis Chip
  • Current - Supply: 29µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
パッケージ: -
Request a Quote
29µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC34PF4210A2ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8V ~ 4.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
パッケージ: -
Request a Quote
-
2.8V ~ 4.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MPF5200AMBA3ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-PowerWFQFN
  • Supplier Device Package: 32-HWQFN (5x5)
パッケージ: -
Request a Quote
-
-
-
Surface Mount, Wettable Flank
32-PowerWFQFN
32-HWQFN (5x5)
MFS2320BMBB1EPR2
NXP

IC

  • Applications: System Basis Chip
  • Current - Supply: 30µA
  • Voltage - Supply: 5.5V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
パッケージ: -
Request a Quote
30µA
5.5V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MPF5024CVNA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 4

  • Applications: High Performance i.MX 8 Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
パッケージ: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MFS8631BMDA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
パッケージ: -
Request a Quote
-
4.5V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)